AMD Ryzen AI 9 HX 370

The AMD Ryzen AI 9 HX 370 is a 12-core, 24-thread mobile processor built on TSMC's 4 nm process, featuring a Zen 5 architecture under the Strix Point codename. It operates within a 28 W TDP class and sits at the 90th percentile of all CPUs in the database, with an average benchmark score of 38,195. The chip pairs a 2.00 GHz base clock with a 5.10 GHz boost clock, and its benchmark results reveal a distinct performance profile that separates single-thread agility from multi-thread throughput.

Single-Thread vs Multi-Thread Behavior

The benchmark data reveals a processor that scales strongly with thread count, but the shape of that scaling is more nuanced than a simple linear progression. In 3DMark testing, the single-thread score of 1,153 more than doubles to 2,179 in the 2-thread test, indicating efficient use of a second core. The 4-thread score jumps to 3,970, and 8-thread reaches 6,992, showing that the architecture extracts near-linear gains up to eight threads. The max-thread score of 9,725 is only 28% higher than the 8-thread result, however, which signals that the final four cores contribute meaningfully but with diminishing returns typical of shared cache and memory bandwidth limits.

Cinebench results reinforce this pattern. The R23 multi-core score of 29,870 versus a single-core score of 4,217 produces a multi-to-single ratio of roughly 7.1x, which is strong for a 12-core part but not exceptional—the ratio is lower than the 12x one might naively expect from core count alone. PassMark data shows a similar story: single-thread performance scores 3,973, while the multithread score of 35,148 is just under 9x higher. This suggests the chip's real-world advantage in heavily threaded workloads is substantial, but the 28 W TDP class imposes thermal and power ceilings that prevent perfect core scaling.

For real workloads, this split means the HX 370 excels at parallel tasks like video rendering, code compilation, and data processing, but it does not sacrifice responsiveness in lightly threaded applications. The 3DMark 16-thread score of 9,365 is only 3.7% below the max-thread score of 9,725, indicating that the chip is already near its performance ceiling when 16 threads are active, and the additional 8 threads provide marginal gains. This behavior suggests a design tuned for laptop-class power envelopes where sustained multi-thread boosts are limited, while bursty single-thread performance remains competitive.

Power and Thermals

The 28 W TDP class places the Ryzen AI 9 HX 370 firmly in the ultraportable and thin-and-light laptop segment. This is a low-power design relative to desktop or high-performance mobile parts, and the data confirms that the chip's thermal solution does not need to be exotic. A capable air cooler with a modest heat pipe arrangement should suffice for sustained workloads, as the 4 nm process node from TSMC provides the efficiency headroom to maintain boost clocks under moderate thermal loads.

The socket is AMD Socket FP8, which is a BGA-style package designed for soldered installation—this means end users cannot upgrade or replace the processor, and cooling solutions are fixed by the laptop OEM rather than user-selectable. The 16 MB of L3 cache and dual-channel memory bus with 89.6 GB/s bandwidth are consistent with a power-conscious design, as wider memory interfaces would increase both power draw and cost. The integrated Radeon 890M graphics further consolidate the package, eliminating the need for a discrete GPU in many productivity scenarios and reducing overall system power requirements.

Given the 28 W TDP, thermal throttling is unlikely to be a primary concern in well-designed chassis. The benchmark scores, particularly the R23 multi-core result of 29,870, indicate that the chip can sustain high throughput without requiring aggressive cooling solutions. The absence of a multiplier unlock confirms this is not an enthusiast overclocking part; instead, it is a tuned mobile processor where the OEM's cooling design dictates sustained performance. Users should expect consistent performance in standard thin-and-light laptops, with no need for oversized cooling systems or high-airflow chassis.

Benchmark Performance

The average benchmark score of 38,195 places the Ryzen AI 9 HX 370 in the 90th percentile of all CPUs, a strong showing for a mobile part. The highest single benchmark result is PassMark data compression at 445,719, while the lowest is PassMark find prime numbers at 126, illustrating the chip's divergent strengths and weaknesses. In integer math, the score of 122,933 is notably high, while floating-point math reaches 76,892—both figures indicate strong general-purpose compute capability.

