AMD Ryzen AI 9 HX 375

The AMD Ryzen AI 9 HX 375 is a 12-core, 24-thread mobile processor built on the Zen 5 architecture, with a base clock of 2.00 GHz and a boost clock of 5.10 GHz. It sits in the 92nd percentile of all CPUs tracked in the database, with an average benchmark score of 46329. This places it in a competitive tier for high-end laptops, but its specific strengths and weaknesses dictate where it fits best.

Who Should Consider It

The benchmark data suggests this chip is a strong all-rounder, but its performance profile leans toward specific workloads. For gamers, the integrated Radeon 890M graphics and strong single-thread performance — a Cinebench R23 single-core score of 3949 — indicate it can handle modern titles at reasonable settings, though the 28 W TDP class means sustained gaming performance will depend heavily on the laptop's cooling solution. The PassMark single-thread score of 3867 reinforces that day-to-day responsiveness and lightly-threaded game engines will run smoothly.

For content creators, the data is more compelling. The Cinebench R23 multi-core score of 27978 and PassMark multithread score of 32916 show strong parallel throughput for video encoding, 3D rendering, and batch photo processing. The PassMark data compression score of 404918 is particularly notable, indicating excellent performance in file archiving and compression tasks. Similarly, the floating-point math score of 75153 and integer math score of 121754 suggest robust number-crunching capability for scientific or financial simulations.

Office workers and general productivity users will find this processor overkill for basic tasks, but the high single-thread scores and 24 threads mean it will never feel sluggish, even with dozens of browser tabs, spreadsheets, and communication apps running simultaneously. The data encryption score of 20802 and extended instructions score of 29269 also indicate strong security and cryptography performance, useful for VPNs, disk encryption, and secure communications. However, users who primarily need battery life over performance might find the 28 W TDP class more power-hungry than lower-tier alternatives.

Power and Thermals

The processor carries a TDP of 28 W, which classifies it as a mid-power mobile chip rather than a high-performance HX-series part. This is a thermally efficient design for a 12-core, 24-thread processor, but it still requires a capable cooling solution. A thin-and-light laptop with a basic heatpipe may struggle to maintain boost clocks under sustained multi-core loads.

Benchmark results indicate the chip can deliver high throughput, but that performance is contingent on the thermal headroom provided by the laptop chassis. Users should look for designs with dual fans or vapor chambers, as the 28 W TDP means the processor can draw enough power to generate significant heat under full load. The 4 nm process node from TSMC helps efficiency, but the 233 mm² die size means there is a substantial amount of silicon to cool. For sustained workloads like video rendering or long compilation tasks, a laptop with a robust cooling system is essential to avoid thermal throttling.

Benchmark Performance

The data shows a processor that trades blows with its closest rivals, often within a single percentage point. In Cinebench R23 multi-core, the score of 27978 is strong, and the R20 multi-core score of 11750 and R15 multi-core score of 2820 follow the expected scaling pattern. The single-core progression — R15 at 397, R20 at 1658, and R23 at 3949 — shows consistent, high per-thread performance that matches or exceeds many desktop parts.

The PassMark suite paints a detailed picture. The multithread score of 32916 is the headline figure, but the component scores reveal strengths and weaknesses. The find prime numbers score of 122 is surprisingly low, suggesting that highly integer-heavy, cache-sensitive workloads may not be this chip's forte. Conversely, the random string sorting score of 44552 is robust, indicating good memory subsystem performance. The physics score of 1819 is modest, which could impact some simulation-based games or physics-heavy applications.

Compared to its average benchmark score of 46329, the processor sits almost exactly at the midpoint of its nearest rivals. It is 0.2% behind the Intel Core Ultra 9 285T, 0.3% behind the Intel Core Ultra 7 265T, and 0.6% behind the Intel Core i9-13900HX. It is 0.8% ahead of the AMD EPYC 7303. These deltas are so small that they fall within typical run-to-run variance, meaning real-world performance between these chips is effectively identical for most applications.

