Intel Arc Graphics 4 Xe Mobile vs Intel Arc Pro B70 Comparison

FAQ

Q: What are the two GPUs being compared in this database entry?

A: The two GPUs are the Intel Arc Graphics 4 Xe Mobile, an integrated graphics processor from the Panther Lake generation, and the Intel Arc Pro B70, a discrete professional graphics card from the Battlemage Pro Series.

Q: How do the shading unit counts differ between the two?

A: The Intel Arc Graphics 4 Xe Mobile has 512 shading units, while the Intel Arc Pro B70 has 4096 shading units. This is an eightfold difference in the core execution resource count.

Q: What is the difference in memory configuration?

A: The Intel Arc Graphics 4 Xe Mobile uses System Shared memory with a bus width and bandwidth that are System Dependent. The Intel Arc Pro B70 has 32 GB of GDDR6 memory on a 256-bit bus, delivering 608.0 GB/s of bandwidth.

Q: What are the boost clock speeds for each GPU?

A: The Intel Arc Graphics 4 Xe Mobile has a boost clock of 2300 MHz, while the Intel Arc Pro B70 boosts to 2800 MHz.

Q: Which GPU has a larger die size?

A: The Intel Arc Pro B70 has a die size of 368 mm², whereas the die size for the Intel Arc Graphics 4 Xe Mobile is listed as unknown in the database.

Q: What are the TDP ratings for the two parts?

A: The Intel Arc Graphics 4 Xe Mobile is rated at 25 W, while the Intel Arc Pro B70 is rated at 230 W.

The Verdict

The data presents two dramatically different products. The Intel Arc Graphics 4 Xe Mobile is an integrated GPU (IGP) built on a 3 nm process, designed for portable devices. The Intel Arc Pro B70 is a dual-slot discrete card on TSMC's 5 nm process, requiring an external 8-pin power connector and a 550 W suggested power supply.

Benchmark results indicate the Intel Arc Pro B70 is the dominant performer. Its shading unit count of 4096 versus 512, its 32 GB of dedicated GDDR6 memory versus shared system memory, and its 22.94 TFLOPS FP32 throughput versus 2.355 TFLOPS for the mobile part all point to a professional-grade compute and rendering workhorse. The mobile part, with a 25 W TDP, is clearly intended for basic graphics acceleration in thin-and-light systems.

Specific users should pick based on workload. The Intel Arc Pro B70 suits tasks requiring high memory bandwidth (608.0 GB/s), massive frame buffers, and sustained rendering performance. The Intel Arc Graphics 4 Xe Mobile suits portable devices where power draw and physical footprint are constrained, and where system memory is sufficient for the task. The launch MSRP for the Arc Pro B70 is 949 USD, which the database records once without further commentary. No such price field exists for the mobile part.

Head-to-Head Benchmarks

The database currently records no head-to-head benchmark scores, and both parts show an average benchmark score of 0 with zero wins each. However, the raw specification data provides a clear comparative picture.

The most decisive advantage for the Intel Arc Pro B70 appears in its FP32 compute throughput. It delivers 22.94 TFLOPS versus 2.355 TFLOPS for the Intel Arc Graphics 4 Xe Mobile. That represents a 9.7x gap in raw single-precision floating-point performance, a difference that would dominate any compute-heavy professional workload.

Texture fill rate shows a similar story. The Arc Pro B70 achieves 716.8 GTexel/s against 73.60 GTexel/s for the mobile part, a 9.7x difference. Pixel rate is also lopsided: 358.4 GPixel/s versus 36.80 GPixel/s, again a 9.7x margin. These figures suggest that even in purely fill-rate-bound scenarios, the discrete card would finish tasks nearly ten times faster.

Memory bandwidth is where the gap becomes even more extreme. The Arc Pro B70 offers 608.0 GB/s of dedicated GDDR6 bandwidth, while the mobile part's bandwidth is listed as System Dependent, meaning it relies entirely on whatever memory bandwidth the host portable device provides. In practice, shared system memory typically operates at far lower bandwidth than dedicated GDDR6, so the effective gap could be even larger than the 608.0 GB/s figure suggests.

Clock speeds are the one area where the mobile part is not as far behind. The Arc Graphics 4 Xe Mobile has a base clock of 300 MHz and a boost of 2300 MHz. The Arc Pro B70 has a base of 2280 MHz and a boost of 2800 MHz. While the boost clocks are within 22% of each other, the base clock difference is enormous (300 MHz vs 2280 MHz). The database records no game clock for either part, so sustained real-world frequency behavior is not quantified here.

The FP16 figures follow the same pattern as FP32: the Arc Pro B70 delivers 45.88 TFLOPS (2:1) versus 4.710 TFLOPS (2:1) for the mobile part. This confirms that the performance hierarchy holds consistently across precision formats, reinforcing the interpretation that the Arc Pro B70 is a professional compute device while the mobile part is a general-purpose integrated solution.

Specification Differences

The two GPUs differ in nearly every measurable specification category.

Process Node and Foundry: The Intel Arc Graphics 4 Xe Mobile is fabricated on a 3 nm process at Intel. The Intel Arc Pro B70 is fabricated on a 5 nm process at TSMC.

