AMD Steam Deck OLED GPU vs Intel Arc Pro B70 Comparison

AMD
RADEON

AMD Steam Deck OLED GPU

CORE STATE Sephiroth
VRAM 16 GB
CLOCK SPEED 1600 MHz
TDP 15 W
BUS WIDTH 128 bit
ARCHITECTURE RDNA 2.0
nm
PROCESS 6 nm
LAUNCH DATE 2023
VS
Intel
GPU

Arc Pro B70

CORE STATE BMG-G31
VRAM 32 GB
CLOCK SPEED 2800 MHz
TDP 230 W
BUS WIDTH 256 bit
ARCHITECTURE Xe2-HPG
nm
PROCESS 5 nm
LAUNCH DATE 2026

Analysis: AMD Steam Deck OLED GPU vs Intel Arc Pro B70

Head-to-Head Benchmarks

The recorded data contains no direct head-to-head benchmark results between the AMD Steam Deck OLED GPU and the Intel Arc Pro B70. Both entries in the database list an average benchmark score of zero and a percentile rank of 50 among all GPUs. The absence of measured scores means no direct performance deltas can be calculated from the database fields. However, the specification sheets reveal a large gap in raw compute capacity. The Intel Arc Pro B70 delivers 22.94 TFLOPS of FP32 throughput, while the AMD Steam Deck OLED GPU provides 1.638 TFLOPS. That is a 14.0x difference in single-precision floating-point performance. The texture rate difference is even starker: 716.8 GTexel/s versus 51.20 GTexel/s, a 14.0x advantage for the Intel part. Pixel throughput favors the Intel Arc Pro B70 at 358.4 GPixel/s against 25.60 GPixel/s, again a 14.0x margin.

Memory bandwidth tells a similar story. The Intel part uses a 256-bit memory bus with GDDR6 running at 19 Gbps effective, yielding 608.0 GB/s. The AMD part uses a 128-bit LPDDR5 bus at 11 Gbps effective, yielding 176.0 GB/s. The Intel card offers 3.45x the bandwidth. Capacity also differs substantially: 32 GB versus 16 GB. The AMD chip compensates with a much lower power envelope. Its TDP is 15 W, while the Intel card is rated at 230 W. The thermal and electrical design targets are clearly different product categories.

The database shows no wins recorded for either GPU in the head-to-head section. Both win counters read zero. This means the benchmark database has not yet logged any comparative workload results for this pairing. The analysis below therefore relies on architectural and specification comparisons from the recorded fields.

Where Each One Wins

The AMD Steam Deck OLED GPU is built for constrained environments. Its 15 W TDP allows operation in handheld or compact systems where power delivery and cooling are limited. The 6 nm process node from TSMC and 2,400 million transistors on a 131 mm² die give a transistor density of 18.3 million per square millimeter. The GPU integrates 8 ray tracing cores, 512 shading units, 32 texture mapping units, and 16 render output units. These figures position it as a capable integrated-style solution for portable gaming workloads. The 176.0 GB/s of memory bandwidth and 16 GB of LPDDR5 memory support modern game assets at lower resolutions and detail settings. The single USB Type-C display output reflects its handheld design intent.

The Intel Arc Pro B70 targets professional and desktop workloads. Its 32 GB of GDDR6 memory on a 256-bit bus provides 608.0 GB/s of bandwidth, suitable for large datasets and high-resolution rendering. The compute resources are far larger: 4096 shading units, 256 TMUs, 128 ROPs, and 32 ray tracing cores. The FP16 throughput of 45.88 TFLOPS (2:1 ratio) indicates strong half-precision capability for AI-adjacent tasks. The PCIe 5.0 x16 bus interface allows high-bandwidth host communication. Display outputs include 1x HDMI 2.1a and 3x DisplayPort 2.1, enabling multi-monitor professional setups. The dual-slot cooler and 1x 8-pin power connector support sustained operation at 230 W.

Benchmark wins are not recorded for either device. The database percentile ranks are identical at 50, which places both at the median of the all-GPU distribution. Without workload-specific results, the use-case split must be inferred from the specification sheet. The AMD part wins in power efficiency and portability. The Intel part wins in raw throughput, memory capacity, memory bandwidth, and display connectivity.

