Intel Arc Pro B370 vs Intel Data Center GPU Max 1350 Comparison

FAQ

Q: What are the core specifications of the Intel Arc Pro B370?

A: The Intel Arc Pro B370 is built on a 3 nm process with the Xe3-LPG architecture and Panther Lake chip. It has 1280 shading units, 40 TMUs, 20 ROPs, and 10 RT cores. Its base clock is 300 MHz with a boost clock of 2400 MHz, and it uses system shared memory with system dependent bandwidth.

Q: What are the main specifications of the Intel Data Center GPU Max 1350?

A: The Intel Data Center GPU Max 1350 uses the Ponte Vecchio chip on a 10 nm process with Generation 12.5 architecture. It contains 14336 shading units, 896 TMUs, 0 ROPs, and 112 RT cores. It has 96 GB of HBM2e memory on an 8192-bit bus with 2.46 TB/s bandwidth. Its base clock is 750 MHz and boost clock is 1550 MHz.

Q: How do the power requirements compare between the two?

A: The Arc Pro B370 has a TDP of 25 W and uses no power connectors, functioning as an integrated graphics processor (IGP). The Data Center GPU Max 1350 has a TDP of 450 W and is an OAM module with a suggested PSU of 850 W.

Q: What interfaces do these GPUs use?

A: The Arc Pro B370 uses an IGP bus interface, meaning it is integrated into a processor package. The Data Center GPU Max 1350 uses a PCIe 5.0 x16 interface, providing a dedicated expansion slot connection.

Q: What are the display output capabilities of each?

A: The Arc Pro B370's display outputs are portable device dependent, meaning they vary based on the host system. The Data Center GPU Max 1350 has no display outputs at all, as it is designed for compute workloads rather than graphics output.

Q: What API support does each GPU offer?

A: The Arc Pro B370 supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The Data Center GPU Max 1350 supports DirectX 12 (12_1) and OpenGL 4.6, but has no Vulkan support listed.

Q: When were these products released?

A: The Intel Data Center GPU Max 1350 was released on January 9, 2023, while the Intel Arc Pro B370 was released on January 26, 2026. The Data Center GPU Max 1350 lists the H3C Graphics as its successor.

Where Each One Wins

The Intel Arc Pro B370 is positioned for integrated, low-power graphics scenarios. Its 25 W TDP and IGP form factor make it suitable for compact portable devices where power efficiency and space are primary constraints. The GPU uses system shared memory, which eliminates the need for dedicated VRAM allocation and simplifies system design. Its support for DirectX 12 Ultimate (12_2) and Vulkan 1.4 gives it modern graphics API coverage, and its display outputs being portable device dependent indicate flexibility across different host platforms.

The Intel Data Center GPU Max 1350 targets high-throughput compute environments. Its 96 GB of HBM2e memory with 2.46 TB/s bandwidth provides massive data movement capability for large datasets. The 14336 shading units deliver substantial parallel processing throughput, while the 112 RT cores support ray tracing workloads. The PCIe 5.0 x16 interface offers high-bandwidth host connectivity. With no display outputs, this GPU is strictly for computation rather than visualization.

The transistor counts tell a clear story of scale. The Data Center GPU Max 1350 integrates 100,000 million transistors across a 1280 mm² die with a density of 78.1M per mm². The Arc Pro B370's transistor count is unknown, but its 3 nm process node suggests a much smaller, denser implementation optimized for integration rather than raw scale.

The texture rate figures highlight the compute divide. The Data Center GPU Max 1350 achieves 1,388.8 GTexel/s, which is over 14 times the Arc Pro B370's 96.00 GTexel/s. The FP32 throughput difference follows the same pattern: 44.44 TFLOPS versus 6.144 TFLOPS. However, the Arc Pro B370 has a non-zero pixel rate of 48.00 GPixel/s, while the Data Center GPU Max 1350 records 0 MPixel/s, reflecting its lack of rasterization hardware in the traditional sense.

Architecture Differences

The two GPUs represent fundamentally different architectural approaches within Intel's lineup. The Arc Pro B370 uses Xe3-LPG architecture on the Panther Lake chip, built on a 3 nm process. This is a low-power integrated graphics design from the Arc Graphics-WM (Panther Lake) generation. Its predecessor is listed as HD Graphics-WM, indicating an evolutionary path from Intel's integrated graphics solutions.

The Data Center GPU Max 1350 uses Generation 12.5 architecture on the Ponte Vecchio chip, fabricated on a 10 nm process. This belongs to the Data Center GPU (Ponte Vecchio) generation and has no predecessor listed. The architectural generation gap is substantial: Xe3-LPG represents a newer design philosophy focused on efficiency and integration, while Generation 12.5 was built for maximum compute density in data center deployments.

The memory architecture differs fundamentally. The Arc Pro B370 uses system shared memory with system dependent bandwidth, meaning it borrows from the host system's memory pool. The Data Center GPU Max 1350 has dedicated 96 GB of HBM2e memory with a 2.46 TB/s bandwidth over an 8192-bit bus. This dedicated high-bandwidth memory is essential for data center workloads that cannot tolerate the latency and bandwidth variability of shared memory.

