AMD Ryzen Z2 Go GPU vs Intel Data Center GPU Max 1350 Comparison

AMD Ryzen Z2 Go GPU and Intel Data Center GPU Max 1350 represent two extremes in GPU design: one is a low-power integrated-style solution for compact systems, the other is a massive data center accelerator. The recorded data shows they share a 50th percentile ranking among all GPUs, but their specifications, architectures, and intended workloads diverge sharply. The AMD part is built on a 6 nm TSMC process with RDNA 2.0 architecture, while the Intel part uses a 10 nm Intel process with Generation 12.5 architecture. Their performance profiles, memory systems, and power envelopes place them in entirely different segments of the market.

FAQ

Q: What are the core architectural differences between the two GPUs?

A: The AMD Ryzen Z2 Go GPU uses RDNA 2.0 architecture on a 6 nm TSMC process, with 13,100 million transistors on a 208 mm² die. The Intel Data Center GPU Max 1350 uses Generation 12.5 architecture on a 10 nm Intel process, with 100,000 million transistors on a 1280 mm² die. The Intel part has a much larger transistor count and die size.

Q: How do their memory configurations compare?

A: The AMD GPU has 16 GB of LPDDR5 memory on a 128 bit bus, delivering 102.4 GB/s bandwidth. The Intel GPU has 96 GB of HBM2e memory on a 8192 bit bus, delivering 2.46 TB/s bandwidth. The Intel part offers substantially more capacity and bandwidth.

Q: What is the power consumption difference?

A: The AMD Ryzen Z2 Go GPU has a TDP of 28 W and requires no power connectors. The Intel Data Center GPU Max 1350 has a TDP of 450 W and suggests an 850 W power supply. The Intel part consumes over 16 times the power of the AMD part.

Q: Which GPU has higher raw compute performance?

A: The Intel Data Center GPU Max 1350 delivers 44.44 TFLOPS FP32 and 44.44 TFLOPS FP16. The AMD Ryzen Z2 Go GPU delivers 4.147 TFLOPS FP32 and 8.294 TFLOPS FP16. The Intel part is roughly 10.7 times faster in FP32 performance.

Q: What are the display output capabilities?

A: The AMD Ryzen Z2 Go GPU has one USB Type-C display output. The Intel Data Center GPU Max 1350 has no display outputs, indicating it is designed for compute workloads rather than graphics output.

Q: When were these GPUs released?

A: The Intel Data Center GPU Max 1350 was released on 2023-01-09. The AMD Ryzen Z2 Go GPU was released on 2024-12-31, nearly two years later.

Architecture Differences

The AMD Ryzen Z2 Go GPU is built on RDNA 2.0 architecture, fabricated on a 6 nm process at TSMC. The chip carries the Rembrandt+ designation and belongs to the Console GPU generation. It integrates 13,100 million transistors on a 208 mm² die, resulting in a transistor density of 63.0M per mm². The GPU includes 768 shading units, 48 texture mapping units, 32 render output units, and 12 ray tracing cores. Its clock speeds range from a base of 800 MHz to a boost of 2700 MHz. The memory subsystem uses 16 GB of LPDDR5 on a 128 bit interface, achieving 102.4 GB/s bandwidth. The memory clock runs at 800 MHz with 6.4 Gbps effective speed.

The Intel Data Center GPU Max 1350 uses Generation 12.5 architecture, built on a 10 nm Intel process with the Ponte Vecchio chip. It belongs to the Data Center GPU generation and contains 100,000 million transistors on a 1280 mm² die, giving a transistor density of 78.1M per mm². The compute configuration is far larger: 14,336 shading units, 896 texture mapping units, and 112 ray tracing cores. Notably, the render output unit count is listed as 0, and the pixel rate is recorded as 0 MPixel/s. The base clock is 750 MHz with a boost of 1550 MHz, lower than the AMD part but with far more execution units. Memory consists of 96 GB of HBM2e on an 8192 bit bus, providing 2.46 TB/s bandwidth, with a memory clock of 1200 MHz and 2.4 Gbps effective speed.

