Intel Data Center GPU Max 1350
Intel graphics card specifications and benchmark scores
Ray Tracing
XMX CoresAt a Glance
IntelIntel Data Center GPU Max 1350 Specifications
GPU Core
Shader units and compute resources
The Intel Data Center GPU Max 1350 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
Data Center GPU Max 1350 Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the Data Center GPU Max 1350's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The Data Center GPU Max 1350 by Intel dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
Intel's Data Center GPU Max 1350 Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The Data Center GPU Max 1350's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
Data Center GPU Max 1350 by Intel Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the Data Center GPU Max 1350, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
Data Center GPU Max 1350 Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the Intel Data Center GPU Max 1350 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
Data Center GPU Max 1350 Ray Tracing & AI
Hardware acceleration features
The Intel Data Center GPU Max 1350 includes dedicated hardware for ray tracing and AI acceleration. RT cores handle real-time ray tracing calculations for realistic lighting, reflections, and shadows in supported games. Tensor cores (NVIDIA) or XMX cores (Intel) accelerate AI workloads including DLSS, FSR, and XeSS upscaling technologies. These features enable higher visual quality without proportional performance costs, making the Data Center GPU Max 1350 capable of delivering both stunning graphics and smooth frame rates in modern titles.
Generation 12.5 Architecture & Process
Manufacturing and design details
The Intel Data Center GPU Max 1350 is built on Intel's Generation 12.5 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the Data Center GPU Max 1350 will perform in GPU benchmarks compared to previous generations.
Power & Thermal
TDP and power requirements
Power specifications for the Intel Data Center GPU Max 1350 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the Data Center GPU Max 1350 to maintain boost clocks without throttling.
Data Center GPU Max 1350 by Intel Physical & Connectivity
Dimensions and outputs
Physical dimensions of the Intel Data Center GPU Max 1350 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
Intel API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the Intel Data Center GPU Max 1350. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
Data Center GPU Max 1350 Product Information
Release and pricing details
The Intel Data Center GPU Max 1350 is manufactured by Intel as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the Data Center GPU Max 1350 by Intel represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
About Intel Data Center GPU Max 1350
The Intel Data Center GPU Max 1350 is listed as an active accelerator released on 2023-01-09, built around the Ponte Vecchio chip on Intel’s Generation 12.5 architecture and 10 nm process. The FACT PACK contains no entries in its benchmarks array, an average benchmark score of 0, a percentileVsAllGpus rank of 50, and an empty nearestRivals list. That makes this an unusual database entry: a card with rich specifications but no measured results against which to judge it. This analysis therefore uses the listed specifications as the primary evidence, while noting where benchmark data would normally anchor conclusions.
Benchmark Performance
The benchmark section of this entry is empty. The average benchmark score is 0, and no individual benchmark results are supplied. The percentileVsAllGpus value of 50 would place it at the midpoint of the database, but with a zero average score and no supporting runs, that percentile cannot be read as a measured performance signal. The database offers no deltaPct figures because the nearestRivals list is empty. In other words, there is no percentage lead or deficit against any named competitor in this record.
What the entry does provide is raw specification data. The GPU is rated for 44.44 TFLOPS FP32 and 44.44 TFLOPS FP16, with the FP16 figure explicitly listed as 1:1. The shading unit count is 14,336, and the texture mapping unit count is 896. Texture rate is listed at 1,388.8 GTexel/s. Ray tracing cores are present at 112. The base clock is 750 MHz, and the boost clock is 1550 MHz. The pixel rate is listed as 0 MPixel/s, and the ROP count is 0, which strongly signals that this chip is not being evaluated as a conventional rasterized rendering product.
These numbers are throughput ceilings, not workload outcomes. A 44.44 TFLOPS FP32 figure indicates a large amount of compute hardware, and an identical FP16 figure suggests that mixed-precision work does not suffer a listed rate penalty. But without benchmark scores, the page cannot confirm how those rates translate into real applications. The empty benchmarks array is also a limitation for comparing the card to anything else. The data shows raw capability, not demonstrated performance.
Memory Subsystem
The memory configuration is one of the most distinctive parts of this entry. The Intel Data Center GPU Max 1350 is listed with 96 GB of HBM2e memory on an 8192-bit bus, delivering 2.46 TB/s of bandwidth. The memory clock is 1200 MHz, with an effective data rate of 2.4 Gbps. These numbers describe a memory system built for very large, very bandwidth-hungry workloads.
For high-resolution work, the 96 GB capacity is the first important number. Large models, dense high-resolution datasets, or large frame buffers can reside on the accelerator without spilling to host memory, assuming they fit within 96 GB. The 2.46 TB/s bandwidth is the second important number. That bandwidth allows the shading units and any memory-heavy kernels to be fed at a high rate across the 8192-bit bus. The width of the bus is itself a meaningful specification: 8192 bit is an extremely wide memory path, and HBM2e is the listed memory type.
The entry also lists 896 TMUs and a texture rate of 1,388.8 GTexel/s. However, ROPs are 0, and the pixel rate is 0 MPixel/s. The implication is that this memory subsystem is not oriented toward pixel-producing rasterization but toward compute workloads that need massive capacity and bandwidth. High resolution in this context is less about monitor resolutions and more about high-resolution data arrays, simulation grids, or inference tensors. Without benchmark scores, the actual scaling behavior at various resolutions is not quantified, but the specification sheet is clearly memory-first.
