AMD Radeon Instinct MI308X vs Lisuan Tech LX MAX Comparison

AMD Radeon Instinct MI308X and Lisuan Tech LX MAX occupy different corners of the GPU landscape, separated by architecture, memory design, and intended workload. The database records no direct benchmark scores for either part, so the comparison relies on their listed specifications, memory subsystems, and compute capabilities. The MI308X targets data center acceleration with massive HBM3 capacity, while the LX MAX is a conventional dual-slot card with GDDR6 and display outputs.

FAQ

Q: What are the memory capacities of the two cards?

A: The AMD Radeon Instinct MI308X carries 192 GB of HBM3 across an 8192-bit bus, delivering 10.3 TB/s of bandwidth. The Lisuan Tech LX MAX has 12 GB of GDDR6 on a 192-bit bus, providing 432.0 GB/s.

Q: Which card has higher FP32 compute throughput?

A: The MI308X reaches 81.72 TFLOPS in FP32, while the LX MAX delivers 24.58 TFLOPS. That puts the AMD part at approximately 3.3 times the FP32 rate of the Lisuan card.

Q: What process nodes do the two GPUs use?

A: The MI308X uses a 5 nm process at TSMC, with a die size of 1017 mm² and 153,000 million transistors. The LX MAX uses a 6 nm process at TSMC, with die size and transistor count not recorded in the database.

Q: Does either card support display outputs?

A: The MI308X has no display outputs, consistent with its OAM Module form factor. The LX MAX includes 4x DisplayPort 1.4a outputs, making it suitable for direct display connection.

Q: What is the power consumption difference?

A: The MI308X has a TDP of 750 W and suggests a 1150 W power supply. The LX MAX has a TDP of 225 W and suggests a 550 W power supply.

Q: Which card has a newer release date?

A: The MI308X was released on December 5, 2023. The LX MAX has a release date of March 16, 2026, making it the more recent product.

Architecture Differences

The MI308X uses AMD’s CDNA 3.0 architecture, built on the Aqua Vanjaram chip. This is a compute-focused design with a 5 nm process from TSMC, integrating 153,000 million transistors into a 1017 mm² die. The transistor density works out to 150.4 million per square millimeter. The architecture is part of the Radeon Instinct (MIx) generation, and its predecessor is listed as FirePro Data Center. Notably, the MI308X has zero ROPs and a pixel rate of 0 MPixel/s, reflecting a pure compute accelerator with no rasterization pipeline. Its texture rate is 2,553.6 GTexel/s, and it has 19,456 shading units with 1,216 TMUs. The memory clock runs at 2525 MHz, translating to 10.1 Gbps effective, paired with HBM3 memory. The card uses an OAM Module slot width, has no power connectors (power is delivered through the module interface), and rides on PCIe 5.0 x16.

The Lisuan Tech LX MAX uses the TrueGPU architecture on the 7G106 chip, part of the 7G100 generation. It is fabricated on TSMC’s 6 nm process, though die size and transistor counts are not recorded. This is a more traditional graphics card design: it has 96 ROPs, a pixel rate of 192.0 GPixel/s, and a texture rate of 384.0 GTexel/s. The LX MAX includes 6,144 shading units and 192 TMUs. Its memory operates at 2250 MHz with 18 Gbps effective GDDR6. The card is dual-slot, uses a single 16-pin power connector, and runs on PCIe 4.0 x16. It supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.3, and it has physical dimensions of 248 mm length, 118 mm height, and 48 mm width.

The architectural split is stark. The MI308X abandons display and raster functions entirely, maximizing memory bandwidth and FP32 throughput for compute. The LX MAX retains full graphics API support and display outputs, positioning it as a rendering-oriented GPU. The process node difference (5 nm versus 6 nm) gives the MI308X a density advantage, but the LX MAX compensates with a simpler, lower-power design.

Head-to-Head Benchmarks

The database lists no direct benchmark scores for either card, and the head-to-head benchmark array is empty. However, the specification sheet provides clear numerical deltas that indicate relative performance in compute workloads.

