AMD Radeon RX 9050 OEM vs Intel Arc B770 Comparison

AMD
RADEON

AMD Radeon RX 9050 OEM

CORE STATE Navi 44
VRAM 4 GB
CLOCK SPEED 2600 MHz
TDP 92 W
BUS WIDTH 64 bit
ARCHITECTURE RDNA 4.0
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
GPU

Arc B770

CORE STATE BMG-G31
VRAM 16 GB
CLOCK SPEED 2400 MHz
TDP 225 W
BUS WIDTH 256 bit
ARCHITECTURE Xe2-HPG
nm
PROCESS 5 nm
LAUNCH DATE 2026

Analysis: AMD Radeon RX 9050 OEM vs Intel Arc B770

Head-to-Head Benchmarks

The recorded database contains no direct head-to-head benchmark results for the AMD Radeon RX 9050 OEM against the Intel Arc B770. Both entries have an empty benchmarks array, an average benchmark score of zero, and zero recorded wins on either side. The percentile ranking for both GPUs is identical at 50, placing them at the median of all GPUs tracked in the database.

Without measured frame rates or synthetic scores, the comparison rests entirely on the architectural and specification data recorded for each product. The raw compute figures show a substantial gap. The Intel Arc B770 delivers 19.66 TFLOPS of FP32 throughput, while the AMD Radeon RX 9050 OEM delivers 10.65 TFLOPS. That places the Intel part roughly 85% ahead in raw single-precision compute, a decisive margin on paper.

The memory subsystem tells a similar story. The Arc B770 carries 16 GB of GDDR6 on a 256-bit bus, producing 512.0 GB/s of bandwidth. The RX 9050 OEM has 4 GB of GDDR6 on a 64-bit bus, yielding 144.0 GB/s. The Intel card offers four times the memory capacity and over three and a half times the bandwidth. For texture work, the Arc B770 reaches 614.4 GTexel/s versus 166.4 GTexel/s for the AMD part, a factor of roughly 3.7. Pixel throughput also favors Intel heavily: 307.2 GPixel/s versus 166.4 GPixel/s, a 1.85x advantage.

The FP16 comparison introduces a notable architectural difference. The RX 9050 OEM runs FP16 at a 1:1 ratio with FP32, meaning both sit at 10.65 TFLOPS. The Arc B770 uses a 2:1 ratio, doubling its FP16 output to 39.32 TFLOPS while its FP32 figure stays at 19.66 TFLOPS. For workloads that can use packed FP16 math, the Intel part extends its lead considerably.

Clock behavior diverges as well. The RX 9050 OEM has a base clock of 1330 MHz and a boost clock of 2600 MHz, with a game clock listed at 1920 MHz. The Arc B770 runs a higher base frequency of 2100 MHz but a lower boost of 2400 MHz. The AMD card therefore has a wider boost range and a higher peak frequency, though its sustained game clock sits well below the Intel base clock. Memory clocks also differ: the RX 9050 OEM runs at 2250 MHz (18 Gbps effective) while the Arc B770 runs at 2000 MHz (16 Gbps effective).

The Verdict

The data points to a clear performance hierarchy. The Intel Arc B770 holds decisive advantages in compute throughput, memory capacity, memory bandwidth, texture rate, and pixel rate. Every raw throughput metric in the database favors Intel by a wide margin. The RX 9050 OEM counters with a higher boost clock, a smaller process node, lower power draw, and a smaller die.

For applications that are memory-bound or compute-heavy, the Arc B770 should dominate based on the recorded figures. The 512.0 GB/s bandwidth versus 144.0 GB/s is a 3.6x gap that will manifest in high-resolution textures, large data sets, and ray tracing workloads. The 16 GB frame buffer versus 4 GB means the Intel card can hold far more scene data locally, avoiding spills to system memory.

The RX 9050 OEM appears positioned for low-power or space-constrained configurations. Its 92 W TDP versus 225 W for the Arc B770 represents a 133 W difference, and its suggested PSU of 250 W versus 550 W reflects a much lighter system demand. The 4 nm process node versus 5 nm also indicates a denser, more efficient design, though the transistor count for the Intel chip is not recorded, making direct density comparisons impossible.

Users who prioritize raw performance and large memory pools should select the Arc B770. Users who need a compact, low-power card with modern API support and are willing to accept far lower throughput should consider the RX 9050 OEM. The database shows no benchmark results to contradict this split.

Architecture Differences

The two GPUs use fundamentally different architectures. The AMD Radeon RX 9050 OEM is built on RDNA 4.0, part of the Navi IV generation (RX 9000 series), using the Navi 44 chip. The Intel Arc B770 uses Xe2-HPG, part of the Battlemage generation (Arc 7), built around the BMG-G31 chip.