In 3DMark, the chip's single-thread score of 1,153 is relatively modest, but the 16-thread score of 9,365 shows excellent scaling for gaming and content creation workloads that leverage multiple cores. The Cinebench R23 multi-core score of 29,870 is particularly strong for a 28 W part, rivaling many desktop processors from previous generations. PassMark multithread performance of 35,148 confirms this trend, while the single-thread score of 3,973 is competitive but not class-leading.

The data shows the chip is well-balanced rather than specialized. Memory bandwidth of 89.6 GB/s supports the dual-channel DDR5 and LPDDR5X memory support, and the PCIe Gen 4 interface with 16 lanes provides adequate connectivity for modern SSDs and GPUs. The 4 nm process node and 233 mm² die size indicate a dense, efficient design, and the 80 KB L1 cache per core with 1 MB L2 per core provides sufficient on-die storage for latency-sensitive workloads.

How It Compares

The Intel Xeon w3-2525 is the closest rival, with an average score of 38,122 versus the HX 370's 38,195—a delta of 0.2% in favor of the AMD part. This is a statistical tie, meaning the two processors deliver nearly identical overall performance despite their different market positions. The Xeon is a workstation-class chip, while the HX 370 is a mobile part, yet their benchmark averages align closely, suggesting the AMD chip's efficiency does not come at a significant performance cost.

The Intel Core i5-14490F trails by 0.2%, with an average score of 38,288. This is another near-tie, and the delta is within run-to-run variance. The HX 370 matches a desktop-oriented Core i5 in aggregate benchmarks, which is remarkable given the TDP disparity. However, this rival comparison does not account for power draw or thermal characteristics, only raw average scores.

The Intel Core i5-13600K scores 38,085, which is 0.3% lower than the HX 370. This is effectively a dead heat, with the AMD chip holding a razor-thin edge. The i5-13600K is a popular desktop part, and the HX 370's ability to match it in average benchmark scores highlights the efficiency of the Zen 5 architecture. Still, the delta is negligible and should not be interpreted as a meaningful performance win.

The Intel Core Ultra 5 225F has an average score of 38,305, which is 0.3% higher than the HX 370. This is the only rival that edges out the AMD chip, but the margin is minuscule. The Core Ultra 5 225F represents Intel's newer architecture, and its slight lead suggests the two companies are closely matched at this performance tier. For users, the choice between these processors would depend on platform features and availability rather than benchmark scores alone.

FAQ

Q: How does the Ryzen AI 9 HX 370 compare to its closest rival in aggregate performance?

A: The AMD chip's average benchmark score is 38,195, which is 0.2% higher than the Intel Xeon w3-2525 (38,122) and 0.3% higher than the Intel Core i5-13600K (38,085). It trails the Intel Core Ultra 5 225F by 0.3%, whose average score is 38,305.

Q: What is the processor's threading capability?

A: The Ryzen AI 9 HX 370 has 12 cores and 24 threads, with a base clock of 2.00 GHz and a boost clock of 5.10 GHz. The 3DMark max-thread score is 9,725, while the 16-thread score is 9,365.

Q: What cache hierarchy does the chip use?

A: It features 80 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The total L3 cache is 16 MB, and there is no 3D V-Cache option listed.

Q: What memory and expansion options are supported?

A: The processor supports DDR5 and LPDDR5X memory in a dual-channel configuration, providing 89.6 GB/s of memory bandwidth. It offers PCIe Gen 4 with 16 lanes for CPU-attached devices, and ECC memory is not supported.

Q: What is the integrated graphics solution?

A: The chip includes Radeon 890M integrated graphics, which eliminates the need for a discrete GPU in basic graphics and media workloads. The integrated GPU is part of the same FP8 socket package.

Q: What is the processor's production status and process node?

A: The Ryzen AI 9 HX 370 is currently Active in production, manufactured on TSMC's 4 nm process with a die size of 233 mm². It uses the AMD Socket FP8 and is based on the Zen 5 architecture under the Strix Point codename.