RADEON

AMD Radeon Instinct MI308X

AMD graphics card specifications and benchmark scores

192 GB
VRAM
2100
MHz Boost
750W
TDP
8192
Bus Width
MCM Design

At a Glance

AMD
VRAM 192 GB
Boost Clock 2,100 MHz
Shaders 19,456
Bus Width 8192-bit
TDP 750W
Memory Type HBM3
Architecture CDNA 3.0
nm
Process 5 nm
Released Dec 2023

AMD Radeon Instinct MI308X Specifications

Radeon Instinct MI308X GPU Core

Shader units and compute resources

The AMD Radeon Instinct MI308X GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
19,456
Shaders
19,456
TMUs
1,216
Compute Units
304

Instinct MI308X Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the Radeon Instinct MI308X's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The Radeon Instinct MI308X by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

Base Clock
1000 MHz
Base Clock
1,000 MHz
Boost Clock
2100 MHz
Boost Clock
2,100 MHz
Memory Clock
2525 MHz 10.1 Gbps effective
GDDR GDDR 6X 6X

AMD's Radeon Instinct MI308X Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The Radeon Instinct MI308X's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
192 GB
VRAM
196,608 MB
Memory Type
HBM3
VRAM Type
HBM3
Memory Bus
8192 bit
Bus Width
8192-bit
Bandwidth
10.3 TB/s

Radeon Instinct MI308X by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the Instinct MI308X, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
16 KB (per CU)
L2 Cache
16 MB
Infinity Cache
256 MB

Instinct MI308X Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD Radeon Instinct MI308X against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
81.72 TFLOPS
FP64 (Double)
81.72 TFLOPS (1:1)
FP16 (Half)
653.7 TFLOPS (8:1)
Pixel Rate
0 MPixel/s
Texture Rate
2,553.6 GTexel/s

CDNA 3.0 Architecture & Process

Manufacturing and design details

The AMD Radeon Instinct MI308X is built on AMD's CDNA 3.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the Instinct MI308X will perform in GPU benchmarks compared to previous generations.

Architecture
CDNA 3.0
GPU Name
Aqua Vanjaram
Process Node
5 nm
Foundry
TSMC
Transistors
153,000 million
Die Size
1017 mm²
Density
150.4M / mm²

AMD's Radeon Instinct MI308X Power & Thermal

TDP and power requirements

Power specifications for the AMD Radeon Instinct MI308X determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the Radeon Instinct MI308X to maintain boost clocks without throttling.

TDP
750 W
TDP
750W
Power Connectors
None
Suggested PSU
1150 W

Radeon Instinct MI308X by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD Radeon Instinct MI308X are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
OAM Module
Bus Interface
PCIe 5.0 x16
Display Outputs
No outputs
Display Outputs
No outputs

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD Radeon Instinct MI308X. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

OpenCL
3.0

Radeon Instinct MI308X Product Information

Release and pricing details

The AMD Radeon Instinct MI308X is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the Radeon Instinct MI308X by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
Dec 2023
Predecessor
FirePro Data Center

Radeon Instinct MI308X Benchmark Scores

No benchmark data available for this GPU.

About AMD Radeon Instinct MI308X

The AMD Radeon Instinct MI308X is a compute accelerator from AMD's Radeon Instinct (MIx) generation, built on the CDNA 3.0 architecture with the Aqua Vanjaram chip. It is manufactured by TSMC at 5 nm, contains 153,000 million transistors on a 1017 mm² die, and has a transistor density of 150.4M / mm². The release date is 2023-12-05. The record lists a 750 W TDP, a 1150 W suggested PSU, an OAM Module slot width, no separate power connectors, and no display outputs. Clocks are 1000 MHz base and 2100 MHz boost. The benchmarks array is empty, the avgBenchmarkScore is 0, and the percentileVsAllGpus is 50.

Who Should Consider It

The MI308X is an unusual entry in the database because it combines a large compute configuration with no raster output stage. The ROP count is 0, the pixel rate is 0 MPixel/s, and the display outputs field is "No outputs." Any user who needs to drive a display should not select this part; the record offers no output path. For compute deployments, the relevant resources are 19,456 shading units, 1,216 TMUs, a texture rate of 2,553.6 GTexel/s, and FP32/FP16 rates of 81.72 TFLOPS and 653.7 TFLOPS (8:1). These are the fields that separate the MI308X from a normal rasterized graphics card.

Because no game or synthetic benchmarks are recorded, the data cannot support resolution or settings recommendations. The benchmarks array is empty, and the average score is 0. That does not mean the module is slow; it means no measured score exists in this record. The percentile field of 50 is the only relational marker, but it is tied to no nonzero average score. Therefore, the decision to consider the MI308X should rest on the memory and compute envelope: 192 GB of HBM3, an 8192-bit bus, 10.3 TB/s bandwidth, and the 81.72 TFLOPS FP32 rate. A workload that can fill or feed that memory system is the intended use case. A workload that needs a monitor or rasterized output is not.