How It Compares

Intel Core Ultra 9 285T: The Ryzen AI 9 HX 375 trails this rival by a razor-thin 0.2% in average benchmark score. This effectively a tie, with the Ryzen offering similar multi-threaded throughput in Cinebench R23 while maintaining competitive single-core performance. The Intel part may have a different power profile, but based on scores alone, users should choose based on platform features rather than raw performance.

Intel Core Ultra 7 265T: A 0.3% deficit separates the Ryzen from this Intel part. The scores are nearly identical, and both processors will deliver indistinguishable performance in real-world tasks like video editing or software compilation. The Ryzen's 24 threads match the Intel's thread count, and the Cinebench results show no meaningful gap in either single- or multi-core workloads.

Intel Core i9-13900HX: This is the closest comparison in terms of performance class, with the Ryzen just 0.6% behind. The i9-13900HX is a high-power HX-series part, so the fact that the Ryzen matches it at a lower 28 W TDP is notable. However, the benchmark data does not capture sustained power delivery or thermal behavior, so the i9 may pull ahead in longer workloads if the laptop cooling allows.

AMD EPYC 7303: The Ryzen leads this server-class chip by 0.8%. This is a surprising result, as the EPYC 7303 is designed for datacenter workloads. The Ryzen's newer Zen 5 architecture and higher clock speeds likely compensate for the EPYC's larger core count and memory bandwidth. For mobile users, this comparison confirms that the Ryzen is a serious compute performer, not just a thin-and-light convenience.

FAQ

Q: Does this processor support ECC memory?

A: No, the data indicates ECC memory is not supported, so it is not intended for mission-critical server or workstation builds requiring error-correcting memory.

Q: What integrated graphics does it include?

A: It features the Radeon 890M integrated graphics, which allows for gaming and graphics tasks without a discrete GPU, though performance will vary based on the laptop's power and cooling design.

Q: What is the maximum memory bandwidth?

A: The memory bus is dual-channel, providing a peak bandwidth of 89.6 GB/s, which supports the strong data compression and sorting scores seen in the benchmarks.

Q: Is the processor overclockable?

A: No, the multiplier is locked, so users cannot manually overclock the CPU. Performance tuning is limited to what the laptop manufacturer provides through firmware settings.

Q: How many PCIe lanes are available?

A: The CPU provides 16 lanes of PCIe Gen 4, which is sufficient for a discrete GPU and one or two NVMe SSDs, though the exact configuration depends on the laptop's design.

Q: What is the production status?

A: The processor is listed as Active in production, meaning it is currently available for laptop manufacturers to integrate into new systems.

Platform and Compatibility

The Ryzen AI 9 HX 375 uses the AMD Socket FP8, which is a mobile-specific socket designed for laptops and compact devices. It is not compatible with desktop AM5 or other server sockets, so upgrades are limited to the laptop's motherboard. The processor supports DDR5 and LPDDR5X memory in a dual-channel configuration, with a peak bandwidth of 89.6 GB/s. This memory support is adequate for the processor's performance class, though users should ensure they purchase laptops with sufficient memory speed to avoid bottlenecking the CPU.

PCIe support is Gen 4 with 16 lanes available from the CPU. This allows for a discrete graphics card and high-speed NVMe storage, but it does not support PCIe Gen 5 devices. The integrated Radeon 890M GPU is the primary graphics solution for systems without a discrete GPU, and it leverages the same memory pool as the CPU.

The processor is part of the Strix Point codename family, built on the Zen 5 architecture at TSMC's 4 nm process node. The die size is 233 mm², which is relatively large for a mobile chip, reflecting the 12 cores and 24 threads packed into the package. The L1 cache is 80 KB per core, L2 is 1 MB per core, and L3 is 16 MB shared. This cache hierarchy supports the strong single-thread performance seen in Cinebench R23 and PassMark single-thread tests.

Upgrade path is essentially non-existent for end users, as the FP8 socket is soldered to the motherboard in most laptop designs. The production status is Active, meaning new laptops with this processor are currently being manufactured. The part number is 100-000001682, and it is classified as a Mobile market segment processor. The architecture is Zen 5, with the generation listed as Ryzen AI (Zen 5), indicating this is part of AMD's AI-focused mobile lineup, though the benchmark data does not include any specific AI workload scores to evaluate that capability.