The process technology difference is significant. AMD uses a more advanced 6 nm node from TSMC, while Intel uses a 10 nm node from its own fabs. Despite the older node, Intel achieves higher transistor density at 78.1M per mm² compared to AMD's 63.0M per mm². The Intel die is over six times larger at 1280 mm² versus 208 mm². The architectures also differ in API support: AMD supports DirectX 12 Ultimate (12_2) and Vulkan 1.4, while Intel supports DirectX 12 (12_1) and OpenGL 4.6 but has no Vulkan listing. Both support OpenGL 4.6.

The power delivery systems reflect their different roles. The AMD part runs at 28 W TDP with no power connectors, suitable for compact or portable systems. The Intel part runs at 450 W TDP, uses an OAM Module slot width, and suggests an 850 W power supply. The bus interface on the Intel part is PCIe 5.0 x16, while the AMD part has no bus interface listed.

The Verdict

The data clearly separates these two GPUs into different product categories. The AMD Ryzen Z2 Go GPU is designed for low-power, compact systems with a 28 W TDP, a single USB Type-C display output, and integrated-style memory. The Intel Data Center GPU Max 1350 is a data center accelerator with a 450 W TDP, no display outputs, and an OAM Module form factor.

For workloads requiring massive memory capacity and bandwidth, the Intel part is the only choice. Its 96 GB of HBM2e memory with 2.46 TB/s bandwidth dwarfs the AMD part's 16 GB LPDDR5 with 102.4 GB/s. The Intel part also provides 44.44 TFLOPS FP32 and FP16 performance, compared to 4.147 TFLOPS FP32 and 8.294 TFLOPS FP16 on the AMD part. For compute-heavy data center tasks, the Intel GPU delivers over ten times the FP32 throughput.

For systems that need display output, low power consumption, or compact integration, the AMD part is the appropriate selection. It is the only one of the two with a display output. Its 28 W TDP and lack of power connectors make it suitable for environments where power and space are constrained. The AMD part also offers newer API support with DirectX 12 Ultimate and Vulkan 1.4, which the Intel part lacks.

The Intel part has a successor listed as H3C Graphics, while the AMD part has no listed successor. Both parts are marked as Active in production status. The release dates differ by nearly two years, with Intel launching on 2023-01-09 and AMD on 2024-12-31.

Specification Differences

The two GPUs differ across nearly every specification field. The process node differs: AMD uses 6 nm from TSMC, Intel uses 10 nm from Intel. Transistor counts differ dramatically: AMD has 13,100 million, Intel has 100,000 million. Die size: AMD 208 mm², Intel 1280 mm². Transistor density: AMD 63.0M per mm², Intel 78.1M per mm².

Clock speeds: AMD base 800 MHz and boost 2700 MHz, Intel base 750 MHz and boost 1550 MHz. Memory clock: AMD 800 MHz with 6.4 Gbps effective, Intel 1200 MHz with 2.4 Gbps effective. Memory size: AMD 16 GB LPDDR5, Intel 96 GB HBM2e. Memory bus width: AMD 128 bit, Intel 8192 bit. Memory bandwidth: AMD 102.4 GB/s, Intel 2.46 TB/s.

Compute units: AMD has 768 shading units, 48 TMUs, 32 ROPs, and 12 RT cores. Intel has 14,336 shading units, 896 TMUs, 0 ROPs, and 112 RT cores. Pixel rate: AMD 86.40 GPixel/s, Intel 0 MPixel/s. Texture rate: AMD 129.6 GTexel/s, Intel 1,388.8 GTexel/s. FP32: AMD 4.147 TFLOPS, Intel 44.44 TFLOPS. FP16: AMD 8.294 TFLOPS (2:1), Intel 44.44 TFLOPS (1:1).