Power and Cooling

The MI308X is specified at 750 W TDP. The suggested PSU is 1150 W. The slot width field is OAM Module, and the power connectors field is None. No separate power connector is recorded; the powerConnectors field simply states None. The OAM Module form factor is the listed mounting specification, and the bus interface is PCIe 5.0 x16.

Cooling is not described with a specific cooler. The FACT PACK does not include heatsink dimensions, fan counts, or liquid cooling information. The thermal planning figures are the 750 W TDP and the 1150 W suggested PSU. An OAM Module slot width implies a standardized mounting envelope, but the exact thermal solution is left unspecified. For system planning, the 1150 W PSU recommendation is the single power provisioning number that must be met.

How It Compares

The nearestRivals array in the FACT PACK is empty. There are no rival names, no rival scores, and no deltaPct values to cite. The only comparative data in the record are percentileVsAllGpus (50) and avgBenchmarkScore (0). A percentile of 50 places the MI308X at the median position of all GPUs in the database, but since the benchmarks list is empty and the average score is 0, that percentile is not backed by a specific measured result.

The predecessor field lists FirePro Data Center, which is a lineage label rather than a performance comparison. No successor is recorded. Without nearest-rival entries, any quantitative comparison would be unsupported. The correct analytical position is that the database currently holds no comparison points for the MI308X. When nearestRivals entries are added, their scores and deltaPct values will provide the required comparative basis. Until then, no "ahead of" or "behind" statements can be made from the FACT PACK.

FAQ

Q: What memory configuration does the MI308X have?

A: The FACT PACK lists 192 GB of HBM3 on an 8192-bit bus, with a memory clock of 2525 MHz (10.1 Gbps effective) and a bandwidth of 10.3 TB/s.

Q: What power supply is recommended?

A: The suggested PSU is 1150 W. The TDP is 750 W, and the power connectors field is None.

Q: Does the MI308X have display outputs?

A: No. The display outputs field is "No outputs", the ROP count is 0, and the pixel rate is 0 MPixel/s.

Q: What are the compute throughput numbers?

A: The FP32 rate is 81.72 TFLOPS. The FP16 rate is 653.7 TFLOPS (8:1). The texture rate is 2,553.6 GTexel/s.

Q: What bus interface is used?

A: PCIe 5.0 x16.

Q: What architecture and process are recorded?

A: The MI308X uses the CDNA 3.0 architecture on TSMC's 5 nm process, with the Aqua Vanjaram chip, 153,000 million transistors, and a die size of 1017 mm².

Ray Tracing and Feature Set

The FACT PACK does not include a ray tracing core count. The rtCores field is null. The tensorCores field is also null. For API support, the DirectX, OpenGL, and Vulkan entries are all null. As a result, no ray tracing capability can be assessed from this record, and no API compatibility list can be generated. These null fields mean the information was not populated; they are not measured zeros in the performance sense.

The feature set that is present includes the CDNA 3.0 architecture, 19,456 shading units, 1,216 TMUs, and a texture rate of 2,553.6 GTexel/s. The pixel rate of 0 MPixel/s and the ROP count of 0 reinforce the product's compute orientation. The compute rates are 81.72 TFLOPS FP32 and 653.7 TFLOPS FP16 (8:1). No tensor core count is available, so any tensor-oriented assessment must rely on the FP16 figure rather than a dedicated tensor specification. Similarly, ray tracing performance cannot be derived from the null rtCores field.

Memory Subsystem

Memory is a defining part of the MI308X record. The module has 192 GB of HBM3, an 8192-bit bus, a memory clock of 2525 MHz, and an effective data rate of 10.1 Gbps. The bandwidth field is 10.3 TB/s. For high-resolution workloads, the 192 GB capacity is a substantial pool: large working sets can remain resident on the accelerator instead of being moved in and out of system memory. The 10.3 TB/s bandwidth is the rate at which data can feed the 19,456 shading units and 1,216 TMUs.

The memory design helps explain the rest of the product profile. A device with an 8192-bit bus and 10.3 TB/s bandwidth is arranged around data throughput, and a 0 MPixel/s pixel rate means there is no rasterized output path. The 2525 MHz memory clock and 10.1 Gbps effective rate are the signaling details behind that aggregate bandwidth. In the absence of benchmark scores, the memory subsystem is the clearest evidence of high-resolution suitability: 192 GB removes capacity constraints for very large datasets, and 10.3 TB/s provides the bandwidth to keep the compute units occupied.

The NVIDIA Equivalent of Radeon Instinct MI308X

Looking for a similar graphics card from NVIDIA? The NVIDIA GeForce RTX 4090 D offers comparable performance and features in the NVIDIA lineup.

NVIDIA GeForce RTX 4090 D

NVIDIA • 24 GB VRAM

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