AMD Instinct MI325X vs Intel Arc Graphics 112EU Mobile Comparison

AMD Instinct MI325X and Intel Arc Graphics 112EU Mobile occupy separate ends of the GPU spectrum, with the former being a 1000 W data center accelerator and the latter a 65 W integrated graphics processor. The recorded data shows no overlapping benchmark scores, as the MI325X has an average benchmark score of 0 and the Arc 112EU also has an average benchmark score of 0, with both parts sitting at the 50th percentile in the database. This analysis relies solely on the specification differences and architectural characteristics documented in the database.

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark results between the AMD Instinct MI325X and the Intel Arc Graphics 112EU Mobile. The headToHeadBenchmarks field is empty, and neither part has any recorded benchmark scores in the database. The MI325X shows an average benchmark score of 0, and the Arc 112EU also shows an average benchmark score of 0, meaning there are no measured performance numbers to compare directly.

However, the specification data provides a basis for comparing compute capabilities. The MI325X delivers 81.72 TFLOPS of FP32 performance, while the Arc 112EU delivers 3.942 TFLOPS of FP32. This indicates the MI325X offers roughly 20.7 times the FP32 throughput based on these recorded figures, though this is a derived ratio from the specification data rather than a benchmark result. In FP16, the MI325X maintains 81.72 TFLOPS with a 1:1 ratio, while the Arc 112EU achieves 7.885 TFLOPS with a 2:1 ratio, giving the MI325X approximately 10.4 times the FP16 throughput.

The texture and pixel rates show a similar pattern. The MI325X has a texture rate of 2,553.6 GTexel/s, compared to 123.2 GTexel/s for the Arc 112EU, a difference of roughly 20.7 times. For pixel throughput, the MI325X records 0 MPixel/s due to having 0 ROPs, while the Arc 112EU achieves 52.80 GPixel/s with 24 ROPs. This is the only specification where the Arc 112EU shows a measurable advantage, though the MI325X is not designed for rasterization output as an OAM module with no display outputs.

The shading unit count reinforces the compute gap. The MI325X contains 19,456 shading units, while the Arc 112EU contains 896 shading units, a ratio of approximately 21.7 to 1. Texture mapping units number 1,216 on the MI325X versus 56 on the Arc 112EU, a ratio of 21.7 to 1 as well. These figures align with the FP32 and texture rate differences, confirming that the MI325X is built for massive parallel compute workloads.

Architecture Differences

The MI325X uses the CDNA 3.0 architecture on the Aqua Vanjaram chip, while the Arc 112EU uses the Xe-LPG architecture on the Meteor Lake chip. The MI325X is manufactured on a 5 nm process by TSMC, whereas the Arc 112EU uses a 10 nm process from Intel. The MI325X has 153,000 million transistors on a die size of 1017 mm², resulting in a transistor density of 150.4 million per mm². The Arc 112EU has no recorded transistor count, die size, or density in the database.

The MI325X belongs to the Instinct (MIx) generation, with a predecessor of Radeon Instinct. The Arc 112EU belongs to the Arc Graphics-M (Meteor Lake) generation, with a predecessor of HD Graphics-M. The MI325X was released on 2024-10-09, while the Arc 112EU was released on 2023-12-13, making the Intel part roughly 10 months older in release timing.

Memory architecture differs substantially. The MI325X has 256 GB of HBM3e memory on an 8192-bit bus, delivering 6.14 TB/s of bandwidth. The memory clock is 1500 MHz with 6 Gbps effective. The Arc 112EU uses system shared memory with no dedicated VRAM, featuring system-dependent bandwidth and a system shared bus width. This means the MI325X provides dedicated high-bandwidth memory, while the Arc 112EU relies on the host system's memory subsystem.

The MI325X has no display outputs, while the Arc 112EU supports portable device dependent outputs. The MI325X uses a PCIe 5.0 x16 bus interface, while the Arc 112EU uses a Ring Bus interface. The MI325X is an OAM Module with no power connectors and a suggested PSU of 1400 W, while the Arc 112EU is an IGP with no power connector details or PSU suggestion.

