AMD Instinct MI350P vs Intel Arc B570 Comparison

# Head-to-Head Benchmarks

The AMD Instinct MI350P and Intel Arc B570 occupy entirely different segments of the GPU market, and the benchmark data reflects this divide. The MI350P is a compute-oriented accelerator with no display outputs, while the B570 is a consumer graphics card with full video output capabilities. Their average benchmark scores tell the story: the B570 records an average benchmark score of 20,556 across its tested workloads, while the MI350P has no recorded benchmark scores in the database, placing it at the 50th percentile versus the B570's 65th percentile among all GPUs.

The B570's nearest rivals provide context for its performance tier. It sits within 0.5% of the NVIDIA GeForce RTX 3070 Mobile, which scores 20,534, and the Intel Arc A750, which scores 20,582. The B570 trails the Arc A750 by 0.1% and the AMD Radeon R9 M390X by 0.5%, while leading the RTX 3070 Mobile by 0.1% and the Quadro M4000M by 0.4%. These margins are narrow, indicating that the B570 delivers performance consistent with its direct competitors.

The MI350P, by contrast, has no comparable benchmark entries. Its raw compute specifications are substantially higher: 36.04 TFLOPS FP32 performance versus 11.52 TFLOPS for the B570, and 36.04 TFLOPS FP16 (1:1 ratio) versus 23.04 TFLOPS FP16 (2:1 ratio) for the B570. The MI350P also delivers a texture rate of 1,126.4 GTexel/s, more than three times the B570's 360.0 GTexel/s. However, the MI350P has a pixel rate of 0 MPixel/s, as it lacks raster output units entirely, while the B570 manages 200.0 GPixel/s through its 80 ROPs.

Memory bandwidth presents the largest numerical gap between these two products. The MI350P uses 144 GB of HBM3e memory across an 8192-bit bus, achieving 8.19 TB/s of bandwidth. The B570 uses 10 GB of GDDR6 memory on a 160-bit bus, delivering 380.0 GB/s. This represents a ratio of roughly 21.5 to 1 in favor of the MI350P. The MI350P's memory configuration is designed for large-scale compute workloads that require massive data throughput, whereas the B570's memory subsystem targets conventional gaming and consumer applications.

Clock speeds also differ substantially. The B570 runs at a fixed 2500 MHz for both base and boost clocks. The MI350P has a base clock of 1000 MHz and a boost clock of 2200 MHz. Despite the lower base clock, the MI350P's much larger shader array (8192 shading units versus 2304) and higher boost clock produce far greater theoretical throughput. The B570's memory clock runs at 2375 MHz (19 Gbps effective), while the MI350P's memory clock is 2000 MHz (8 Gbps effective), though the HBM3e memory's wider bus compensates with vastly higher aggregate bandwidth.

Where Each One Wins

The Intel Arc B570 demonstrates clear advantages in consumer-oriented workloads. Its 3DMark Steel Nomad DX12 score of 2,649 confirms its capability in modern gaming APIs. The B570 also records 83,514 in Geekbench OpenCL and 96,844 in Geekbench Vulkan, showing solid cross-platform compute performance in consumer-grade applications. PassMark scores further illustrate its balanced profile: 14,195 in G3D, 7,281 in GPU Compute, 661 in G2D, and legacy DirectX results of 164 for DX9, 118 for DX11, 72 for DX12, and 65 for DX10.

The MI350P wins in every category where raw compute throughput matters. Its FP32 output of 36.04 TFLOPS is roughly 3.1 times the B570's 11.52 TFLOPS. In FP16, the MI350P's 36.04 TFLOPS (1:1 ratio) exceeds the B570's 23.04 TFLOPS (2:1 ratio) by 56%. The texture rate of 1,126.4 GTexel/s dwarfs the B570's 360.0 GTexel/s by a factor of 3.1. Memory bandwidth of 8.19 TB/s versus 380.0 GB/s represents the most extreme difference, favoring the MI350P by more than an order of magnitude.

The B570 wins on power efficiency in terms of performance per watt. Its thermal design power is 150 W, while the MI350P draws 600 W. The B570's FP32 performance of 11.52 TFLOPS at 150 W yields 76.8 GFLOPS per watt. The MI350P's 36.04 TFLOPS at 600 W yields 60.1 GFLOPS per watt. The B570 also requires a 450 W suggested power supply versus 1000 W for the MI350P, making it compatible with far more modest system configurations.

The MI350P wins on raw memory capacity, offering 144 GB versus 10 GB. This 14.4 times capacity difference matters for workloads that require large models or datasets to reside in GPU memory. The MI350P's HBM3e memory type also provides lower latency characteristics than GDDR6, though the database does not record latency measurements for either product.

Display capabilities belong exclusively to the B570. It provides 1x HDMI 2.1a and 3x DisplayPort 2.1 outputs, while the MI350P has no display outputs. The B570 supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4, whereas the MI350P lists N/A for all three APIs. This makes the B570 the only viable option for graphics rendering to a display.

Architecture Differences

The MI350P uses AMD's CDNA 4.0 architecture, built on a 3 nm process at TSMC. CDNA is AMD's dedicated compute architecture, optimized for data center and scientific workloads rather than graphics rendering. The chip, designated MI350 128CU, contains 73,000 million transistors on a die size of 1,190 mm², yielding a transistor density of 61.3 million transistors per square millimeter.

