Intel Arc 140V Mobile vs Intel Arc G3 Extreme Comparison

Intel
GPU

Intel Arc 140V Mobile

CORE STATE Lunar Lake
VRAM System Shared
CLOCK SPEED 1950 MHz
TDP 37 W
BUS WIDTH System Shared
ARCHITECTURE Xe2-LPG
nm
PROCESS 3 nm
LAUNCH DATE 2024
VS
Intel
GPU

Arc G3 Extreme

CORE STATE Panther Lake
VRAM System Shared
CLOCK SPEED 2500 MHz
TDP 80 W
BUS WIDTH System Shared
ARCHITECTURE Xe3-LPG
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Arc 140V Mobile vs Intel Arc G3 Extreme

Intel Arc 140V Mobile and Intel Arc G3 Extreme are both integrated graphics solutions from Intel, but they target different performance brackets within the mobile segment. The 140V is based on the Lunar Lake chip with the Xe2-LPG architecture, while the G3 Extreme uses the Panther Lake chip with the newer Xe3-LPG architecture. Both parts share the same IGP slot width, bus interface, and API support, but the data reveals substantial differences in compute resources, clock speeds, and power envelopes. This analysis draws exclusively on recorded specifications and benchmark data from the database.

Head-to-Head Benchmarks

The database records no direct benchmark scores for either GPU, so the comparison must rely on theoretical peak throughput values and architectural parameters. The most striking difference appears in FP32 compute. The Arc G3 Extreme delivers 7.680 TFLOPS, which is 1.923 times the 3.994 TFLOPS of the Arc 140V Mobile. In percentage terms, the G3 Extreme leads by 92.3% in single-precision floating-point throughput. This gap is directly attributable to the G3 Extreme’s larger shader array: 1536 shading units versus 1024 on the 140V, a 50% increase in raw shader count. The G3 Extreme also boosts its clock speed higher, reaching 2500 MHz compared to 1950 MHz on the 140V, a 28.2% advantage in peak boost frequency. Together, the extra shaders and higher clock produce the near-doubling of FP32 performance.

FP16 throughput follows the same pattern. The G3 Extreme achieves 15.36 TFLOPS (2:1) against the 140V’s 7.987 TFLOPS (2:1), again a 92.3% advantage. Both GPUs appear to use a 2:1 ratio for FP16 operations, meaning the relative performance gap remains constant across precision formats. This consistency suggests that the compute architecture scales linearly with shader count and clock speed, with no architectural efficiency differences between Xe2-LPG and Xe3-LPG in raw math throughput.

The texture and pixel rate comparison introduces a twist. The Arc 140V Mobile has 64 texture mapping units (TMUs) and 32 raster output units (ROPs), producing a texture rate of 124.8 GTexel/s and a pixel rate of 62.40 GPixel/s. The Arc G3 Extreme has fewer TMUs (48) and fewer ROPs (24), yielding 120.0 GTexel/s and 60.00 GPixel/s respectively. Despite the G3 Extreme’s higher clock speed, its reduced TMU and ROP counts mean it trails the 140V in both texture fill rate (3.8% lower) and pixel fill rate (3.8% lower). This is a notable inversion: the G3 Extreme is faster in compute but slower in fixed-function rasterization throughput. The 140V’s higher ROP count (32 vs 24) gives it a 33.3% advantage in raw pixel output capacity, though the actual rendering performance depends on memory bandwidth and other factors that the database lists as system-dependent.

Ray tracing resources also favor the G3 Extreme. It contains 12 RT cores versus 8 on the 140V, a 50% increase. No ray tracing benchmark scores are recorded, so the practical impact cannot be quantified, but the hardware allocation suggests the G3 Extreme is designed for heavier ray-traced workloads.

The power envelope differs dramatically. The Arc G3 Extreme carries a TDP of 80 W, while the Arc 140V Mobile is rated at 37 W. This 43 W difference represents a 116.2% higher power budget for the G3 Extreme. The performance-per-watt picture is therefore complex: the G3 Extreme delivers 92.3% more FP32 performance while consuming 116.2% more power, making the 140V more efficient in raw compute per watt. However, the G3 Extreme’s higher absolute performance may justify the power cost in larger laptops or devices with cooling headroom.

Both GPUs rely on system-shared memory with system-dependent bandwidth, so memory performance cannot be compared directly. Neither part has dedicated VRAM, and both use the same memory type and bus width, which are listed as system shared. The database records no memory clock or bandwidth figures for either GPU, only that bandwidth is system dependent.