Process technology differs. The RX 9050 OEM uses a 4 nm node from TSMC, while the Arc B770 uses a 5 nm node from the same foundry. The AMD die measures 199 mm² with 29,700 million transistors, giving a transistor density of 149.2M per mm². The Intel die is larger at 368 mm², but its transistor count is listed as unknown, so density cannot be calculated.

Compute unit organization diverges sharply. The RX 9050 OEM has 1024 shading units, 64 texture mapping units, 64 ROPs, and 16 ray tracing cores. The Arc B770 has 4096 shading units, 256 TMUs, 128 ROPs, and 32 ray tracing cores. That is exactly four times the shading units and TMUs, double the ROPs, and double the ray tracing cores.

API support is identical on both cards: DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. Neither card lists tensor cores in the database, so AI acceleration hardware is not documented for either product.

The memory architecture also differs in bus width and capacity, as noted earlier. The RX 9050 OEM uses a 64-bit bus with 4 GB, while the Arc B770 uses a 256-bit bus with 16 GB. Both use GDDR6 memory, but the AMD card runs at a higher effective speed of 18 Gbps versus 16 Gbps, though the wider Intel bus overwhelms that clock advantage.

Specification Differences

The following fields differ between the two recorded products:

  • Chip: Navi 44 versus BMG-G31
  • Architecture: RDNA 4.0 versus Xe2-HPG
  • Generation: Navi IV (RX 9000) versus Battlemage (Arc 7)
  • Process node: 4 nm versus 5 nm
  • Die size: 199 mm² versus 368 mm²
  • Transistor count: 29,700 million versus unknown
  • Transistor density: 149.2M / mm² versus not listed
  • Base clock: 1330 MHz versus 2100 MHz
  • Boost clock: 2600 MHz versus 2400 MHz
  • Game clock: 1920 MHz versus not listed
  • Memory clock: 2250 MHz (18 Gbps effective) versus 2000 MHz (16 Gbps effective)
  • Memory size: 4 GB versus 16 GB
  • Memory bus width: 64 bit versus 256 bit
  • Memory bandwidth: 144.0 GB/s versus 512.0 GB/s
  • Shading units: 1024 versus 4096
  • TMUs: 64 versus 256
  • ROPs: 64 versus 128
  • Ray tracing cores: 16 versus 32
  • Pixel rate: 166.4 GPixel/s versus 307.2 GPixel/s
  • Texture rate: 166.4 GTexel/s versus 614.4 GTexel/s
  • FP32 performance: 10.65 TFLOPS versus 19.66 TFLOPS
  • FP16 performance: 10.65 TFLOPS (1:1) versus 39.32 TFLOPS (2:1)
  • TDP: 92 W versus 225 W
  • Power connectors: 1x 8-pin versus 1x 6-pin + 1x 8-pin
  • Suggested PSU: 250 W versus 550 W
  • Bus interface: PCIe 5.0 x16 versus PCIe 4.0 x16
  • Display outputs: 1x HDMI 2.1b, 2x DisplayPort 2.1a versus 1x HDMI 2.1a, 3x DisplayPort 2.1
  • Release date: 2026-07-27 versus 2025-12-31
  • Predecessor: Navi III versus Alchemist
  • Production status: Active versus not listed

Fields that are identical include both being dual-slot cards, both using GDDR6 memory, both having DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4 support, and neither having a recorded launch MSRP.

FAQ

Q: Which GPU has more memory bandwidth?

A: The Intel Arc B770 has 512.0 GB/s of bandwidth, compared to 144.0 GB/s for the AMD Radeon RX 9050 OEM. The Intel card uses a 256-bit bus while the AMD card uses a 64-bit bus.

Q: What is the FP32 compute difference between the two cards?

A: The Arc B770 delivers 19.66 TFLOPS of FP32 throughput, while the RX 9050 OEM delivers 10.65 TFLOPS. The Intel card is approximately 85% ahead in this metric.

Q: How do the power requirements compare?

A: The RX 9050 OEM has a TDP of 92 W and a suggested PSU of 250 W, using a single 8-pin connector. The Arc B770 has a TDP of 225 W and a suggested PSU of 550 W, using one 6-pin and one 8-pin connector.

Q: Do both cards support the same graphics APIs?

A: Yes, both support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4.

Q: Which card has a higher boost clock?

A: The AMD RX 9050 OEM has a boost clock of 2600 MHz, while the Intel Arc B770 has a boost clock of 2400 MHz. However, the Intel card has a higher base clock at 2100 MHz versus 1330 MHz.

Q: What are the process node and die size differences?

A: The RX 9050 OEM uses a 4 nm TSMC process with a 199 mm² die. The Arc B770 uses a 5 nm TSMC process with a 368 mm² die. The AMD card has a smaller die on a more advanced node.

