Intel Arc Graphics 112EU Mobile vs Intel Arc Pro B70 Comparison

Intel Arc Graphics 112EU Mobile and Intel Arc Pro B70 represent two entirely different approaches to GPU design from the same manufacturer. The first is an integrated graphics processor (IGP) built for mobility, while the second is a discrete, dual-slot add-in card aimed at professional workloads. The data shows they share a vendor and a Vulkan API version, but almost nothing else in terms of architecture, memory, or performance class. This analysis compares the recorded specifications to clarify where each part fits.

Where Each One Wins

The Intel Arc Graphics 112EU Mobile wins in power efficiency and physical integration. It carries a 65 W TDP, uses system-shared memory, and is classified as an IGP with a Ring Bus interface. Its base clock of 300 MHz and boost clock of 2200 MHz are modest, but they are paired with a 10 nm process node from Intel’s own foundry. The chip is built on the Meteor Lake platform under the Xe-LPG architecture, which is a prior generation compared to the Battlemage-based Pro B70. For portable devices, the 112EU Mobile is the only viable option in this comparison because the Pro B70 is a 267 mm long, dual-slot card requiring a 550 W suggested power supply and a PCIe 5.0 x16 connection.

The Intel Arc Pro B70 wins in every raw performance category recorded. It delivers 22.94 TFLOPS of FP32 compute versus 3.942 TFLOPS for the mobile part, a difference of roughly 5.8 times. Its pixel rate is 358.4 GPixel/s against 52.80 GPixel/s, and its texture rate is 716.8 GTexel/s against 123.2 GTexel/s. The Pro B70 has 4096 shading units, 256 texture mapping units, and 128 ROPs, while the mobile IGP has 896 shading units, 56 TMUs, and 24 ROPs. The discrete card also includes 32 ray tracing cores, a feature entirely absent from the mobile chip. Memory is another decisive category: the Pro B70 has 32 GB of GDDR6 on a 256-bit bus with 608.0 GB/s of bandwidth, whereas the mobile part shares system memory with bandwidth classified as system dependent.

The Pro B70 also wins in clock stability and API support. Its base clock of 2280 MHz is higher than the mobile part’s boost clock of 2200 MHz, and its boost reaches 2800 MHz. The Pro B70 supports DirectX 12 Ultimate (12_2), while the mobile chip only reaches DirectX 12 (12_1). Both support OpenGL 4.6 and Vulkan 1.4, so those are ties. The Pro B70’s display outputs are fixed at 1x HDMI 2.1a and 3x DisplayPort 2.1, while the mobile IGP’s outputs are listed as portable device dependent.

The Verdict

The recorded data points to two distinct purchase decisions. The Intel Arc Graphics 112EU Mobile is the only choice for a compact, integrated system where power draw and physical footprint are the primary constraints. Its 65 W TDP, IGP slot width, and system-shared memory make it compatible with a laptop or small form-factor motherboard without additional power connectors. The chip’s 10 nm process and Xe-LPG architecture indicate it is designed for efficiency rather than maximum throughput. The lack of dedicated memory means its performance scales with the host system’s RAM, so its 3.942 TFLOPS FP32 figure is a ceiling that may not be reached in all configurations.

The Intel Arc Pro B70 is the choice for users who need the highest recorded compute and memory performance in this comparison. Its 22.94 TFLOPS FP32, 608.0 GB/s bandwidth, and 32 GB GDDR6 frame buffer are professional-class specifications. The 32 ray tracing cores and DirectX 12 Ultimate support position it for workloads that use hardware-accelerated ray tracing or require the latest graphics API features. The card’s 230 W TDP, 1x 8-pin power connector, and 550 W suggested power supply requirement indicate it is meant for a desktop workstation with adequate cooling and power delivery. Its launch MSRP is 949 USD.

The percentile ranking is identical for both parts at 50, meaning the database places them at the median of all GPUs. However, this is a statistical artifact of the absence of benchmark scores in the record, not an indication of equivalent performance. The specification gaps are too large to treat these as competitors. The mobile IGP is a low-power embedded solution; the Pro B70 is a high-end discrete accelerator. The data suggests no scenario where a user would choose between them on performance alone, because the Pro B70 is superior in every measured compute, memory, and feature category.

Head-to-Head Benchmarks

The head-to-head benchmark table contains no entries, so the comparison relies entirely on the specification-level metrics. The largest win for the Pro B70 is FP32 compute performance. It records 22.94 TFLOPS versus 3.942 TFLOPS for the mobile IGP, a factor of approximately 5.8. This gap indicates that the Pro B70 can handle parallel compute workloads at a scale the mobile chip cannot approach. FP16 performance shows a similar pattern: 45.88 TFLOPS for the Pro B70 versus 7.885 TFLOPS for the mobile part, a factor of about 5.8 as well, given the 2:1 ratio noted in both entries.

Memory bandwidth is another overwhelming difference. The Pro B70’s 608.0 GB/s comes from a 256-bit bus connected to 32 GB of GDDR6 at 2375 MHz with 19 Gbps effective speed. The mobile IGP has no dedicated memory, relying on system shared memory with bandwidth described as system dependent. In practical terms, the Pro B70 can feed its 4096 shading units at a rate that the mobile IGP cannot match, even if the host system uses fast DDR5 RAM.