API support shows a clear division. The MI325X lists N/A for DirectX, OpenGL, and Vulkan, indicating it is not intended for graphics API workloads. The Arc 112EU supports DirectX 12 (12_1), OpenGL 4.6, and Vulkan 1.4, making it a fully capable graphics processor for consumer applications.

Clock speeds differ in configuration. The MI325X has a base clock of 1000 MHz and a boost clock of 2100 MHz. The Arc 112EU has a base clock of 300 MHz and a higher boost clock of 2200 MHz. Despite the higher boost clock on the Arc 112EU, the massive difference in shading units and memory bandwidth gives the MI325X the compute advantage.

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The AMD Instinct MI325X delivers 81.72 TFLOPS of FP32 performance, compared to 3.942 TFLOPS for the Intel Arc Graphics 112EU Mobile. The MI325X provides approximately 20.7 times the FP32 throughput based on the recorded specification data.

Q: What type of memory does each GPU use?

A: The MI325X uses 256 GB of HBM3e memory with an 8192-bit bus and 6.14 TB/s bandwidth. The Arc 112EU uses system shared memory with system-dependent bandwidth and a system shared bus width.

Q: Does the MI325X support DirectX or Vulkan?

A: No, the MI325X lists N/A for DirectX, OpenGL, and Vulkan in the database. It has no display outputs and is designed for compute workloads. The Arc 112EU supports DirectX 12 (12_1), OpenGL 4.6, and Vulkan 1.4.

Q: What are the power consumption figures for these GPUs?

A: The MI325X has a TDP of 1000 W and a suggested PSU of 1400 W. The Arc 112EU has a TDP of 65 W and no suggested PSU listed, as it is an integrated graphics processor.

Q: Which GPU has more shading units?

A: The MI325X has 19,456 shading units, while the Arc 112EU has 896 shading units. The MI325X also has 1,216 texture mapping units versus 56 on the Arc 112EU.

Q: What is the release date difference between the two?

A: The Arc 112EU was released on 2023-12-13, and the MI325X was released on 2024-10-09. The Intel part came first by approximately 10 months.

Specification Differences

The two GPUs differ across nearly every recorded specification. The MI325X uses a 5 nm process from TSMC, while the Arc 112EU uses a 10 nm process from Intel. The MI325X has 153,000 million transistors on a 1017 mm² die, while the Arc 112EU has no transistor count or die size recorded. Transistor density for the MI325X is 150.4 million per mm², while the Arc 112EU has no density figure.

Clock speeds differ: the MI325X runs at 1000 MHz base and 2100 MHz boost, while the Arc 112EU runs at 300 MHz base and 2200 MHz boost. The memory clock on the MI325X is 1500 MHz with 6 Gbps effective, while the Arc 112EU uses system shared memory with no dedicated clock.

Memory configuration shows the largest gap: the MI325X has 256 GB of HBM3e on an 8192-bit bus with 6.14 TB/s bandwidth, while the Arc 112EU has system shared memory with system-dependent bandwidth and bus width. The MI325X has 19,456 shading units, 1,216 TMUs, and 0 ROPs. The Arc 112EU has 896 shading units, 56 TMUs, and 24 ROPs.

Pixel rate for the MI325X is 0 MPixel/s, while the Arc 112EU achieves 52.80 GPixel/s. Texture rate for the MI325X is 2,553.6 GTexel/s, versus 123.2 GTexel/s for the Arc 112EU. FP32 performance is 81.72 TFLOPS for the MI325X and 3.942 TFLOPS for the Arc 112EU. FP16 performance is 81.72 TFLOPS at 1:1 ratio for the MI325X, and 7.885 TFLOPS at 2:1 ratio for the Arc 112EU.

Power figures show the MI325X at 1000 W TDP with a 1400 W suggested PSU, while the Arc 112EU is at 65 W TDP with no PSU suggestion. The MI325X is an OAM Module with no power connectors and no display outputs. The Arc 112EU is an IGP with portable device dependent outputs. The bus interface differs: PCIe 5.0 x16 for the MI325X, Ring Bus for the Arc 112EU.

