AMD Ryzen Z2 Go GPU vs NVIDIA B300 SXM6 AC Comparison

AMD
RADEON

AMD Ryzen Z2 Go GPU

CORE STATE Rembrandt+
VRAM 16 GB
CLOCK SPEED 2700 MHz
TDP 28 W
BUS WIDTH 128 bit
ARCHITECTURE RDNA 2.0
nm
PROCESS 6 nm
LAUNCH DATE 2025
VS
NVIDIA
GEFORCE

B300 SXM6 AC

CORE STATE GB110
VRAM 288 GB
CLOCK SPEED 2032 MHz
TDP 1100 W
BUS WIDTH 8192 bit
ARCHITECTURE Blackwell Ultra
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

geekbench_opencl
N/A
369,831

Analysis: AMD Ryzen Z2 Go GPU vs NVIDIA B300 SXM6 AC

The Verdict

The AMD Ryzen Z2 Go GPU and NVIDIA B300 SXM6 AC occupy entirely different segments of the GPU market, and the data confirms there is no genuine overlap in their intended use cases. The B300 SXM6 AC is a server-class accelerator with a recorded Geekbench OpenCL score of 369,831, placing it in the 100th percentile of all GPUs in the database. The Ryzen Z2 Go, by contrast, sits at the 50th percentile with no recorded benchmark scores. The B300 SXM6 AC delivers 76.99 TFLOPS of FP32 compute, while the Ryzen Z2 Go delivers 4.147 TFLOPS. Any buyer comparing these two is not choosing between alternatives; they are choosing which workload class matters. The Ryzen Z2 Go is an integrated-class part for compact, low-power systems, while the B300 SXM6 AC is a data center accelerator for high-throughput compute. The verdict is simple: the B300 SXM6 AC dominates every performance metric, but the Ryzen Z2 Go offers a viable path for power-constrained environments where the B300's 1100 W TDP is impossible to support.

Architecture Differences

The two parts come from different foundries, nodes, and design philosophies. The AMD Ryzen Z2 Go uses the Rembrandt+ chip, built on RDNA 2.0 architecture, manufactured by TSMC on a 6 nm process. It integrates 13,100 million transistors on a 208 mm² die, yielding a transistor density of 63.0M per mm². The NVIDIA B300 SXM6 AC uses the GB110 chip, built on Blackwell Ultra architecture, also manufactured by TSMC but on a 5 nm process. It packs 208,000 million transistors on a 1628 mm² die, achieving 127.8M transistors per mm². That density difference is substantial: the B300 crams more than twice as many transistors per square millimeter.

The B300 SXM6 AC is a server part with no display outputs and no DirectX, OpenGL, or Vulkan API support. It is a pure compute accelerator. The Ryzen Z2 Go, in contrast, supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4, and provides a single USB Type-C display output. The B300's predecessor is Server Hopper and its successor is Server Rubin, placing it in a clear generational lineage. The Ryzen Z2 Go has no predecessor or successor listed.

The memory subsystems are equally divergent. The Ryzen Z2 Go uses 16 GB of LPDDR5 on a 128-bit bus, delivering 102.4 GB/s of bandwidth, with memory clocked at 800 MHz (6.4 Gbps effective). The B300 SXM6 AC uses 288 GB of HBM3e on an 8192-bit bus, delivering 8.19 TB/s of bandwidth, with memory at 2000 MHz (8 Gbps effective). That is an 80-fold difference in memory capacity and an 80-fold difference in bandwidth. The B300 has 18944 shading units, 592 TMUs, 24 ROPs, and 592 tensor cores. The Ryzen Z2 Go has 768 shading units, 48 TMUs, 32 ROPs, and 12 ray tracing cores. The B300's tensor core count is a key architectural feature for AI workloads, while the Ryzen Z2 Go's RT cores serve graphics rendering.

Head-to-Head Benchmarks

The database includes no direct head-to-head benchmark entries between these two parts. However, the B300 SXM6 AC has a recorded Geekbench OpenCL score of 369,831, and its nearest rivals provide context for that number. The B300 SXM6 AC leads the NVIDIA B200 by 7%, the NVIDIA H200 NVL by 10.4%, the AMD Instinct MI300X by 16.3%, and the NVIDIA L40S by 25%. These deltas establish the B300 SXM6 AC as the top performer in its immediate competitive set, sitting at the 100th percentile of all GPUs in the database.