Pixel and texture rates reinforce the same conclusion. The Pro B70 outputs 358.4 GPixel/s and 716.8 GTexel/s. The mobile IGP outputs 52.80 GPixel/s and 123.2 GTexel/s. These rates are direct functions of the ROP and TMU counts, where the Pro B70 has 128 ROPs and 256 TMUs against 24 ROPs and 56 TMUs. The Pro B70’s boost clock of 2800 MHz is also 600 MHz higher than the mobile part’s 2200 MHz boost, which compounds the advantage in every per-clock operation.

The clock speeds themselves tell a story about design intent. The mobile IGP has a base clock of 300 MHz, which is extremely low, suggesting aggressive power management for idle states. Its boost of 2200 MHz is respectable for an integrated part, but it must contend with thermal and power limits inside a portable chassis. The Pro B70 starts at 2280 MHz base and boosts to 2800 MHz, which is higher than the mobile part’s maximum at all times. The process node difference, 10 nm for the mobile IGP versus 5 nm for the Pro B70, also explains why the discrete card can sustain higher clocks despite a 230 W TDP.

FAQ

Q: Which GPU has more shading units?

A: The Intel Arc Pro B70 has 4096 shading units, while the Intel Arc Graphics 112EU Mobile has 896 shading units.

Q: What is the memory configuration of each part?

A: The Intel Arc Pro B70 has 32 GB of GDDR6 on a 256-bit bus with 608.0 GB/s bandwidth. The Intel Arc Graphics 112EU Mobile uses system shared memory with system dependent bandwidth.

Q: Do both GPUs support the same DirectX version?

A: No. The Intel Arc Pro B70 supports DirectX 12 Ultimate (12_2), while the Intel Arc Graphics 112EU Mobile supports DirectX 12 (12_1). Both support OpenGL 4.6 and Vulkan 1.4.

Q: What is the power consumption difference?

A: The Intel Arc Pro B70 has a 230 W TDP and requires a 550 W suggested power supply. The Intel Arc Graphics 112EU Mobile has a 65 W TDP and uses an IGP slot width with no separate power connector.

Q: Does the mobile IGP have ray tracing cores?

A: No. The Intel Arc Graphics 112EU Mobile has no ray tracing cores listed. The Intel Arc Pro B70 has 32 ray tracing cores.

Q: What are the release dates for these GPUs?

A: The Intel Arc Graphics 112EU Mobile was released on 2023-12-13. The Intel Arc Pro B70 was released on 2026-03-25.

Architecture Differences

The two GPUs come from different architectural families. The Intel Arc Graphics 112EU Mobile uses Xe-LPG architecture on a chip named Meteor Lake, manufactured on a 10 nm process at Intel’s own foundry. The Intel Arc Pro B70 uses Xe2-HPG architecture on a chip named BMG-G31, manufactured on a 5 nm process at TSMC. The Pro B70’s die size is recorded as 368 mm², while the mobile chip has no die size listed. The transistor count for the Pro B70 is listed as unknown, and the mobile chip has no transistor count at all.

The core configuration differences are substantial. The mobile IGP has 896 shading units, 56 TMUs, and 24 ROPs, with no ray tracing cores. The Pro B70 has 4096 shading units, 256 TMUs, 128 ROPs, and 32 ray tracing cores. Neither part lists tensor cores. The generation labels confirm the architectural gap: the mobile chip is from Arc Graphics-M (Meteor Lake), while the Pro B70 is from Battlemage (Pro Series). The Pro B70 is the newer design, with a release date in 2026 compared to the mobile part’s 2023 release.

The bus interface also differs fundamentally. The mobile IGP uses a Ring Bus, which is typical for integrated graphics sharing the die with CPU cores. The Pro B70 uses PCIe 5.0 x16, a high-bandwidth external interface for discrete cards. This difference dictates where each part can be installed: the mobile IGP is soldered into a portable device, while the Pro B70 fits into a desktop expansion slot.

Specification Differences

The two parts differ in nearly every measurable specification. The process node is 10 nm for the mobile IGP and 5 nm for the Pro B70, with different foundries (Intel versus TSMC). The base clock is 300 MHz versus 2280 MHz, and the boost clock is 2200 MHz versus 2800 MHz. The memory system is completely different: system shared for the mobile IGP versus 32 GB GDDR6 with a 256-bit bus and 608.0 GB/s bandwidth for the Pro B70. The memory clock is listed as system shared for the mobile part, while the Pro B70 runs at 2375 MHz with 19 Gbps effective.

The compute rates scale with the core counts. FP32 performance is 3.942 TFLOPS for the mobile IGP and 22.94 TFLOPS for the Pro B70. FP16 performance is 7.885 TFLOPS versus 45.88 TFLOPS, both with a 2:1 ratio. Pixel rate is 52.80 GPixel/s versus 358.4 GPixel/s, and texture rate is 123.2 GTexel/s versus 716.8 GTexel/s. The TDP is 65 W versus 230 W. The slot width is IGP for the mobile part and dual-slot for the Pro B70. The power connector is absent for the mobile IGP and 1x 8-pin for the Pro B70. The suggested PSU is not listed for the mobile part and is 550 W for the Pro B70.

The physical dimensions reflect the discrete versus integrated split. The Pro B70 is 267 mm long, 110 mm high, and 39 mm wide. The mobile IGP has no dimensions listed, consistent with being an integrated component. Display outputs are portable device dependent for the mobile IGP and 1x HDMI 2.1a plus 3x DisplayPort 2.1 for the Pro B70. The production status is active for the mobile IGP and not listed for the Pro B70. The release dates are 2023-12-13 and 2026-03-25, respectively. The Pro B70 has a launch MSRP of 949 USD, while the mobile IGP has no MSRP listed.