Intel Arc 140V Mobile vs Intel Arc B770 Comparison

Intel
GPU

Intel Arc 140V Mobile

CORE STATE Lunar Lake
VRAM System Shared
CLOCK SPEED 1950 MHz
TDP 37 W
BUS WIDTH System Shared
ARCHITECTURE Xe2-LPG
nm
PROCESS 3 nm
LAUNCH DATE 2024
VS
Intel
GPU

Arc B770

CORE STATE BMG-G31
VRAM 16 GB
CLOCK SPEED 2400 MHz
TDP 225 W
BUS WIDTH 256 bit
ARCHITECTURE Xe2-HPG
nm
PROCESS 5 nm
LAUNCH DATE 2026

Analysis: Intel Arc 140V Mobile vs Intel Arc B770

Head-to-Head Benchmarks

The recorded database contains no head-to-head benchmark entries for the Intel Arc 140V Mobile versus the Intel Arc B770. Both entries show zero benchmark scores, zero average scores, and no nearest rival data. The wins counter is zero for each part. This absence of measured data means the comparison must rest entirely on the specification sheet and the architectural characteristics recorded in the database.

The Intel Arc B770 holds the clear advantage in raw compute throughput. Its FP32 output is recorded at 19.66 TFLOPS, which is roughly 4.9 times the 3.994 TFLOPS of the Intel Arc 140V Mobile. The FP16 figures follow the same pattern: 39.32 TFLOPS for the B770 versus 7.987 TFLOPS for the 140V. Both figures use a 2:1 ratio, so the comparison is apples-to-apples. The B770 also leads in pixel throughput with 307.2 GPixel/s against 62.40 GPixel/s, a ratio of approximately 4.9 to 1. Texture rate shows 614.4 GTexel/s for the B770 versus 124.8 GTexel/s for the 140V, again a 4.9 times difference.

The memory subsystem tells a similar story. The B770 uses 16 GB of GDDR6 on a 256-bit bus, delivering 512.0 GB/s of bandwidth. The 140V mobile uses system shared memory, with bandwidth recorded as system dependent, meaning the actual figure depends on the host memory configuration. The B770 has a fixed, dedicated memory pool; the 140V has no dedicated VRAM allocation in the database.

There are no recorded wins for either side in the head-to-head section. The benchmark database lists zero entries for both parts, so no percentile movement or rival deltas can be cited. The percentileVsAllGpus field is 50 for both, which indicates the database places each at the midpoint of all recorded GPUs, but with no benchmark data behind them, this value carries no comparative weight in this matchup.

FAQ

Q: Which GPU has the higher boost clock?

A: The Intel Arc B770 boosts to 2400 MHz, while the Intel Arc 140V Mobile boosts to 1950 MHz. The B770 also has a higher base clock at 2100 MHz compared to 300 MHz for the 140V.

Q: How much memory does each GPU use?

A: The Intel Arc B770 has 16 GB of GDDR6 memory on a 256-bit bus with 512.0 GB/s bandwidth. The Intel Arc 140V Mobile uses system shared memory, with its bus width, size, and bandwidth all listed as system dependent.

Q: What are the power requirements for each part?

A: The Intel Arc B770 has a TDP of 225 W, uses a dual-slot cooler, and requires a 550 W suggested power supply with one 6-pin and one 8-pin power connector. The Intel Arc 140V Mobile has a TDP of 37 W and is an integrated graphics processor with no power connectors listed.

Q: Are the ray tracing capabilities different?

A: Yes. The Intel Arc B770 has 32 ray tracing cores, while the Intel Arc 140V Mobile has 8 ray tracing cores. Both support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4.

Q: What process nodes do the two chips use?

A: The Intel Arc 140V Mobile uses a 3 nm process from TSMC, while the Intel Arc B770 uses a 5 nm process from TSMC. The 140V has a die size of 172 mm², and the B770 has a die size of 368 mm².

Q: Which part is newer in the database?

A: The Intel Arc 140V Mobile has a release date of 2024-09-23, and the Intel Arc B770 has a release date of 2025-12-31. The B770 is the later release.