The Ryzen Z2 Go has no recorded benchmark scores and no nearest rivals listed. Its 50th percentile ranking places it in the middle of the overall GPU distribution, but without a benchmark score, the database cannot quantify its position against any specific competitor. The performance gap between the two parts is defined by raw specifications: the B300 SXM6 AC delivers 76.99 TFLOPS of FP32 and 76.99 TFLOPS of FP16 (1:1 ratio), while the Ryzen Z2 Go delivers 4.147 TFLOPS of FP32 and 8.294 TFLOPS of FP16 (2:1 ratio). The B300 is roughly 18.6 times faster in FP32 throughput. The B300 also achieves a texture rate of 1,202.9 GTexel/s against the Ryzen Z2 Go's 129.6 GTexel/s. The pixel rates are closer in raw terms: the B300 posts 48.77 GPixel/s, while the Ryzen Z2 Go posts 86.40 GPixel/s. The Ryzen Z2 Go actually leads in pixel fill rate, a result of its lower resolution target and smaller ROP count.

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The NVIDIA B300 SXM6 AC delivers 76.99 TFLOPS of FP32, while the AMD Ryzen Z2 Go delivers 4.147 TFLOPS. The B300 is approximately 18.6 times faster in this metric.

Q: What memory configurations do these GPUs use?

A: The AMD Ryzen Z2 Go uses 16 GB of LPDDR5 on a 128-bit bus with 102.4 GB/s bandwidth. The NVIDIA B300 SXM6 AC uses 288 GB of HBM3e on an 8192-bit bus with 8.19 TB/s bandwidth.

Q: Do both GPUs support modern graphics APIs?

A: No. The AMD Ryzen Z2 Go supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The NVIDIA B300 SXM6 AC has no DirectX, OpenGL, or Vulkan support, as it is a compute-focused server accelerator.

Q: What is the power draw difference?

A: The AMD Ryzen Z2 Go has a TDP of 28 W and requires no power connectors. The NVIDIA B300 SXM6 AC has a TDP of 1100 W and a suggested PSU rating of 1500 W.

Q: How does the B300 SXM6 AC compare to its nearest rivals?

A: The B300 SXM6 AC scores 369,831 in Geekbench OpenCL. It leads the NVIDIA B200 (345,482) by 7%, the NVIDIA H200 NVL (334,891) by 10.4%, the AMD Instinct MI300X (317,994) by 16.3%, and the NVIDIA L40S (295,763) by 25%.

Q: Which GPU has more shading units?

A: The NVIDIA B300 SXM6 AC has 18,944 shading units, while the AMD Ryzen Z2 Go has 768. The B300 also has 592 tensor cores, while the Ryzen Z2 Go has 12 ray tracing cores and no tensor cores.

Where Each One Wins

The AMD Ryzen Z2 Go wins in scenarios defined by low power and compact integration. Its 28 W TDP, lack of power connectors, and single USB Type-C output make it suitable for small form factor systems or devices where thermal and electrical budgets are tight. Its 16 GB of LPDDR5 memory is ample for graphics workloads, and its support for DirectX 12 Ultimate, OpenGL 4.6, and Vulkan 1.4 means it can run modern graphics applications. Its FP16 output of 8.294 TFLOPS (2:1) doubles its FP32 rate, which can benefit certain mixed-precision workloads. Its pixel rate of 86.40 GPixel/s is higher than the B300's 48.77 GPixel/s, giving it an edge in pure pixel throughput, which matters for lower-resolution rendering tasks.

The NVIDIA B300 SXM6 AC wins in every compute-heavy category. Its 76.99 TFLOPS FP32 and FP16 (1:1 ratio) performance, 8.19 TB/s memory bandwidth, 288 GB capacity, and 1,202.9 GTexel/s texture rate place it firmly in the accelerator class. Its 100th percentile ranking and 369,831 Geekbench OpenCL score confirm its position at the top of the database. Its nearest rival deltas (7% over the B200, 10.4% over the H200 NVL, 16.3% over the MI300X, 25% over the L40S) show it is not merely competitive but decisively ahead of established server accelerators. The B300's 592 tensor cores support AI and deep learning workloads, and its PCIe 6.0 x16 interface reflects a modern server integration path. Its 5 nm process and 208,000 million transistors give it the raw silicon resources to sustain these workloads, though at 1100 W TDP and with a 1500 W suggested PSU, it demands substantial infrastructure.