The B570 uses Intel's Xe2-HPG architecture, which powers the Battlemage generation. It is built on a 5 nm process at TSMC. The BMG-G21 chip contains 19,600 million transistors on a die size of 272 mm², giving a transistor density of 72.1 million transistors per square millimeter. The Xe2-HPG architecture is designed for consumer graphics, supporting modern rendering features and display output.

The transistor density figures are notable. Despite using a larger 5 nm node, the B570 achieves higher density (72.1M / mm²) than the MI350P (61.3M / mm²). This reflects different design priorities: the MI350P's massive 1,190 mm² die prioritizes raw compute resources and memory bandwidth over density optimization, while the B570's smaller 272 mm² die focuses on efficient integration of graphics features.

The MI350P features 512 texture mapping units and 8,192 shading units, but zero raster output units. This configuration confirms its compute-only design. The B570 includes 144 TMUs, 2,304 shading units, and 80 ROPs, plus 18 ray tracing cores. The MI350P does not list ray tracing cores or tensor cores in the database, while the B570 lists 18 RT cores and no tensor cores.

Memory architectures differ fundamentally. The MI350P uses HBM3e stacked memory with an 8192-bit interface, typical of high-bandwidth compute accelerators. The B570 uses GDDR6 memory on a 160-bit bus, standard for consumer GPUs. The MI350P's memory clock of 2000 MHz with 8 Gbps effective rate runs lower than the B570's 2375 MHz with 19 Gbps effective rate, but the MI350P's vastly wider bus compensates with much higher total bandwidth.

Specification Differences

The process nodes differ: the MI350P uses 3 nm while the B570 uses 5 nm, both from TSMC. Transistor counts differ at 73,000 million versus 19,600 million. Die sizes measure 1,190 mm² versus 272 mm².

Clock specifications show the B570 fixed at 2500 MHz base and boost, while the MI350P ranges from 1000 MHz base to 2200 MHz boost. Memory clocks are 2000 MHz (8 Gbps effective) for the MI350P and 2375 MHz (19 Gbps effective) for the B570.

Memory configurations diverge completely: 144 GB HBM3e on an 8192-bit bus with 8.19 TB/s bandwidth versus 10 GB GDDR6 on a 160-bit bus with 380.0 GB/s bandwidth. Shading units number 8,192 versus 2,304. TMUs number 512 versus 144. ROPs number 0 versus 80. The B570 has 18 ray tracing cores; the MI350P has none listed.

Compute throughput differs significantly: FP32 at 36.04 TFLOPS versus 11.52 TFLOPS, FP16 at 36.04 TFLOPS (1:1) versus 23.04 TFLOPS (2:1). Texture rates are 1,126.4 GTexel/s versus 360.0 GTexel/s. Pixel rates are 0 MPixel/s versus 200.0 GPixel/s.

Power requirements differ: 600 W TDP with a 1x 16-pin connector and 1000 W suggested PSU for the MI350P; 150 W TDP with a 1x 8-pin connector and 450 W suggested PSU for the B570. Both are dual-slot cards. The MI350P measures 267 mm in length, 111 mm in height, and 40 mm in width. The B570 measures 272 mm in length and 115 mm in height, with no width recorded.

Bus interfaces differ: PCIe 5.0 x16 for the MI350P versus PCIe 4.0 x8 for the B570. Display outputs are absent on the MI350P but present on the B570 as 1x HDMI 2.1a and 3x DisplayPort 2.1. API support is N/A for the MI350P, while the B570 supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4.

The B570 carries a launch MSRP of 219 USD. The MI350P has no launch MSRP recorded in the database. Release dates also differ: the B570 released on January 15, 2025, while the MI350P is dated May 6, 2026. The B570's production status is listed as Active, and its predecessor is Alchemist. The MI350P's predecessor is Radeon Instinct. The B570 carries a generation label of Battlemage (Arc 5), while the MI350P is labeled Instinct (MIx).

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The AMD Instinct MI350P delivers 36.04 TFLOPS FP32, which is 3.1 times the Intel Arc B570's 11.52 TFLOPS.

Q: What are the memory capacities and types?

A: The MI350P uses 144 GB of HBM3e memory with an 8192-bit bus and 8.19 TB/s bandwidth. The B570 uses 10 GB of GDDR6 memory with a 160-bit bus and 380.0 GB/s bandwidth.

Q: Can the MI350P output video to a display?

A: No. The MI350P has no display outputs and lists N/A for DirectX, OpenGL, and Vulkan support. The B570 provides 1x HDMI 2.1a and 3x DisplayPort 2.1 outputs with full API support.

Q: How do their power requirements compare?

A: The MI350P has a 600 W TDP, requires a 1x 16-pin connector, and a 1000 W suggested power supply. The B570 has a 150 W TDP, uses a 1x 8-pin connector, and requires a 450 W suggested power supply.

Q: What is the B570's closest rival in the database?

A: The B570's nearest rival is the NVIDIA GeForce RTX 3070 Mobile with a score of 20,534, which is 0.1% behind the B570's 20,556 average benchmark score. The Intel Arc A750 is 0.1% ahead at 20,582.

Q: What process nodes and die sizes do they use?

A: The MI350P uses a 3 nm TSMC process with a 1,190 mm² die containing 73,000 million transistors. The B570 uses a 5 nm TSMC process with a 272 mm² die containing 19,600 million transistors.