In FP32, the MI308X delivers 81.72 TFLOPS versus 24.58 TFLOPS for the LX MAX. That is a 3.3x advantage for the AMD part, a massive gap for any general compute task such as scientific simulation or AI inference. In FP16, the MI308X reaches 653.7 TFLOPS using an 8:1 ratio, while the LX MAX hits 49.15 TFLOPS with a 2:1 ratio. The MI308X is 13.3x faster in FP16, but the ratio difference matters: the MI308X’s FP16 rate is achieved through specialized compute paths, whereas the LX MAX’s FP16 is a straightforward doubling of its FP32 rate. For workloads that rely on FP16 tensor operations, the MI308X’s advantage is overwhelming.

Memory bandwidth is another decisive differentiator. The MI308X’s 10.3 TB/s exceeds the LX MAX’s 432.0 GB/s by a factor of 23.8. This bandwidth gap matters for large datasets, deep learning training, and in-memory analytics, where the GPU must feed data to compute units continuously. The LX MAX’s 12 GB capacity is a fraction of the MI308X’s 192 GB, so the AMD card can hold entire model weights or datasets on-chip, avoiding PCIe transfers.

Texture rate favors the MI308X as well: 2,553.6 GTexel/s versus 384.0 GTexel/s, a 6.7x difference. Pixel rate is the one metric where the LX MAX leads, at 192.0 GPixel/s versus 0 MPixel/s for the MI308X. This reflects the LX MAX’s rasterization hardware; the MI308X has no pixel output capability. For traditional graphics rendering, the LX MAX is the only viable option, but for compute, the MI308X dominates every measurable metric.

The MI308X’s transistor count of 153,000 million dwarfs the LX MAX’s unlisted count, and its die size of 1017 mm² is among the largest in the database. The LX MAX’s 6 nm process suggests a smaller, more efficient die, but without recorded dimensions, the comparison remains qualitative. The MI308X’s 750 W TDP versus the LX MAX’s 225 W TDP indicates the AMD card consumes 3.3x more power, which aligns with its 3.3x FP32 advantage. Power efficiency in FP32 per watt is roughly equal, but the MI308X’s memory bandwidth advantage comes at a significant power cost.