Specification Differences

The two parts differ across nearly every specification field. The AMD Ryzen Z2 Go uses a 6 nm TSMC process, while the NVIDIA B300 SXM6 AC uses a 5 nm TSMC process. Transistor counts are 13,100 million versus 208,000 million. Die size is 208 mm² versus 1628 mm². Transistor density is 63.0M per mm² versus 127.8M per mm². Base clocks are 800 MHz versus 1665 MHz, and boost clocks are 2700 MHz versus 2032 MHz. Memory type is LPDDR5 versus HBM3e, with bus widths of 128 bit versus 8192 bit. Memory bandwidth is 102.4 GB/s versus 8.19 TB/s. Shading units are 768 versus 18,944. TMUs are 48 versus 592. ROPs are 32 versus 24. The Ryzen Z2 Go has 12 RT cores; the B300 has none listed. The B300 has 592 tensor cores; the Ryzen Z2 Go has none listed. Pixel rate is 86.40 GPixel/s versus 48.77 GPixel/s. Texture rate is 129.6 GTexel/s versus 1,202.9 GTexel/s. FP32 is 4.147 TFLOPS versus 76.99 TFLOPS. FP16 is 8.294 TFLOPS (2:1) versus 76.99 TFLOPS (1:1). TDP is 28 W versus 1100 W. The B300 supports PCIe 6.0 x16; the Ryzen Z2 Go lists no bus interface. Display outputs are one USB Type-C for the Ryzen Z2 Go and none for the B300. The B300 is an SXM Module with a 1500 W suggested PSU, while the Ryzen Z2 Go has no power connectors. The Ryzen Z2 Go supports DirectX 12 Ultimate, OpenGL 4.6, and Vulkan 1.4; the B300 supports none of these. Release dates are 2024-12-31 for the Ryzen Z2 Go and 2025-09-10 for the B300. The Ryzen Z2 Go's ROP count of 32 is higher than the B300's 24, and its pixel rate reflects that advantage. The B300's 592 tensor cores and 18,944 shading units define its compute identity, while the Ryzen Z2 Go's 768 shading units and 12 RT cores define its graphics identity.

DETAILED SPECIFICATIONS

SPECIFICATION
Z2 Go GPU
B300 SXM6 AC
Core Specs
Shading Units
768
18,944 +2366.7%
Shaders
768
18,944 +2366.7%
TMUs
48
592 +1133.3%
ROPs
32
24 -25.0%
Compute Units
12
—
SM Count
—
148
Clocks
Base Clock
800 MHz
1665 MHz
Boost Clock
2700 MHz
2032 MHz
Memory Clock
800 MHz 6.4 Gbps effective
2000 MHz 8 Gbps effective
Memory
Memory Size
16 GB
288 GB
VRAM (MB)
16,384
294,912 +1700.0%
Memory Type
LPDDR5
HBM3e
Memory Bus
128 bit
8192 bit
Bandwidth
102.4 GB/s
8.19 TB/s
Cache
L1 Cache
128 KB per Array
256 KB (per SM)
L2 Cache
8 MB
126 MB
L3 Cache
16 MB
—
L0 Cache
32 KB per WGP
—
Performance
Pixel Rate
86.40 GPixel/s
48.77 GPixel/s
Texture Rate
129.6 GTexel/s
1,202.9 GTexel/s
FP32 (TFLOPS)
4.147 TFLOPS
76.99 TFLOPS
FP64 (TFLOPS)
259.2 GFLOPS (1:16)
1,202.9 GFLOPS (1:64)
FP16 (TFLOPS)
8.294 TFLOPS (2:1)
76.99 TFLOPS (1:1)
AI/RT
RT Cores
12
—
Tensor Cores
—
592
Power
TDP
28 W
1100 W
TDP (W)
28
1,100 +3828.6%
Suggested PSU
—
1500 W
Power Connectors
None
—
Architecture
Architecture
RDNA 2.0
Blackwell Ultra
GPU Name
Rembrandt+
GB110
Generation
Console GPU (AMD)
Server Blackwell (Bxx)
Process Size
6 nm
5 nm
Transistors
13,100 million
208,000 million
Die Size
208 mm²
1628 mm²
Foundry
TSMC
TSMC
Density
63.0M / mm²
127.8M / mm²
API Support
DirectX
12 Ultimate (12_2)
—
OpenGL
4.6
—
Vulkan
1.4
—
OpenCL
2.0
3.0
CUDA
—
10.3
Shader Model
6.8
—
Physical
Slot Width
—
SXM Module
Outputs
1x USB Type-C
No outputs
Bus Interface
—
PCIe 6.0 x16
Other
Production
Active
Active
Predecessor
—
Server Hopper
Successor
—
Server Rubin
View Ryzen Z2 Go GPU Details View B300 SXM6 AC Details