Who Should Consider It
The displayOutputs field is blunt: “No outputs.” That makes this card unsuitable for any direct-to-display use case, including desktop gaming, conventional workstation display, or any scenario that requires a video output at a chosen resolution and refresh rate. The 0 MPixel/s pixel rate and 0 ROPs reinforce that it is not a rendering card in the traditional sense.
The data instead points toward data-center compute environments. A system with a 450 W TDP and a suggested PSU of 850 W is not a typical desktop build. The slot width is listed as OAM Module, again indicating a data-center accelerator form factor rather than a consumer graphics card. Organizations running workloads that require 96 GB of HBM2e memory, 2.46 TB/s of bandwidth, and 44.44 TFLOPS of FP32 or FP16 compute are the plausible audience.
In terms of settings-based recommendations, there are none to make for games or interactive graphics, because there is no display path. The relevant “settings” are workload parameters such as dataset size, batch size, or grid resolution. On that axis, the 96 GB capacity provides a hard boundary for what can remain on-card. The 2.46 TB/s bandwidth then determines how quickly data can move across that large memory system. This is a compute accelerator for high-capacity, high-bandwidth tasks, not a product for resolution-driven consumer graphics.
Power and Cooling
The TDP is listed as 450 W, and the suggested PSU is 850 W. Those are the two primary power figures in the entry. The slot width is OAM Module, which distinguishes it from standard add-in cards. The bus interface is PCIe 5.0 x16.
Power connector details are not listed. The powerConnectors field is null, so connector count, type, and pinout cannot be stated from the FACT PACK. The only system-level guidance is the suggested PSU of 850 W. Cooling details are likewise not specified. The data does not include dimensions or a cooler type, so the physical thermal solution is not documented. What is known is that the card carries a 450 W TDP, meaning the power delivery design must accommodate that level of draw. Because the listed slot width is OAM Module, installation appears to target OAM-style chassis rather than ordinary PCIe slots, even though the bus interface itself is PCIe 5.0 x16.
How It Compares
The nearestRivals array in the FACT PACK is empty. There are no rival names, no rival scores, and no deltaPct values. Consequently, no percentage comparisons can be written for the Intel Data Center GPU Max 1350 against any specific product. The entry simply does not contain the relational data needed to say that this card is ahead of or behind another card by a measured margin.
The only positional data present is the percentileVsAllGpus value of 50, alongside an avgBenchmarkScore of 0. With no benchmark runs behind that average, the percentile is not a trustworthy comparison metric. The predecessor field is null, meaning no direct predecessor is listed. The successor field names H3C Graphics, but that is a successor relationship, not a nearest-rival comparison, and no benchmark data accompanies it. In the absence of nearestRivals information, this database entry cannot support any relative competitive positioning.
FAQ
Q: What is the memory configuration of the Intel Data Center GPU Max 1350?
A: It has 96 GB of HBM2e memory on an 8192-bit bus with 2.46 TB/s bandwidth. The memory clock is 1200 MHz with a 2.4 Gbps effective data rate.
Q: Does this card have display outputs?
A: No. The displayOutputs field is “No outputs,” and the pixel rate is 0 MPixel/s with 0 ROPs.
Q: What power supply is recommended?
A: The TDP is 450 W, and the suggested PSU is 850 W. Power connector specifics are not listed in the data.
Q: Does it support ray tracing?
A: It lists 112 RT cores, so ray tracing hardware is present. The tensorCores field is null, so no tensor core count is provided.
Q: Which APIs are supported?
A: DirectX 12 (12_1) and OpenGL 4.6 are listed. Vulkan support is not listed.
Q: What process and die data is listed?
A: The chip is built on Intel’s 10 nm process, with 100,000 million transistors and a die size of 1280 mm², for a transistor density of 78.1M / mm².
Ray Tracing and Feature Set
The feature set includes 14,336 shading units, 896 texture mapping units, and 112 ray tracing cores. There are 0 ROPs, and the pixel rate is 0 MPixel/s, so the feature set is compute-oriented rather than rasterization-oriented. The FP32 compute rate is 44.44 TFLOPS, and the FP16 rate is also 44.44 TFLOPS, listed as 1:1. That 1:1 designation means both precision modes appear at the same rate in the data.
The architecture is Generation 12.5, based on the Ponte Vecchio chip. The card is built by Intel on a 10 nm process, with 100,000 million transistors on a 1280 mm² die. API support includes DirectX 12 (12_1) and OpenGL 4.6, while Vulkan is not listed. The tensorCores field is null, so AI-oriented tensor throughput cannot be derived from this entry.
The 112 RT cores show that ray tracing acceleration is a designed-in feature, but with no benchmark scores, the data cannot describe how fast that ray tracing is. Because the card has no display outputs, any ray tracing work would occur in off-screen or compute contexts rather than through a rendered display path. The memory side of the feature set remains the same: 96 GB HBM2e, 8192-bit bus, 2.46 TB/s bandwidth, and a 1200 MHz memory clock with a 2.4 Gbps effective data rate. The bus interface is PCIe 5.0 x16. Together, these specifications define a data-center accelerator with wide memory, high compute rates, and ray tracing hardware, but the database entry has not yet recorded the benchmark evidence needed to rank it.
Detailed benchmark scores and charts for the Intel Data Center GPU Max 1350 are below.
Benchmark Scores
No benchmark data available for this GPU.
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