AMD Instinct MI350X vs AMD Radeon 8050S Comparison

AMD
RADEON

AMD Instinct MI350X

CORE STATE MI350 256CU
VRAM 288 GB
CLOCK SPEED 2200 MHz
TDP 1000 W
BUS WIDTH 8192 bit
ARCHITECTURE CDNA 4.0
nm
PROCESS 3 nm
LAUNCH DATE 2025
VS
AMD
RADEON

Radeon 8050S

CORE STATE Strix Halo
VRAM System Shared
CLOCK SPEED 2800 MHz
TDP 55 W
BUS WIDTH System Shared
ARCHITECTURE RDNA 3.5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

geekbench_opencl
N/A
65,818
geekbench_vulkan
N/A
58,398

Analysis: AMD Instinct MI350X vs AMD Radeon 8050S

The Verdict

The AMD Instinct MI350X and AMD Radeon 8050S serve entirely different purposes, and the data confirms they should not be cross-shopped. The MI350X is a compute accelerator built for massive data center workloads, while the 8050S is an integrated mobile GPU designed for portable devices.

The MI350X targets server and AI deployments where its 288 GB of HBM3e memory and 72.09 TFLOPS FP32 throughput matter more than display outputs or API compatibility. It has no display outputs, no DirectX support, and consumes 1000 W. The 8050S, by contrast, is an active production part with DirectX 12 Ultimate support, 32 ray tracing cores, and a 55 W power envelope. It fits into laptops and portable devices where the MI350X cannot operate at all.

For anyone building or buying a portable gaming or workstation device, the 8050S is the only viable option between the two. For anyone provisioning data center compute for AI training or scientific workloads, the MI350X is the clear choice based on its memory capacity and raw compute throughput.

Architecture Differences

The MI350X uses the MI350 256CU chip built on CDNA 4.0 architecture, fabricated on a 3 nm process at TSMC. It packs 185,000 million transistors onto a 2380 mm² die, yielding a transistor density of 77.7M per mm². The chip is a compute-focused design with 16384 shading units, 1024 texture mapping units, and zero ROPs. It has no ray tracing cores listed and no tensor core count specified. Its pixel rate is 0 MPixel/s, confirming it is not designed for rasterization or graphics output.

The 8050S uses the Strix Halo chip built on RDNA 3.5 architecture, fabricated on a 4 nm process at TSMC. Its die size is 308 mm², and its transistor count is listed as unknown. The 8050S has 2048 shading units, 128 TMUs, 64 ROPs, and 32 ray tracing cores. Its pixel rate reaches 179.2 GPixel/s, and its texture rate is 358.4 GTexel/s.

The MI350X delivers a texture rate of 2,252.8 GTexel/s, which is over 6 times the 8050S figure. However, the MI350X has no graphics API support whatsoever. DirectX, OpenGL, and Vulkan are all marked N/A for the MI350X. The 8050S supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. This is a fundamental architectural split: the MI350X is a pure compute processor, while the 8050S is a full graphics solution.

The MI350X uses HBM3e memory with an 8192-bit bus and 8.19 TB/s bandwidth. The 8050S relies on system shared memory, with bandwidth described as system dependent. The MI350X's memory configuration is purpose-built for data-intensive workloads that need to keep massive datasets close to the compute units.

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark results between these two parts. The MI350X has no benchmark scores recorded, and its percentile rank sits at 50 with an average score of 0. The 8050S has two recorded benchmark scores: 65,818 in Geekbench OpenCL and 58,398 in Geekbench Vulkan, with an average of 62,108.

The 8050S ranks in the 89th percentile among all GPUs in the database. Its nearest rivals provide context for its performance level. The AMD Radeon Pro W6600M scores 61,896, putting the 8050S 0.3% ahead. The AMD Radeon Pro Vega 56 scores 63,693, with the 8050S trailing by 2.5%. The AMD Radeon RX 7600M scores 63,775, a 2.6% deficit for the 8050S. The AMD Radeon RX 9060 XT LP scores 63,830, with the 8050S 2.7% behind.

These deltas are small, indicating the 8050S performs in a tight band around established mobile and workstation GPUs. Its OpenCL score of 65,818 exceeds its average, while its Vulkan score of 58,398 falls below it. The gap between OpenCL and Vulkan results suggests the 8050S handles compute-oriented workloads more efficiently than graphics-heavy workloads in synthetic testing.