Where Each One Wins

The Intel Arc B770 wins every raw throughput category in the database. Its FP32 compute is 19.66 TFLOPS versus 10.65 TFLOPS, making it the clear choice for general compute tasks, shader-heavy rendering, and any workload that scales with raw ALU throughput. The FP16 advantage is even larger at 39.32 TFLOPS versus 10.65 TFLOPS, so applications using packed half-precision math will see an outsized benefit from the Intel part.

The memory subsystem heavily favors Intel. With 16 GB of GDDR6 and 512.0 GB/s of bandwidth, the Arc B770 can handle large textures, complex geometry, and high-resolution frame buffers without running out of capacity. The RX 9050 OEM's 4 GB and 144.0 GB/s will constrain scene complexity and may force texture streaming or asset compression in demanding titles. The 3.6x bandwidth gap will be felt in any bandwidth-sensitive scenario, including 4K rendering, ray tracing, and compute workloads that stream large data arrays.

The texture and pixel fill rates also go to Intel. The Arc B770's 614.4 GTexel/s versus 166.4 GTexel/s gives it a 3.7x advantage in texture-heavy scenes, while its 307.2 GPixel/s versus 166.4 GPixel/s provides a 1.85x edge in fill-bound situations. The doubling of ray tracing cores (32 versus 16) suggests better ray tracing throughput, assuming comparable per-core efficiency.

The AMD Radeon RX 9050 OEM wins in efficiency-oriented categories. Its 92 W TDP versus 225 W means it draws less than half the power of the Intel card. The suggested PSU of 250 W versus 550 W indicates it can fit into systems with much smaller power supplies. The 4 nm process node versus 5 nm gives it a manufacturing advantage, and the higher boost clock of 2600 MHz versus 2400 MHz shows it can reach higher peak frequencies. The PCIe 5.0 x16 interface versus PCIe 4.0 x16 provides double the bus bandwidth for data transfers, though this matters less for a card with a 64-bit memory bus.

The RX 9050 OEM also has a newer release date of 2026-07-27 versus 2025-12-31 for the Arc B770, and it carries an active production status while the Intel card's status is not listed. For users building low-power systems, small-form-factor machines, or configurations where the power supply is limited to 250 W, the AMD card is the only viable option in this comparison. For everyone else prioritizing performance, the Intel Arc B770 dominates the recorded metrics.

DETAILED SPECIFICATIONS

SPECIFICATION
RX 9050 OEM
B770
Core Specs
Shading Units
1,024
4,096 +300.0%
Shaders
1,024
4,096 +300.0%
TMUs
64
256 +300.0%
ROPs
64
128 +100.0%
Compute Units
16
—
Execution Units
—
32
Clocks
Base Clock
1330 MHz
2100 MHz
Boost Clock
2600 MHz
2400 MHz
Game Clock
1920 MHz
—
Memory Clock
2250 MHz 18 Gbps effective
2000 MHz 16 Gbps effective
Memory
Memory Size
4 GB
16 GB
VRAM (MB)
4,096
16,384 +300.0%
Memory Type
GDDR6
GDDR6
Memory Bus
64 bit
256 bit
Bandwidth
144.0 GB/s
512.0 GB/s
Cache
L2 Cache
2 MB
16 MB
L3 Cache
16 MB
—
L0 Cache
32 KB per WGP
—
Performance
Pixel Rate
166.4 GPixel/s
307.2 GPixel/s
Texture Rate
166.4 GTexel/s
614.4 GTexel/s
FP32 (TFLOPS)
10.65 TFLOPS
19.66 TFLOPS
FP64 (TFLOPS)
332.8 GFLOPS (1:32)
2.458 TFLOPS (1:8)
FP16 (TFLOPS)
10.65 TFLOPS (1:1)
39.32 TFLOPS (2:1)
AI/RT
RT Cores
16
32 +100.0%
XMX Cores
—
256
Matrix Cores
32
—
Power
TDP
92 W
225 W
TDP (W)
92
225 +144.6%
Suggested PSU
250 W
550 W
Power Connectors
1x 8-pin
1x 6-pin + 1x 8-pin
Architecture
Architecture
RDNA 4.0
Xe2-HPG
GPU Name
Navi 44
BMG-G31
Generation
Navi IV (RX 9000)
Battlemage (Arc 7)
Process Size
4 nm
5 nm
Transistors
29,700 million
unknown
Die Size
199 mm²
368 mm²
Foundry
TSMC
TSMC
Density
149.2M / mm²
—
API Support
DirectX
12 Ultimate (12_2)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.4
1.4
OpenCL
2.2
3.0
Shader Model
6.9
6.6
Physical
Slot Width
Dual-slot
Dual-slot
Outputs
1x HDMI 2.1b2x DisplayPort 2.1a
1x HDMI 2.1a3x DisplayPort 2.1
Bus Interface
PCIe 5.0 x16
PCIe 4.0 x16
Other
Production
Active
—
Predecessor
Navi III
Alchemist
View Radeon RX 9050 OEM Details View Arc B770 Details