Intel Arc 140V Mobile vs Intel Arc Pro B60 Dual Comparison

Intel
GPU

Intel Arc 140V Mobile

CORE STATE Lunar Lake
VRAM System Shared
CLOCK SPEED 1950 MHz
TDP 37 W
BUS WIDTH System Shared
ARCHITECTURE Xe2-LPG
nm
PROCESS 3 nm
LAUNCH DATE 2024
VS
Intel
GPU

Arc Pro B60 Dual

CORE STATE BMG-G21
VRAM 24 GB
CLOCK SPEED 2400 MHz
TDP 400 W
BUS WIDTH 192 bit
ARCHITECTURE Xe2-HPG
nm
PROCESS 5 nm
LAUNCH DATE 2025

Analysis: Intel Arc 140V Mobile vs Intel Arc Pro B60 Dual

Head-to-Head Benchmarks

The recorded data shows no direct head-to-head benchmark scores between the Intel Arc 140V Mobile and the Intel Arc Pro B60 Dual. Both entries list an empty benchmarks array, and the head-to-head comparison table contains no entries. The wins counter for each side is set to zero, indicating that no measured application or synthetic test results exist in the database for a direct comparison.

What can be compared are the raw computational throughput figures recorded in the specifications. The Arc Pro B60 Dual delivers 12.29 TFLOPS of FP32 compute, which is 3.08 times the 3.994 TFLOPS of the Arc 140V Mobile. In FP16 with a 2:1 ratio, the Pro B60 Dual reaches 24.58 TFLOPS against 7.987 TFLOPS for the mobile part, a gap of roughly 3.08 times as well. Pixel throughput favors the Pro B60 Dual at 192.0 GPixel/s versus 62.40 GPixel/s, a 3.08 times advantage. Texture rate follows the same pattern: 384.0 GTexel/s against 124.8 GTexel/s.

The memory subsystem shows a wider gap. The Arc Pro B60 Dual uses 24 GB of GDDR6 on a 192 bit bus, delivering 456.0 GB/s of bandwidth. The Arc 140V Mobile relies on System Shared memory, with bandwidth listed as System Dependent. This means the mobile part's memory performance is tied to the host platform's memory configuration, which can vary, while the discrete card has a fixed, dedicated pool.

The percentile ranking in the database is identical for both: 50th percentile against all GPUs. The average benchmark score for both entries is zero, which is consistent with the absence of recorded benchmarks. The lack of measured data means the head-to-head section must rely on the specification deltas above rather than observed performance deltas.

Architecture Differences

The two GPUs come from different families within Intel's Xe2 architecture. The Arc 140V Mobile uses the Xe2-LPG architecture, built on the Lunar Lake chip, and belongs to the Arc Graphics-M (Lunar Lake) generation. The Arc Pro B60 Dual uses the Xe2-HPG architecture, built on the BMG-G21 chip, and belongs to the Battlemage (Pro Series) generation.

The process nodes differ. The Arc 140V Mobile is fabricated on a 3 nm process at TSMC. The Arc Pro B60 Dual uses a 5 nm process at TSMC. The die sizes also differ substantially: the mobile part measures 172 mm², while the Pro B60 Dual measures 272 mm². The transistor count for the Arc 140V Mobile is listed as unknown, while the Pro B60 Dual has 19,600 million transistors, yielding a transistor density of 72.1M per mm².

Compute resources scale with the larger die. The Arc Pro B60 Dual has 2560 shading units, 160 texture mapping units, 80 raster output units, and 20 ray tracing cores. The Arc 140V Mobile has 1024 shading units, 64 TMUs, 32 ROPs, and 8 ray tracing cores. The Pro B60 Dual has 2.5 times the shading units, 2.5 times the TMUs, 2.5 times the ROPs, and 2.5 times the ray tracing cores.