Specification Differences

| Field | AMD Radeon Instinct MI308X | Lisuan Tech LX MAX |

|-------|----------------------------|---------------------|

| Architecture | CDNA 3.0 | TrueGPU |

| Chip | Aqua Vanjaram | 7G106 |

| Generation | Radeon Instinct (MIx) | 7G100 |

| Process Node | 5 nm | 6 nm |

| Transistors | 153,000 million | unknown |

| Die Size | 1017 mm² | unknown |

| Transistor Density | 150.4M / mm² | null |

| Base Clock | 1000 MHz | null |

| Boost Clock | 2100 MHz | null |

| Memory Clock | 2525 MHz, 10.1 Gbps effective | 2250 MHz, 18 Gbps effective |

| Memory Size | 192 GB | 12 GB |

| Memory Type | HBM3 | GDDR6 |

| Memory Bus Width | 8192 bit | 192 bit |

| Memory Bandwidth | 10.3 TB/s | 432.0 GB/s |

| Shading Units | 19456 | 6144 |

| TMUs | 1216 | 192 |

| ROPs | 0 | 96 |

| Pixel Rate | 0 MPixel/s | 192.0 GPixel/s |

| Texture Rate | 2,553.6 GTexel/s | 384.0 GTexel/s |

| FP32 | 81.72 TFLOPS | 24.58 TFLOPS |

| FP16 | 653.7 TFLOPS (8:1) | 49.15 TFLOPS (2:1) |

| TDP | 750 W | 225 W |

| Slot Width | OAM Module | Dual-slot |

| Power Connectors | None | 1x 16-pin |

| Suggested PSU | 1150 W | 550 W |

| Bus Interface | PCIe 5.0 x16 | PCIe 4.0 x16 |

| Display Outputs | No outputs | 4x DisplayPort 1.4a |

| DirectX | null | 12 Ultimate (12_2) |

| OpenGL | null | 4.6 |

| Vulkan | null | 1.3 |

| Dimensions | null | 248 mm, 118 mm, 48 mm |

| Production Status | null | Active |

| Release Date | 2023-12-05 | 2026-03-16 |

| Predecessor | FirePro Data Center | null |

The two cards differ in every major category. The MI308X has 3.2x more shading units, 6.3x more TMUs, 16x more memory capacity, and 23.8x more memory bandwidth. The LX MAX has 96 ROPs where the MI308X has none, and it supports three graphics APIs that are null on the AMD card. The MI308X uses PCIe 5.0, the LX MAX uses PCIe 4.0. The MI308X has no power connectors because it is an OAM module, while the LX MAX uses a standard 16-pin connector. The MI308X’s release date is 2023, the LX MAX’s is 2026. The LX MAX is listed as Active in production status; the MI308X has no status recorded.

The Verdict

The data indicates the AMD Radeon Instinct MI308X is a compute accelerator with no display or raster capabilities. Its 192 GB HBM3 pool, 10.3 TB/s bandwidth, and 81.72 TFLOPS FP32 make it suitable for large-scale data center workloads such as training neural networks, processing massive datasets, or running scientific simulations that require sustained memory throughput. The 653.7 TFLOPS FP16 figure, achieved through an 8:1 ratio, suggests specialized matrix operations that far exceed the LX MAX’s 49.15 TFLOPS. The 750 W TDP and OAM form factor indicate a server-oriented installation, likely in multi-GPU racks where the 1150 W suggested PSU is shared across the system.

The Lisuan Tech LX MAX, by contrast, is a conventional graphics card with active production status, display outputs, and full API support. Its 12 GB GDDR6 and 432.0 GB/s bandwidth are modest by comparison, but its 96 ROPs and 192.0 GPixel/s pixel rate enable real rendering work. The 225 W TDP and dual-slot design allow integration into standard desktop systems with a 550 W power supply. The 6 nm process and 2026 release date suggest a newer, more efficient design, but the database does not record its die size or transistor count to confirm density improvements.

For compute-heavy tasks, the MI308X is the clear choice based on every recorded metric: FP32, FP16, memory capacity, bandwidth, texture rate, and shading unit count. The LX MAX cannot approach the MI308X’s throughput in any compute dimension. For rendering or any workload requiring display output, the MI308X is unusable due to zero ROPs and no outputs, leaving the LX MAX as the only functional option. The LX MAX’s DirectX 12 Ultimate and Vulkan 1.3 support make it appropriate for gaming or workstation graphics, though the database provides no benchmark scores to quantify its real-world performance.

The power envelope difference is proportional to the compute gap. The MI308X uses 3.3x the power of the LX MAX and provides 3.3x the FP32 throughput. In FP16, the MI308X’s 8:1 ratio gives it a 13.3x advantage, but this comes at the cost of a much higher TDP. The LX MAX’s 2:1 FP16 ratio is typical of consumer GPUs, where FP16 is used for compatible workloads but not optimized to the same degree as a dedicated compute chip.

The release dates position the MI308X as a 2023 product and the LX MAX as a 2026 product. The newer part uses a slightly larger process node (6 nm versus 5 nm), which may indicate a different design philosophy: the LX MAX prioritizes power efficiency and compatibility, while the MI308X prioritizes raw compute and memory capacity. The MI308X’s predecessor is FirePro Data Center, signaling AMD’s long line of server GPUs, while the LX MAX has no recorded predecessor.

The verdict from the recorded data is that these are complementary products, not competitors. The MI308X exists for high-performance computing and AI training where memory bandwidth and capacity are paramount. The LX MAX exists for graphics rendering and display-connected workloads where rasterization and API support are required. Neither card can substitute for the other in its respective domain. The MI308X’s 0 MPixel/s pixel rate disqualifies it from any graphics task, and the LX MAX’s 12 GB memory and 432.0 GB/s bandwidth would bottleneck compute workloads that the MI308X handles with ease. The database shows no benchmark scores for either, so the comparison rests entirely on specifications, but those specifications are unambiguous in their intent.