The ROP configuration is notable. The Arc Pro B370 has 20 ROPs and achieves a 48.00 GPixel/s pixel rate. The Data Center GPU Max 1350 has 0 ROPs and a 0 MPixel/s pixel rate. This indicates the data center part does not perform traditional rasterization output, instead focusing entirely on compute and texture processing. The texture units tell the opposite story: 40 TMUs on the Arc Pro B370 versus 896 TMUs on the Data Center GPU Max 1350, with proportional texture rates of 96.00 GTexel/s and 1,388.8 GTexel/s respectively.

API support differences reflect their intended roles. The Arc Pro B370 supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The Data Center GPU Max 1350 supports DirectX 12 (12_1) and OpenGL 4.6 but lists no Vulkan support. The graphics-oriented integrated part has broader API coverage, while the compute-oriented data center part omits Vulkan entirely.

Specification Differences

The clock speeds differ significantly. The Arc Pro B370 operates at a 300 MHz base clock and 2400 MHz boost clock, with system shared memory clock. The Data Center GPU Max 1350 runs at 750 MHz base and 1550 MHz boost, with memory at 1200 MHz or 2.4 Gbps effective. The integrated part boosts much higher, while the data center part relies on wider parallelism rather than higher clocks.

The FP16 capabilities show different ratios. The Arc Pro B370 delivers 12.29 TFLOPS FP16 at a 2:1 ratio relative to FP32. The Data Center GPU Max 1350 delivers 44.44 TFLOPS FP16 at a 1:1 ratio, meaning it processes FP16 at the same rate as FP32. This suggests the data center part is optimized for mixed-precision workloads where FP16 throughput matters.

The form factors are entirely different. The Arc Pro B370 is an IGP with no slot width specified, no power connectors, and dimensions dependent on the host device. The Data Center GPU Max 1350 is an OAM Module with a suggested PSU of 850 W and a PCIe 5.0 x16 bus interface.

The production status for both is listed as Active. The release dates are separated by roughly three years: January 9, 2023 for the Data Center GPU Max 1350 and January 26, 2026 for the Arc Pro B370. The Data Center GPU Max 1350 has a listed successor, H3C Graphics, while the Arc Pro B370 has no successor listed.

The die size difference is dramatic: the Data Center GPU Max 1350 measures 1280 mm², while the Arc Pro B370's die size is unknown. Transistor density for the data center part is 78.1M per mm², and its transistor count is listed at 100,000 million. The Arc Pro B370's transistor count is unknown.

Head-to-Head Benchmarks

Direct benchmark comparisons between these two GPUs are limited in the database, with no head-to-head benchmark entries recorded and zero wins recorded for either side. However, the specification data provides clear performance indicators that establish the hierarchy between them.

The FP32 compute performance shows the Data Center GPU Max 1350 at 44.44 TFLOPS versus 6.144 TFLOPS for the Arc Pro B370. This represents roughly a 7.2 times advantage for the data center part. In FP16, the Data Center GPU Max 1350 delivers 44.44 TFLOPS at a 1:1 ratio, while the Arc Pro B370 provides 12.29 TFLOPS at a 2:1 ratio, giving the data center part approximately a 3.6 times advantage.

Texture processing favors the Data Center GPU Max 1350 overwhelmingly. Its 1,388.8 GTexel/s texture rate compares to 96.00 GTexel/s for the Arc Pro B370, a difference of approximately 14.5 times. The 896 TMUs versus 40 TMUs explains this gap, as the data center part has over 22 times the texture units.

The pixel rate reverses this trend. The Arc Pro B370 achieves 48.00 GPixel/s with its 20 ROPs, while the Data Center GPU Max 1350 records 0 MPixel/s with 0 ROPs. This reflects the integrated part's role in rendering to displays, an unnecessary function for a compute accelerator with no display outputs.

Memory bandwidth is another area of massive divergence. The Data Center GPU Max 1350 provides 2.46 TB/s from its 96 GB HBM2e pool over an 8192-bit bus. The Arc Pro B370 relies on system shared memory with bandwidth listed as system dependent, meaning its memory performance varies with the host platform. The 96 GB capacity of the data center part is a fixed specification, while the Arc Pro B370's memory size is also system shared and therefore variable.

The RT core count differs by an order of magnitude: 112 on the Data Center GPU Max 1350 versus 10 on the Arc Pro B370. This suggests the data center part has significantly more ray tracing capability, though its intended workloads may not emphasize this feature given the lack of display outputs.

Both GPUs sit at the 50th percentile among all GPUs in the database. The average benchmark score for both is 0, indicating no recorded benchmark averages. The nearest rivals lists are empty for both products, limiting direct comparative analysis within the database.

The clock behavior highlights different design priorities. The Arc Pro B370's 2400 MHz boost clock is substantially higher than the Data Center GPU Max 1350's 1550 MHz. The integrated part compensates for fewer execution units with higher frequencies. The data center part instead scales through massive parallelism: 14336 shading units versus 1280, 896 TMUs versus 40, and 112 RT cores versus 10.

The power envelope difference is stark. The Arc Pro B370's 25 W TDP enables fanless, integrated operation without power connectors. The Data Center GPU Max 1350's 450 W TDP requires the 850 W suggested PSU and an OAM module form factor. This 18 times power difference maps directly to the performance differences: the data center part consumes significantly more power to deliver its compute throughput.

The memory clock specifications also differ. The Data Center GPU Max 1350 operates its HBM2e at 1200 MHz with 2.4 Gbps effective data rate. The Arc Pro B370's memory clock is listed as system shared, meaning it depends entirely on the host system's memory configuration.