The Verdict

The data indicates that the Arc G3 Extreme is the higher-performance part for compute-heavy workloads. Its FP32 throughput of 7.680 TFLOPS nearly doubles the 140V’s 3.994 TFLOPS, and its FP16 performance scales correspondingly. The G3 Extreme also has 50% more RT cores, which may benefit ray-traced rendering in supported titles. For tasks that rely heavily on shader math, such as high-resolution gaming with modern effects, or GPU-accelerated compute, the G3 Extreme holds a clear advantage.

The Arc 140V Mobile, however, offers superior fixed-function throughput. Its 124.8 GTexel/s texture rate and 62.40 GPixel/s pixel rate exceed the G3 Extreme’s 120.0 GTexel/s and 60.00 GPixel/s. This suggests that in scenarios where texture filtering or rasterization is the bottleneck, the 140V may perform comparably or even better despite its lower compute ceiling. The 140V also consumes less power, with a 37 W TDP against 80 W, making it more suitable for thin-and-light devices where thermal and battery constraints dominate.

The release dates further differentiate the parts. The Arc 140V Mobile launched on 2024-09-23, while the Arc G3 Extreme is dated 2026-05-31. The G3 Extreme is a later-generation product, built on the Xe3-LPG architecture versus Xe2-LPG. Both use a 3 nm process, but the foundries differ: TSMC for the 140V and Intel for the G3 Extreme. The die size is recorded as 172 mm² for the 140V, while the G3 Extreme’s die size is unknown.

For a device where GPU compute is the primary requirement, the Arc G3 Extreme is the logical choice based on the recorded specifications. For a device prioritizing efficiency and balanced rasterization performance, the Arc 140V Mobile presents a compelling case. Neither part has a recorded average benchmark score or percentile ranking beyond a shared 50th percentile against all GPUs, and the nearest rivals list is empty. The verdict rests entirely on the theoretical peak rates and architectural allocations documented here.

Architecture Differences

The two GPUs represent two distinct microarchitectures from Intel. The Arc 140V Mobile uses Xe2-LPG, which is the graphics architecture found in the Lunar Lake chip. The Arc G3 Extreme uses Xe3-LPG, a newer architecture paired with the Panther Lake chip. Both architectures are described as low-power graphics variants, indicated by the LPG suffix, and both are integrated into the processor package rather than being discrete add-in cards.

The manufacturing process is 3 nm for both parts, but the foundry assignment differs. The Arc 140V Mobile is fabricated by TSMC, while the Arc G3 Extreme is fabricated by Intel. The die size for the 140V is 172 mm², whereas the G3 Extreme’s die size is not recorded in the database. Transistor counts are unknown for both, and transistor density is not provided.

The shading unit count increases from 1024 on the 140V to 1536 on the G3 Extreme. This 512-unit increase aligns with the G3 Extreme’s higher compute throughput. However, the TMU and ROP counts decrease: from 64 TMUs and 32 ROPs on the 140V to 48 TMUs and 24 ROPs on the G3 Extreme. This trade-off suggests that Xe3-LPG prioritizes shader and RT resources over texture and raster units, at least in this implementation. The RT core count rises from 8 to 12, reinforcing the emphasis on ray tracing.

Both GPUs expose the same API feature set: DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The tensor core field is null for both, so no AI accelerator differentiation can be drawn from the data. The base clock is identical at 300 MHz, but the boost clock differs substantially: 1950 MHz for the 140V versus 2500 MHz for the G3 Extreme.

The power connector field is null for the 140V and listed as none for the G3 Extreme, which is consistent with both being IGP parts. The display outputs are portable device dependent for both, meaning the actual ports are determined by the laptop or handheld system rather than the GPU itself.

Specification Differences

The following specification fields differ between the two parts, based solely on the recorded data:

  • Chip: Lunar Lake (140V) versus Panther Lake (G3 Extreme)
  • Architecture: Xe2-LPG (140V) versus Xe3-LPG (G3 Extreme)
  • Generation: Arc Graphics-M (Lunar Lake) versus Arc Graphics-M (Panther Lake)
  • Foundry: TSMC (140V) versus Intel (G3 Extreme)
  • Die size: 172 mm² (140V) versus unknown (G3 Extreme)
  • Boost clock: 1950 MHz (140V) versus 2500 MHz (G3 Extreme)
  • Shading units: 1024 (140V) versus 1536 (G3 Extreme)
  • TMUs: 64 (140V) versus 48 (G3 Extreme)
  • ROPs: 32 (140V) versus 24 (G3 Extreme)
  • RT cores: 8 (140V) versus 12 (G3 Extreme)
  • Pixel rate: 62.40 GPixel/s (140V) versus 60.00 GPixel/s (G3 Extreme)
  • Texture rate: 124.8 GTexel/s (140V) versus 120.0 GTexel/s (G3 Extreme)
  • FP32: 3.994 TFLOPS (140V) versus 7.680 TFLOPS (G3 Extreme)
  • FP16: 7.987 TFLOPS (140V) versus 15.36 TFLOPS (G3 Extreme)
  • TDP: 37 W (140V) versus 80 W (G3 Extreme)
  • Power connectors: null (140V) versus none (G3 Extreme)
  • Release date: 2024-09-23 (140V) versus 2026-05-31 (G3 Extreme)
  • Predecessor: HD Graphics-M (140V) versus null (G3 Extreme)