Architecture Differences

The AMD Steam Deck OLED GPU uses the RDNA 2.0 architecture on the Sephiroth chip. This is a console-class GPU generation developed by Valve. RDNA 2.0 implements DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.3. The ray tracing implementation uses 8 dedicated RT cores. The FP16 to FP32 ratio is 2:1, indicating packed math execution. The memory subsystem pairs LPDDR5 with a 128-bit interface. The process node is 6 nm at TSMC. The transistor count is 2,400 million on a 131 mm² die.

The Intel Arc Pro B70 uses the Xe2-HPG architecture on the BMG-G31 chip, part of the Battlemage Pro Series. It supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The Vulkan revision is newer than the AMD part's 1.3 support. The ray tracing block contains 32 RT cores, four times the AMD count. The FP16 to FP32 ratio is also 2:1, but the absolute FP16 output reaches 45.88 TFLOPS. The process node is 5 nm at TSMC, one step smaller than the AMD chip. The die size is 368 mm², which is 2.81x the AMD die. The Intel transistor count is listed as unknown in the database, so density cannot be calculated for that part.

Memory technology differs completely. AMD uses LPDDR5, a low-power DRAM standard suitable for battery operation. Intel uses GDDR6, a high-bandwidth graphics memory standard. The bus widths are 128-bit versus 256-bit. The effective memory clock is 11 Gbps on the AMD part versus 19 Gbps on the Intel part. The resulting bandwidth gap is 3.45x in favor of Intel.

The PCIe interface is another architectural split. The AMD part lists no bus interface in the database, consistent with an integrated or embedded design. The Intel part uses PCIe 5.0 x16, the current high-end desktop interconnect. The AMD part lists one USB Type-C display output. The Intel part lists four outputs: one HDMI 2.1a and three DisplayPort 2.1. These differences reflect the intended deployment scenarios: a handheld console versus a professional graphics card.

Specification Differences

The two GPUs differ across nearly every recorded specification field. The process node is 6 nm for AMD and 5 nm for Intel, both fabricated by TSMC. The AMD die is 131 mm²; the Intel die is 368 mm². Base clock speeds are 1000 MHz for AMD and 2280 MHz for Intel. Boost clocks are 1600 MHz and 2800 MHz respectively. Memory capacity is 16 GB versus 32 GB. Memory type is LPDDR5 versus GDDR6. Bus width is 128 bit versus 256 bit. Bandwidth is 176.0 GB/s versus 608.0 GB/s.

The compute unit counts differ by a factor of eight in shading units: 512 versus 4096. TMUs are 32 versus 256. ROPs are 16 versus 128. Ray tracing cores are 8 versus 32. Pixel rate is 25.60 GPixel/s versus 358.4 GPixel/s. Texture rate is 51.20 GTexel/s versus 716.8 GTexel/s. FP32 throughput is 1.638 TFLOPS versus 22.94 TFLOPS. FP16 throughput is 3.277 TFLOPS versus 45.88 TFLOPS.

Power consumption is 15 W versus 230 W. The Intel card requires a dual-slot cooler, one 8-pin power connector, and a 550 W suggested power supply. The AMD part lists no slot width, power connector, or PSU requirement. The Intel card uses PCIe 5.0 x16; the AMD part has no listed bus interface. Display outputs are one USB Type-C versus one HDMI 2.1a plus three DisplayPort 2.1. The Vulkan API version differs: 1.3 for AMD, 1.4 for Intel. Both support DirectX 12 Ultimate (12_2) and OpenGL 4.6.

Physical dimensions also differ. The AMD device is 298 mm long, 117 mm tall, and 49 mm wide. The Intel card is 267 mm long, 110 mm tall, and 39 mm wide. The AMD part is longer and taller, while the Intel card is thinner. Release dates are 2023-11-08 for AMD and 2026-03-25 for Intel. The Intel card has a launch MSRP of 949 USD. The AMD part has no launch MSRP recorded. The Intel part lists no production status; the AMD part is marked Active.

FAQ

Q: Which GPU has higher FP32 compute throughput?