API support is entirely different: the MI325X lists N/A for DirectX, OpenGL, and Vulkan, while the Arc 112EU lists DirectX 12 (12_1), OpenGL 4.6, and Vulkan 1.4. Production status is not recorded for the MI325X, while the Arc 112EU is marked as Active. Release dates differ: 2024-10-09 for the MI325X, 2023-12-13 for the Arc 112EU.

Where Each One Wins

The MI325X wins decisively in raw compute throughput. Its FP32 performance of 81.72 TFLOPS versus 3.942 TFLOPS for the Arc 112EU makes it suitable for large-scale parallel processing. The 256 GB HBM3e memory with 6.14 TB/s bandwidth provides massive data handling capacity, far exceeding the system shared memory of the Arc 112EU. The 19,456 shading units and 1,216 TMUs enable high-throughput workloads in scientific computing, AI training, and data center applications. The PCIe 5.0 x16 interface provides high-bandwidth host connectivity, and the 1000 W TDP with 1400 W suggested PSU indicates a design for sustained heavy compute loads.

The Arc 112EU wins in graphics-oriented tasks. It has 24 ROPs delivering 52.80 GPixel/s, while the MI325X has 0 ROPs and 0 MPixel/s pixel rate. The Arc 112EU supports DirectX 12 (12_1), OpenGL 4.6, and Vulkan 1.4, enabling full graphics API compatibility, whereas the MI325X lists N/A for all APIs. The Arc 112EU has display outputs for portable devices, while the MI325X has no outputs. The Arc 112EU operates at 65 W TDP, making it suitable for mobile integration, while the MI325X requires 1000 W and an OAM Module form factor. The Arc 112EU also has a higher boost clock at 2200 MHz versus 2100 MHz for the MI325X, though this does not compensate for the compute gap.

The MI325X offers higher texture rate at 2,553.6 GTexel/s versus 123.2 GTexel/s, and higher FP16 performance at 81.72 TFLOPS versus 7.885 TFLOPS. The MI325X also has a larger transistor count at 153,000 million versus no recorded figure for the Arc 112EU, and a more advanced 5 nm process versus 10 nm. The Arc 112EU has an active production status, while the MI325X has no production status recorded.

The Verdict

The data indicates that the AMD Instinct MI325X and Intel Arc Graphics 112EU Mobile serve entirely different purposes with no performance overlap in the database. The MI325X is a data center accelerator with 81.72 TFLOPS FP32, 256 GB HBM3e memory, and 6.14 TB/s bandwidth, designed for compute-intensive workloads that do not require graphics output. The Arc 112EU is an integrated graphics processor with 3.942 TFLOPS FP32, system shared memory, and full graphics API support, designed for mobile devices that need display output and power efficiency.

For users requiring massive parallel compute throughput, the MI325X delivers 20.7 times the FP32 performance of the Arc 112EU and 10.4 times the FP16 performance. Its 19,456 shading units and 1,216 TMUs provide the hardware resources for large-scale matrix operations and tensor workloads. However, it offers no display outputs, no graphics API support, and requires a 1000 W power envelope with a 1400 W suggested PSU, making it unsuitable for any consumer or mobile application.

For users needing graphics rendering and display functionality, the Arc 112EU provides 52.80 GPixel/s pixel rate, DirectX 12 (12_1), OpenGL 4.6, and Vulkan 1.4 support, along with portable device dependent display outputs. Its 65 W TDP makes it viable for mobile integration, and its Ring Bus interface connects directly to the host processor. The MI325X cannot perform any graphics output tasks, as evidenced by its 0 ROPs and N/A API entries.

The MI325X has a more advanced manufacturing process at 5 nm from TSMC, while the Arc 112EU uses 10 nm from Intel. The MI325X was released on 2024-10-09, and the Arc 112EU on 2023-12-13. Neither part has recorded benchmark scores, so the comparison relies entirely on specification data. The recorded data shows the MI325X as a specialized compute accelerator and the Arc 112EU as a general-purpose integrated GPU, with each winning in its respective domain.