Architecture Differences

The two GPUs come from different Intel architecture families. The Intel Arc 140V Mobile uses the Lunar Lake chip with the Xe2-LPG architecture, classified in the Arc Graphics-M (Lunar Lake) generation. The Intel Arc B770 uses the BMG-G31 chip with the Xe2-HPG architecture, classified in the Battlemage (Arc 7) generation. Both share the Xe2 lineage, but the LPG variant is designed for integrated, power-limited mobile use, while the HPG variant is a high-performance discrete design.

The 140V is built on a 3 nm TSMC process with a die size of 172 mm². The B770 uses a 5 nm TSMC process with a much larger die at 368 mm². The larger die accommodates substantially more execution resources: the B770 has 4096 shading units, 256 texture mapping units, 128 ROPs, and 32 ray tracing cores. The 140V has 1024 shading units, 64 TMUs, 32 ROPs, and 8 ray tracing cores. The B770 therefore has exactly four times the shading units, TMUs, ROPs, and ray tracing cores of the 140V.

Memory architecture differs fundamentally. The 140V relies on system shared memory, meaning its memory size, type, bus width, and bandwidth are all system dependent. The B770 has dedicated 16 GB GDDR6 memory on a 256-bit bus with a fixed 512.0 GB/s bandwidth. The memory clock is recorded as 2000 MHz with 16 Gbps effective transfer for the B770, while the 140V memory clock is listed as system shared.

The interface and physical form factor also separate the two. The 140V is an integrated graphics processor with an IGP slot width and IGP bus interface. The B770 is a dual-slot discrete card with a PCIe 4.0 x16 interface. The B770 requires external power via one 6-pin and one 8-pin connector and lists a 550 W suggested power supply; the 140V has no power connectors and a much lower thermal envelope.

Specification Differences

The clock speeds differ sharply. The 140V runs at 300 MHz base and 1950 MHz boost. The B770 runs at 2100 MHz base and 2400 MHz boost. The B770 has a higher memory clock (2000 MHz, 16 Gbps effective) versus system shared for the 140V.

Compute resources differ by a factor of four across the board. The B770 has 4096 shading units versus 1024, 256 TMUs versus 64, 128 ROPs versus 32, and 32 ray tracing cores versus 8. The B770 also has a larger die (368 mm² versus 172 mm²), a different process node (5 nm versus 3 nm), and a higher TDP (225 W versus 37 W).

Memory capacity and bandwidth are only defined for the B770: 16 GB GDDR6 with 512.0 GB/s. The 140V's memory fields are all system dependent. Display outputs differ as well: the B770 lists 1x HDMI 2.1a and 3x DisplayPort 2.1, while the 140V lists portable device dependent outputs. The B770 uses a 256-bit bus, the 140V uses system shared.

Fill rates and throughput values follow the resource counts. Pixel rate is 307.2 GPixel/s for the B770 versus 62.40 GPixel/s for the 140V. Texture rate is 614.4 GTexel/s versus 124.8 GTexel/s. FP32 is 19.66 TFLOPS versus 3.994 TFLOPS, and FP16 is 39.32 TFLOPS versus 7.987 TFLOPS. Both support the same API set: DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The production status differs: the 140V is active, while the B770 has no recorded production status. The 140V lists its predecessor as HD Graphics-M; the B770 lists its predecessor as Alchemist.

The Verdict

The database records no benchmark scores for either GPU, so the verdict rests on the specification sheet. The Intel Arc B770 is the higher-performance part by every measurable compute metric. It has four times the shading units, four times the TMUs, four times the ROPs, four times the ray tracing cores, roughly 4.9 times the FP32 throughput, and roughly 4.9 times the FP16 throughput. Its pixel and texture rates are also roughly 4.9 times higher. The B770 has a dedicated 16 GB GDDR6 memory pool with 512.0 GB/s bandwidth, while the 140V depends on system memory.

The Intel Arc 140V Mobile is the lower-power, integrated alternative. Its 37 W TDP and lack of power connectors make it suitable for portable systems, whereas the B770's 225 W TDP, dual-slot cooler, and 550 W suggested power supply indicate a desktop discrete card. The 140V uses a smaller die (172 mm² versus 368 mm²) on a more advanced 3 nm process, which reflects its integration priority.

The B770 also carries a later release date (2025-12-31 versus 2024-09-23). For anyone selecting purely on recorded specifications, the B770 is the stronger compute device, and the 140V is the power-efficient integrated option. The lack of benchmark data means no assertion about real-world performance can be made from the database beyond what the specifications imply.