The MI350X's absence of benchmark data means no direct performance comparison is possible from the recorded measurements. Its 50th percentile rank is a placeholder rather than a measured result. The database does not support any claim about the MI350X's relative performance against the 8050S or any other GPU.

Specification Differences

The two parts differ across nearly every measurable specification. The process node differs: 3 nm for the MI350X versus 4 nm for the 8050S. Die size is 2380 mm² versus 308 mm². Transistor count is 185,000 million versus unknown.

Clock speeds favor the 8050S in boost frequency. The 8050S has a base clock of 1295 MHz and a boost clock of 2800 MHz. The MI350X has a base clock of 1000 MHz and a boost clock of 2200 MHz. The 8050S boosts 27% higher than the MI350X, though the MI350X compensates with far more compute units.

Memory configurations are completely different. The MI350X has 288 GB of HBM3e on an 8192-bit bus with 8.19 TB/s bandwidth. The 8050S uses system shared memory with system dependent bandwidth. Memory clock for the MI350X is 2000 MHz with 8 Gbps effective; the 8050S has no dedicated memory clock.

Compute resources differ by an order of magnitude. The MI350X has 16384 shading units versus 2048 for the 8050S. TMUs number 1024 versus 128. ROPs are 0 versus 64. The MI350X has no ray tracing cores; the 8050S has 32.

Pixel rate is 0 MPixel/s for the MI350X versus 179.2 GPixel/s for the 8050S. Texture rate is 2,252.8 GTexel/s versus 358.4 GTexel/s. FP32 performance is 72.09 TFLOPS versus 11.47 TFLOPS. Both parts show FP16 at a 1:1 ratio with FP32.

Power consumption differs drastically. The MI350X has a TDP of 1000 W with a suggested PSU of 1400 W. The 8050S has a TDP of 55 W and no suggested PSU listed. The MI350X is an OAM module with no power connectors; the 8050S is an IGP with no power connectors. Physical dimensions exist only for the MI350X: 102 mm length and 165 mm width. The 8050S has no recorded dimensions.

API support is exclusive to the 8050S. The MI350X has no display outputs and no API support. The 8050S has portable device dependent display outputs.

Release dates differ by roughly five months. The 8050S launched on January 5, 2025. The MI350X launched on June 11, 2025. The 8050S has an active production status; the MI350X has none recorded. The 8050S succeeds Polaris Mobile, while the MI350X succeeds Radeon Instinct.

FAQ

Q: Which GPU has more raw compute throughput?

A: The MI350X delivers 72.09 TFLOPS FP32, which is 6.3 times the 8050S's 11.47 TFLOPS FP32. Both parts run FP16 at a 1:1 ratio with FP32.

Q: Can the MI350X be used for gaming?

A: No. The MI350X has no display outputs, no DirectX support, no OpenGL support, and no Vulkan support. Its pixel rate is 0 MPixel/s, and it has no ROPs. It is a compute-only accelerator.

Q: How does the 8050S compare to its nearest rivals?

A: The 8050S scores 0.3% above the Radeon Pro W6600M, 2.5% below the Radeon Pro Vega 56, 2.6% below the Radeon RX 7600M, and 2.7% below the Radeon RX 9060 XT LP. These are small margins, placing it in a competitive band.

Q: What memory does each part use?

A: The MI350X uses 288 GB of HBM3e on an 8192-bit bus with 8.19 TB/s bandwidth. The 8050S uses system shared memory with system dependent bandwidth.

Q: What is the power requirement difference?

A: The MI350X has a 1000 W TDP and requires a 1400 W suggested PSU. The 8050S has a 55 W TDP and no suggested PSU listed. The 8050S is an IGP, while the MI350X is an OAM module.

Q: Which part supports ray tracing?

A: Only the 8050S supports ray tracing, with 32 ray tracing cores. The MI350X has no ray tracing cores listed.