Clock speeds are higher on the discrete card. The Arc Pro B60 Dual has a base clock of 2000 MHz and a boost clock of 2400 MHz. The Arc 140V Mobile has a base clock of 300 MHz and a boost clock of 1950 MHz. Memory clocks differ as well: the Pro B60 Dual runs at 2375 MHz with 19 Gbps effective, while the mobile part uses System Shared memory with no fixed clock.

Power and physical configuration diverge sharply. The Arc Pro B60 Dual has a TDP of 400 W, uses a Dual-slot cooler, requires a 1x 16-pin power connector, and suggests an 800 W power supply. The Arc 140V Mobile has a TDP of 37 W, is an integrated graphics processor (IGP) with no power connectors, and has no suggested PSU. The bus interface for the discrete card is PCIe 5.0 x8, while the mobile part uses IGP. Physical dimensions for the Pro B60 Dual are 300 mm in length, 110 mm in height, and 40 mm in width. The mobile part has no recorded dimensions.

The Pro B60 Dual offers 4x mini-DisplayPort 2.1 outputs. The Arc 140V Mobile's display outputs are listed as Portable Device Dependent, reflecting its integrated nature. Both support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The release dates differ by about a year: the Arc 140V Mobile launched on 2024-09-23, and the Arc Pro B60 Dual launched on 2025-09-04. Both are marked as Active in production status. The Arc 140V Mobile lists HD Graphics-M as its predecessor, while the Pro B60 Dual has no predecessor recorded. The launch MSRP for the Pro B60 Dual is 1,199 USD; the mobile part has no MSRP recorded.

Where Each One Wins

The Arc Pro B60 Dual wins on every recorded raw performance metric. Its FP32 throughput of 12.29 TFLOPS is roughly three times the mobile part's 3.994 TFLOPS. Its FP16 throughput of 24.58 TFLOPS is likewise about three times the 7.987 TFLOPS of the Arc 140V Mobile. Pixel fill rate, texture fill rate, shading units, TMUs, ROPs, and ray tracing cores all favor the discrete card by the same 2.5 to 3.08 times factor. The 24 GB GDDR6 memory with 456.0 GB/s bandwidth is a decisive advantage for workloads that require large datasets or high bandwidth, since the mobile part depends on System Shared memory with System Dependent bandwidth.

The Arc 140V Mobile wins on power efficiency and integration. Its 37 W TDP is dramatically lower than the 400 W TDP of the Pro B60 Dual. It requires no additional power connectors, no external power supply rating, and occupies an IGP slot rather than a Dual-slot cooler. It is built on a smaller 3 nm process, which contributes to its lower power draw. For systems where physical space and power delivery are constrained, the mobile part is the only feasible option, since the discrete card requires a 300 mm length, 110 mm height, 40 mm width, an 800 W PSU, and PCIe 5.0 x8 connectivity.

The 3 nm process node gives the Arc 140V Mobile a manufacturing advantage in density and efficiency, though the Pro B60 Dual counters with a larger die and 19,600 million transistors. The Pro B60 Dual's 272 mm² die allows for the higher compute and memory resources, but it also drives the 400 W TDP and the need for active cooling.

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The Intel Arc Pro B60 Dual delivers 12.29 TFLOPS of FP32, while the Intel Arc 140V Mobile delivers 3.994 TFLOPS. The discrete card is roughly three times faster in this metric.

Q: How much memory does each GPU have?

A: The Arc Pro B60 Dual has 24 GB of GDDR6 memory on a 192 bit bus with 456.0 GB/s bandwidth. The Arc 140V Mobile uses System Shared memory, with bandwidth listed as System Dependent.

Q: What are the TDP requirements for each?

A: The Arc Pro B60 Dual has a TDP of 400 W and suggests an 800 W power supply. The Arc 140V Mobile has a TDP of 37 W and lists no suggested PSU.

Q: Do both GPUs support the same APIs?

A: Yes. Both support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4.

Q: What process nodes are used?

A: The Arc 140V Mobile uses a 3 nm process at TSMC. The Arc Pro B60 Dual uses a 5 nm process at TSMC.

Q: What is the release date for each?

A: The Arc 140V Mobile was released on 2024-09-23. The Arc Pro B60 Dual was released on 2025-09-04.