Power: AMD 28 W TDP with no power connectors, Intel 450 W TDP with an 850 W suggested PSU. Form factor: AMD has no slot width listed, Intel uses OAM Module. Bus interface: AMD none listed, Intel PCIe 5.0 x16. Display outputs: AMD 1x USB Type-C, Intel no outputs. APIs: AMD DirectX 12 Ultimate (12_2), OpenGL 4.6, Vulkan 1.4; Intel DirectX 12 (12_1), OpenGL 4.6, no Vulkan. Release dates: AMD 2024-12-31, Intel 2023-01-09.

Head-to-Head Benchmarks

The benchmark data shows no recorded head-to-head benchmark scores, no wins for either part, and no average benchmark scores. Both GPUs share the same 50th percentile ranking among all GPUs. The lack of benchmark entries means direct performance comparisons must rely on the specification data.

The largest advantage for the Intel Data Center GPU Max 1350 appears in compute throughput. The Intel part delivers 44.44 TFLOPS FP32, which is 10.7 times the AMD part's 4.147 TFLOPS. In FP16, the Intel part delivers 44.44 TFLOPS, which is 5.4 times the AMD part's 8.294 TFLOPS. The texture rate also favors Intel: 1,388.8 GTexel/s versus 129.6 GTexel/s, a factor of 10.7.

Memory bandwidth shows the most extreme difference. The Intel part provides 2.46 TB/s, which is 24 times the AMD part's 102.4 GB/s. Memory capacity favors Intel at 96 GB versus 16 GB, a 6 times difference. The memory bus width of 8192 bit on Intel versus 128 bit on AMD explains the bandwidth gap.

The AMD Ryzen Z2 Go GPU holds advantages in several areas. The boost clock is 2700 MHz versus 1550 MHz on Intel, a 74% higher clock speed. The pixel rate is 86.40 GPixel/s on AMD versus 0 MPixel/s on Intel, giving AMD a complete advantage in this metric. The base clock is also higher on AMD at 800 MHz versus 750 MHz. The AMD part uses a more advanced process node at 6 nm versus 10 nm, and it supports DirectX 12 Ultimate and Vulkan 1.4, which the Intel part does not.

Where Each One Wins

The AMD Ryzen Z2 Go GPU wins in scenarios that prioritize power efficiency, display output, and high clock speeds. Its 28 W TDP makes it suitable for systems where power draw is a primary constraint. The single USB Type-C display output enables graphics presentation, something the Intel part cannot do. The higher boost clock of 2700 MHz suggests responsiveness in single-threaded or lightly threaded graphics workloads. The pixel rate of 86.40 GPixel/s indicates capability in rasterization tasks, despite the lower overall compute throughput. The newer API support, including DirectX 12 Ultimate and Vulkan 1.4, provides compatibility with modern graphics standards.

The Intel Data Center GPU Max 1350 wins in compute-heavy, memory-intensive data center workloads. Its 44.44 TFLOPS FP32 and FP16 performance positions it for large-scale parallel computation. The 96 GB HBM2e memory with 2.46 TB/s bandwidth supports massive datasets that cannot fit in the AMD part's 16 GB memory. The 8192 bit memory bus enables the high bandwidth required for memory-bound workloads. The 1,388.8 GTexel/s texture rate indicates strong texture processing capability. The 450 W TDP and 850 W suggested power supply reflect its design for server environments with ample power delivery. The PCIe 5.0 x16 bus interface allows high-speed host connectivity. The Intel part also has a listed successor, H3C Graphics, indicating an ongoing product line.

The data shows no overlap in their optimal use cases. The AMD part targets compact, low-power systems with display requirements. The Intel part targets data center compute nodes without display needs. The 16 times power difference, the 24 times memory bandwidth difference, and the complete divergence in display capabilities confirm these are complementary rather than competing products.