Where Each One Wins

The MI350X wins decisively in compute density and memory capacity. Its 288 GB HBM3e pool with 8.19 TB/s bandwidth suits AI model training, scientific simulation, and large-scale data processing where memory residency matters. Its 72.09 TFLOPS FP32 output and 2,252.8 GTexel/s texture rate indicate massive parallel throughput. The 1000 W TDP and 1400 W suggested PSU confirm it is designed for rack-mounted data center deployment, not desktop or mobile use. The 3 nm process and 185,000 million transistors on a 2380 mm² die represent an extreme engineering effort for maximum compute per module.

The 8050S wins in every graphics-related category. Its 64 ROPs, 179.2 GPixel/s pixel rate, and 32 ray tracing cores make it a functional graphics processor. DirectX 12 Ultimate, OpenGL 4.6, and Vulkan 1.4 support mean it can run modern games and graphics applications. Its 55 W TDP allows integration into portable devices without active cooling concerns. The 2800 MHz boost clock is the highest among the two parts. The 8050S's 89th percentile rank with measurable benchmark scores of 65,818 in OpenCL and 58,398 in Vulkan demonstrates real-world usability.

The MI350X wins on transistor density at 77.7M per mm² versus an unknown figure for the 8050S. It also wins on memory bandwidth by an enormous margin: 8.19 TB/s versus system dependent. The MI350X has 8 times the shading units, 8 times the TMUs, and 6.3 times the FP32 throughput.

The 8050S wins on power efficiency. At 55 W versus 1000 W, it consumes 5.5% of the MI350X's power budget while still delivering 11.47 TFLOPS. It wins on portability with no physical dimensions recorded, suggesting a chip-level integration rather than a module. It wins on software ecosystem compatibility with full API support. It wins on production status as an active part, while the MI350X has no recorded production status.

For workload split: the MI350X targets compute-only data center tasks that require massive memory and raw FP32 throughput. The 8050S targets mobile graphics and compute tasks that require API compatibility, ray tracing, and low power consumption. The database shows no overlap in their intended use cases.

DETAILED SPECIFICATIONS

SPECIFICATION
Instinct MI350X
8050S
Core Specs
Shading Units
16,384
2,048 -87.5%
Shaders
16,384
2,048 -87.5%
TMUs
1,024
128 -87.5%
ROPs
0
64 +∞%
Compute Units
256
32 -87.5%
Clocks
Base Clock
1000 MHz
1295 MHz
Boost Clock
2200 MHz
2800 MHz
Memory Clock
2000 MHz 8 Gbps effective
System Shared
Memory
Memory Size
288 GB
System Shared
VRAM (MB)
294,912
Memory Type
HBM3e
System Shared
Memory Bus
8192 bit
System Shared
Bandwidth
8.19 TB/s
System Dependent
Cache
L1 Cache
16 KB (per CU)
L2 Cache
16 MB
2 MB
L3 Cache
256 MB
32 MB
Performance
Pixel Rate
0 MPixel/s
179.2 GPixel/s
Texture Rate
2,252.8 GTexel/s
358.4 GTexel/s
FP32 (TFLOPS)
72.09 TFLOPS
11.47 TFLOPS
FP64 (TFLOPS)
36.04 TFLOPS (1:2)
358.4 GFLOPS (1:32)
FP16 (TFLOPS)
72.09 TFLOPS (1:1)
11.47 TFLOPS (1:1)
AI/RT
RT Cores
32
Matrix Cores
1,024
Power
TDP
1000 W
55 W
TDP (W)
1,000
55 -94.5%
Suggested PSU
1400 W
Power Connectors
None
None
Architecture
Architecture
CDNA 4.0
RDNA 3.5
GPU Name
MI350 256CU
Strix Halo
Generation
Instinct (MIx)
Navi Mobile (RX 8000M)
Process Size
3 nm
4 nm
Transistors
185,000 million
unknown
Die Size
2380 mm²
308 mm²
Foundry
TSMC
TSMC
Density
77.7M / mm²
AMD MCM
MCM
2
API Support
DirectX
12 Ultimate (12_2)
OpenGL
4.6
Vulkan
1.4
OpenCL
3.0
2.1
Shader Model
6.8
Physical
Slot Width
OAM Module
IGP
Length
102 mm 4 inches
Outputs
No outputs
Portable Device Dependent
Bus Interface
PCIe 5.0 x16
PCIe 5.0 x16
Other
Production
Active
Predecessor
Radeon Instinct
Polaris Mobile
View Instinct MI350X Details View Radeon 8050S Details