GPU Comparison
RADEON
AMD FirePro W4300
CORE STATE
Bonaire
VRAM
4 GB
CLOCK SPEED
—
TDP
50 W
BUS WIDTH
128 bit
ARCHITECTURE
GCN 2.0
PROCESS
28 nm
LAUNCH DATE
2015
VS
RADEON
Radeon 860M
CORE STATE
Krackan Point
VRAM
System Shared
CLOCK SPEED
3000 MHz
TDP
15 W
BUS WIDTH
System Shared
ARCHITECTURE
RDNA 3.5
PROCESS
4 nm
LAUNCH DATE
—
PERFORMANCE BENCHMARKS
geekbench_opencl
geekbench_vulkan
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro W4300
860M
Core Specs
Shading Units
768
512
-33.3%
Shaders
768
512
-33.3%
TMUs
48
32
-33.3%
ROPs
16
8
-50.0%
Compute Units
12
8
-33.3%
Clocks
Base Clock
—
600 MHz
Boost Clock
—
3000 MHz
GPU Clock
930 MHz
—
Memory Clock
1500 MHz
6 Gbps effective
System Shared
Memory
Memory Size
4 GB
System Shared
VRAM (MB)
4,096
—
Memory Type
GDDR5
System Shared
Memory Bus
128 bit
System Shared
Bandwidth
96.00 GB/s
System Dependent
Cache
L1 Cache
16 KB (per CU)
128 KB per Array
L2 Cache
256 KB
1024 KB
L0 Cache
—
32 KB per WGP
Performance
Pixel Rate
14.88 GPixel/s
24.00 GPixel/s
Texture Rate
44.64 GTexel/s
96.00 GTexel/s
FP32 (TFLOPS)
1,428.5 GFLOPS
3.072 TFLOPS
FP64 (TFLOPS)
89.28 GFLOPS (1:16)
192.0 GFLOPS (1:16)
FP16 (TFLOPS)
—
6.144 TFLOPS (2:1)
AI/RT
RT Cores
—
8
Power
TDP
50 W
15 W
TDP (W)
50
15
-70.0%
Suggested PSU
250 W
—
Power Connectors
None
None
Architecture
Architecture
GCN 2.0
RDNA 3.5
GPU Name
Bonaire
Krackan Point
Generation
FirePro GCN
(Wx300)
Navi III IGP
(Strix Point Mobile)
Process Size
28 nm
4 nm
Transistors
2,080 million
—
Die Size
160 mm²
—
Foundry
TSMC
TSMC
Density
13.0M / mm²
—
API Support
DirectX
12 (12_0)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1
2.1
Shader Model
6.5
6.8
Physical
Slot Width
Single-slot
IGP
Length
171 mm
6.7 inches
—
Height
69 mm
2.7 inches
—
Outputs
4x mini-DisplayPort 1.2
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
PCIe 4.0 x8
Other
Production
End-of-life
Active
Predecessor
FirePro Terascale
Navi II IGP
Successor
Radeon Pro GCN
—