Fields that are identical include the base clock (300 MHz), memory configuration (system shared in size, type, bus width, and bandwidth), slot width (IGP), bus interface (IGP), display outputs (portable device dependent), APIs (DirectX 12 Ultimate, OpenGL 4.6, Vulkan 1.4), production status (active), and launch MSRP (null for both). Both parts also share the same process node (3 nm) and the same manufacturer (Intel). The transistor count and transistor density are unknown for both, and neither has a successor listed.

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The Arc G3 Extreme delivers 7.680 TFLOPS, which is 92.3% higher than the Arc 140V Mobile’s 3.994 TFLOPS.

Q: Does the Arc 140V Mobile outperform the Arc G3 Extreme in any metric?

A: Yes, the 140V has a higher texture rate (124.8 GTexel/s versus 120.0 GTexel/s) and a higher pixel rate (62.40 GPixel/s versus 60.00 GPixel/s), along with more TMUs (64 versus 48) and more ROPs (32 versus 24).

Q: What is the power consumption difference between the two?

A: The Arc G3 Extreme has a TDP of 80 W, while the Arc 140V Mobile is rated at 37 W. The G3 Extreme consumes 43 W more, which is a 116.2% higher power budget.

Q: Do both GPUs support the same graphics APIs?

A: Yes, both support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4.

Q: How do the ray tracing resources compare?

A: The Arc G3 Extreme has 12 RT cores, while the Arc 140V Mobile has 8, a 50% increase in RT core count for the G3 Extreme.

Q: Are the memory configurations different?

A: No, both use system-shared memory with system-shared type, bus width, and system-dependent bandwidth. Neither has dedicated VRAM.

DETAILED SPECIFICATIONS

SPECIFICATION
140V Mobile
G3 Extreme
Core Specs
Shading Units
1,024
1,536 +50.0%
Shaders
1,024
1,536 +50.0%
TMUs
64
48 -25.0%
ROPs
32
24 -25.0%
Execution Units
128
12 -90.6%
Clocks
Base Clock
300 MHz
300 MHz
Boost Clock
1950 MHz
2500 MHz
Memory Clock
System Shared
System Shared
Memory
Memory Size
System Shared
System Shared
Memory Type
System Shared
System Shared
Memory Bus
System Shared
System Shared
Bandwidth
System Dependent
System Dependent
Cache
L1 Cache
64 KB (per EU)
L2 Cache
4 MB
16 MB
Performance
Pixel Rate
62.40 GPixel/s
60.00 GPixel/s
Texture Rate
124.8 GTexel/s
120.0 GTexel/s
FP32 (TFLOPS)
3.994 TFLOPS
7.680 TFLOPS
FP64 (TFLOPS)
998.4 GFLOPS (1:4)
960.0 GFLOPS (1:8)
FP16 (TFLOPS)
7.987 TFLOPS (2:1)
15.36 TFLOPS (2:1)
AI/RT
RT Cores
8
12 +50.0%
XMX Cores
128
96 -25.0%
Power
TDP
37 W
80 W
TDP (W)
37
80 +116.2%
Power Connectors
None
Architecture
Architecture
Xe2-LPG
Xe3-LPG
GPU Name
Lunar Lake
Panther Lake
Generation
Arc Graphics-M (Lunar Lake)
Arc Graphics-M (Panther Lake)
Process Size
3 nm
3 nm
Transistors
unknown
unknown
Die Size
172 mm²
unknown
Foundry
TSMC
Intel
API Support
DirectX
12 Ultimate (12_2)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.4
1.4
OpenCL
3.0
3.0
Shader Model
6.8
6.9
Physical
Slot Width
IGP
IGP
Outputs
Portable Device Dependent
Portable Device Dependent
Bus Interface
IGP
IGP
Other
Production
Active
Active
Predecessor
HD Graphics-M
View Arc 140V Mobile Details View Arc G3 Extreme Details