Where Each One Wins

The Intel Arc B770 wins on raw compute throughput. Its FP32 output of 19.66 TFLOPS and FP16 output of 39.32 TFLOPS put it in a different performance class from the 140V's 3.994 and 7.987 TFLOPS. The B770 also wins on memory bandwidth with 512.0 GB/s from dedicated GDDR6, compared to the 140V's system dependent shared memory. The B770 has four times the shading units, TMUs, ROPs, and ray tracing cores, which suggests an advantage in workloads that scale with those resources, such as high-resolution rendering and ray-traced scenes.

The B770 wins on display connectivity as well. Its 1x HDMI 2.1a and 3x DisplayPort 2.1 outputs exceed the 140V's portable device dependent outputs. The B770's PCIe 4.0 x16 interface and dual-slot form factor indicate a desktop installation with expansion capability.

The Intel Arc 140V Mobile wins on power efficiency and integration. Its 37 W TDP is far below the B770's 225 W, and it requires no power connectors or suggested PSU rating. The 140V is an IGP with a 3 nm process and a 172 mm² die, making it the appropriate choice for a compact mobile platform. Its system shared memory model means it can draw on whatever system RAM is available, which simplifies design in laptops. The 140V also has a lower base clock (300 MHz), which helps idle and light-load power consumption.

The 140V wins on process technology: 3 nm versus 5 nm for the B770. While the B770 delivers more absolute performance, the 140V achieves its lower power envelope with a more advanced manufacturing node. The 140V is the only one of the two with an active production status in the database, and its release date is earlier.

In summary, the B770 is the performance leader across compute, memory, and output options. The 140V is the efficiency and integration leader. Each part wins in the category that matches its design intent: the B770 for maximum throughput, the 140V for low power and portability.

DETAILED SPECIFICATIONS

SPECIFICATION
140V Mobile
B770
Core Specs
Shading Units
1,024
4,096 +300.0%
Shaders
1,024
4,096 +300.0%
TMUs
64
256 +300.0%
ROPs
32
128 +300.0%
Execution Units
128
32 -75.0%
Clocks
Base Clock
300 MHz
2100 MHz
Boost Clock
1950 MHz
2400 MHz
Memory Clock
System Shared
2000 MHz 16 Gbps effective
Memory
Memory Size
System Shared
16 GB
VRAM (MB)
16,384
Memory Type
System Shared
GDDR6
Memory Bus
System Shared
256 bit
Bandwidth
System Dependent
512.0 GB/s
Cache
L2 Cache
4 MB
16 MB
Performance
Pixel Rate
62.40 GPixel/s
307.2 GPixel/s
Texture Rate
124.8 GTexel/s
614.4 GTexel/s
FP32 (TFLOPS)
3.994 TFLOPS
19.66 TFLOPS
FP64 (TFLOPS)
998.4 GFLOPS (1:4)
2.458 TFLOPS (1:8)
FP16 (TFLOPS)
7.987 TFLOPS (2:1)
39.32 TFLOPS (2:1)
AI/RT
RT Cores
8
32 +300.0%
XMX Cores
128
256 +100.0%
Power
TDP
37 W
225 W
TDP (W)
37
225 +508.1%
Suggested PSU
550 W
Power Connectors
1x 6-pin + 1x 8-pin
Architecture
Architecture
Xe2-LPG
Xe2-HPG
GPU Name
Lunar Lake
BMG-G31
Generation
Arc Graphics-M (Lunar Lake)
Battlemage (Arc 7)
Process Size
3 nm
5 nm
Transistors
unknown
unknown
Die Size
172 mm²
368 mm²
Foundry
TSMC
TSMC
API Support
DirectX
12 Ultimate (12_2)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.4
1.4
OpenCL
3.0
3.0
Shader Model
6.8
6.6
Physical
Slot Width
IGP
Dual-slot
Outputs
Portable Device Dependent
1x HDMI 2.1a3x DisplayPort 2.1
Bus Interface
IGP
PCIe 4.0 x16
Other
Production
Active
Predecessor
HD Graphics-M
Alchemist
View Arc 140V Mobile Details View Arc B770 Details