A: The Intel Arc Pro B70 delivers 22.94 TFLOPS of FP32 performance. The AMD Steam Deck OLED GPU delivers 1.638 TFLOPS. Intel leads by 14.0x in this metric.

Q: What are the memory bandwidth figures for each GPU?

A: The AMD Steam Deck OLED GPU has 176.0 GB/s from 16 GB of LPDDR5 on a 128-bit bus. The Intel Arc Pro B70 has 608.0 GB/s from 32 GB of GDDR6 on a 256-bit bus. Intel provides 3.45x the bandwidth.

Q: How do the power requirements compare?

A: The AMD part is rated at 15 W TDP. The Intel part is rated at 230 W TDP and requires a dual-slot cooler, a single 8-pin power connector, and a 550 W suggested power supply.

Q: Do both GPUs support the same DirectX and OpenGL versions?

A: Yes, both support DirectX 12 Ultimate (12_2) and OpenGL 4.6. They differ in Vulkan support: the AMD part supports Vulkan 1.3, while the Intel part supports Vulkan 1.4.

Q: What is the ray tracing core count for each GPU?

A: The AMD Steam Deck OLED GPU has 8 ray tracing cores. The Intel Arc Pro B70 has 32 ray tracing cores, which is four times the AMD count.

Q: What are the display output configurations?

A: The AMD part lists a single USB Type-C output. The Intel part lists one HDMI 2.1a and three DisplayPort 2.1 outputs, for a total of four display connections.

DETAILED SPECIFICATIONS

SPECIFICATION
Steam Deck OLED GPU
Pro B70
Core Specs
Shading Units
512
4,096 +700.0%
Shaders
512
4,096 +700.0%
TMUs
32
256 +700.0%
ROPs
16
128 +700.0%
Compute Units
8
Execution Units
32
Clocks
Base Clock
1000 MHz
2280 MHz
Boost Clock
1600 MHz
2800 MHz
Memory Clock
1375 MHz 11 Gbps effective
2375 MHz 19 Gbps effective
Memory
Memory Size
16 GB
32 GB
VRAM (MB)
16,384
32,768 +100.0%
Memory Type
LPDDR5
GDDR6
Memory Bus
128 bit
256 bit
Bandwidth
176.0 GB/s
608.0 GB/s
Cache
L1 Cache
128 KB per Array
L2 Cache
1024 KB
24 MB
L3 Cache
8 MB
L0 Cache
32 KB per WGP
Performance
Pixel Rate
25.60 GPixel/s
358.4 GPixel/s
Texture Rate
51.20 GTexel/s
716.8 GTexel/s
FP32 (TFLOPS)
1.638 TFLOPS
22.94 TFLOPS
FP64 (TFLOPS)
102.4 GFLOPS (1:16)
2.867 TFLOPS (1:8)
FP16 (TFLOPS)
3.277 TFLOPS (2:1)
45.88 TFLOPS (2:1)
AI/RT
RT Cores
8
32 +300.0%
XMX Cores
256
Power
TDP
15 W
230 W
TDP (W)
15
230 +1433.3%
Suggested PSU
550 W
Power Connectors
1x 8-pin
Architecture
Architecture
RDNA 2.0
Xe2-HPG
GPU Name
Sephiroth
BMG-G31
Generation
Console GPU (Valve)
Battlemage (Pro Series)
Process Size
6 nm
5 nm
Transistors
2,400 million
unknown
Die Size
131 mm²
368 mm²
Foundry
TSMC
TSMC
Density
18.3M / mm²
API Support
DirectX
12 Ultimate (12_2)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.3
1.4
OpenCL
2.0
3.0
Shader Model
6.8
6.6
Physical
Slot Width
Dual-slot
Length
298 mm 11.7 inches
267 mm 10.5 inches
Height
117 mm 4.6 inches
110 mm 4.3 inches
Outputs
1x USB Type-C
1x HDMI 2.1a3x DisplayPort 2.1
Bus Interface
PCIe 5.0 x16
Other
Launch Price
949 USD
Production
Active
View Steam Deck OLED GPU Details View Arc Pro B70 Details