The Verdict

The data positions the Intel Arc Pro B60 Dual as the higher-performance part across every recorded compute and memory metric. It has 2.5 times the shading units, 2.5 times the ray tracing cores, 3.08 times the FP32 throughput, and a memory system with 24 GB of GDDR6 and 456.0 GB/s of bandwidth versus the System Shared memory of the mobile part. Its 400 W TDP, Dual-slot cooler, 1x 16-pin power connector, and 800 W suggested PSU make it appropriate for desktop workstations with sufficient power delivery and physical space. Its 300 mm length, 110 mm height, and 40 mm width define those space requirements.

The Intel Arc 140V Mobile is the integrated solution for portable systems. Its 37 W TDP, lack of power connectors, and IGP bus interface make it suitable for mobile devices where the Pro B60 Dual cannot physically or electrically operate. Its 3 nm process node and 172 mm² die provide a compact footprint, though its 1024 shading units and 3.994 TFLOPS FP32 are substantially below the discrete card. It has no recorded MSRP, while the Pro B60 Dual carries a launch MSRP of 1,199 USD.

The selection depends entirely on the use case. Systems requiring maximum recorded throughput, large dedicated memory, and professional display outputs should use the Arc Pro B60 Dual. Systems constrained to integrated graphics with minimal power draw should use the Arc 140V Mobile. The benchmark database currently contains no direct performance scores for either GPU, so these conclusions rest on the recorded specification deltas rather than measured application results.

DETAILED SPECIFICATIONS

SPECIFICATION
140V Mobile
Pro B60 Dual
Core Specs
Shading Units
1,024
2,560 +150.0%
Shaders
1,024
2,560 +150.0%
TMUs
64
160 +150.0%
ROPs
32
80 +150.0%
Execution Units
128
20 -84.4%
Clocks
Base Clock
300 MHz
2000 MHz
Boost Clock
1950 MHz
2400 MHz
Memory Clock
System Shared
2375 MHz 19 Gbps effective
Memory
Memory Size
System Shared
24 GB
VRAM (MB)
24,576
Memory Type
System Shared
GDDR6
Memory Bus
System Shared
192 bit
Bandwidth
System Dependent
456.0 GB/s
Cache
L2 Cache
4 MB
10 MB
Performance
Pixel Rate
62.40 GPixel/s
192.0 GPixel/s
Texture Rate
124.8 GTexel/s
384.0 GTexel/s
FP32 (TFLOPS)
3.994 TFLOPS
12.29 TFLOPS
FP64 (TFLOPS)
998.4 GFLOPS (1:4)
3.072 TFLOPS (1:4)
FP16 (TFLOPS)
7.987 TFLOPS (2:1)
24.58 TFLOPS (2:1)
AI/RT
RT Cores
8
20 +150.0%
XMX Cores
128
160 +25.0%
Power
TDP
37 W
400 W
TDP (W)
37
400 +981.1%
Suggested PSU
800 W
Power Connectors
1x 16-pin
Architecture
Architecture
Xe2-LPG
Xe2-HPG
GPU Name
Lunar Lake
BMG-G21
Generation
Arc Graphics-M (Lunar Lake)
Battlemage (Pro Series)
Process Size
3 nm
5 nm
Transistors
unknown
19,600 million
Die Size
172 mm²
272 mm²
Foundry
TSMC
TSMC
Density
72.1M / mm²
API Support
DirectX
12 Ultimate (12_2)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.4
1.4
OpenCL
3.0
3.0
Shader Model
6.8
6.6
Physical
Slot Width
IGP
Dual-slot
Length
300 mm 11.8 inches
Height
110 mm 4.3 inches
Outputs
Portable Device Dependent
4x mini-DisplayPort 2.1
Bus Interface
IGP
PCIe 5.0 x8
Other
Launch Price
1,199 USD
Production
Active
Active
Predecessor
HD Graphics-M
View Arc 140V Mobile Details View Arc Pro B60 Dual Details