Die Size: The Arc Pro B70 has a die size of 368 mm². The mobile part's die size is unknown.

Clocks: The mobile part has a 300 MHz base and 2300 MHz boost. The discrete card has a 2280 MHz base and 2800 MHz boost. The memory clock for the Arc Pro B70 is 2375 MHz with 19 Gbps effective data rate. The mobile part's memory clock is listed as System Shared.

Memory System: The Arc Graphics 4 Xe Mobile uses System Shared memory, with System Shared type, bus width, and System Dependent bandwidth. The Arc Pro B70 has 32 GB GDDR6, a 256-bit bus, and 608.0 GB/s bandwidth.

Core Configuration: The mobile part has 512 shading units, 32 TMUs, 16 ROPs, and 4 RT cores. The discrete card has 4096 shading units, 256 TMUs, 128 ROPs, and 32 RT cores.

Performance Rates: The mobile part has 36.80 GPixel/s and 73.60 GTexel/s. The Arc Pro B70 has 358.4 GPixel/s and 716.8 GTexel/s.

Power and Cooling: The mobile part is an IGP with a 25 W TDP and no power connectors. The discrete card is a dual-slot design with a 230 W TDP, one 8-pin power connector, and a 550 W suggested PSU.

Physical Interface: The mobile part uses an IGP bus interface. The Arc Pro B70 uses PCIe 5.0 x16.

Dimensions: The Arc Pro B70 measures 267 mm in length, 110 mm in height, and 39 mm in width. The mobile part has no recorded dimensions, as it is integrated into a portable device.

Display Outputs: The mobile part's outputs are Portable Device Dependent. The Arc Pro B70 has 1x HDMI 2.1a and 3x DisplayPort 2.1.

Release Dates: The mobile part was released on 2026-01-26. The Arc Pro B70 was released on 2026-03-25.

Production Status: The mobile part is Active. The Arc Pro B70's production status is not recorded.

Architecture Differences

The two GPUs belong to entirely different architectural generations and design philosophies.

The Intel Arc Graphics 4 Xe Mobile uses the Xe3-LPG architecture, part of the Arc Graphics-M (Panther Lake) generation. This is Intel's third-generation Xe architecture in its low-power graphics variant, designed specifically for integration into mobile processors. The 3 nm process node at Intel suggests a focus on density and power efficiency, consistent with its 25 W TDP and IGP form factor.

The Intel Arc Pro B70 uses the Xe2-HPG architecture, part of the Battlemage (Pro Series) generation. This is a high-performance graphics architecture built for discrete professional cards. The 5 nm process at TSMC, combined with a 368 mm² die, indicates a design optimized for raw throughput rather than power efficiency. The 230 W TDP and dual-slot cooler confirm this priority.

The core count disparity reflects the architectural difference. The mobile part fields 512 shading units, 32 TMUs, 16 ROPs, and 4 RT cores. The discrete part has 4096 shading units, 256 TMUs, 128 ROPs, and 32 RT cores. Each of these is exactly 8x the mobile part's count, suggesting the Arc Pro B70 is essentially a full-scale implementation of a design that the mobile part uses in a heavily cut-down form.

Memory architecture also diverges fundamentally. The mobile part relies on System Shared memory, meaning it has no dedicated VRAM and the bus width, bandwidth, and capacity all depend on the host system's configuration. The Arc Pro B70 has a dedicated 32 GB GDDR6 frame buffer with a fixed 256-bit bus and 608.0 GB/s bandwidth. This distinction matters for professional workloads where large datasets must reside in VRAM to avoid system memory bottlenecks.

Both parts support identical API levels: DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. This means feature-level compatibility is the same, but the performance headroom to exploit those APIs is vastly different.

The clock behavior also shows an architectural difference. The mobile part's 300 MHz base clock is extremely low, indicating aggressive power gating and a design that ramps up to 2300 MHz only under load. The discrete card's 2280 MHz base clock suggests it operates near its maximum frequency continuously, a behavior suited to sustained professional workloads.

Where Each One Wins

The Intel Arc Pro B70 wins decisively in every computational throughput category recorded in the database.

For FP32 compute, the Arc Pro B70's 22.94 TFLOPS versus 2.355 TFLOPS makes it the clear choice for scientific simulations, AI inference, and any workload that relies on single-precision floating-point math. The FP16 figures, 45.88 TFLOPS versus 4.710 TFLOPS, extend that advantage to mixed-precision training and inference tasks.

For memory-bound workloads, the Arc Pro B70's 608.0 GB/s dedicated bandwidth versus the mobile part's System Dependent shared memory gives it an overwhelming advantage. Large 3D scenes, high-resolution texture streaming, and datasets that exceed system memory cache sizes will all benefit from the discrete card's dedicated GDDR6 frame buffer. The 32 GB capacity also enables workloads that require massive in-VRAM data residency.

For rasterization throughput, the Arc Pro B70's 358.4 GPixel/s and 716.8 GTexel/s versus 36.80 GPixel/s and 73.60 GTexel/s means it completes pixel and texture-bound rendering tasks roughly ten times faster. This includes high-resolution display output, multi-monitor configurations, and heavy post-processing effects.

The Arc Pro B70 also offers a fixed interface: PCIe 5.0 x16, dual-slot cooling, and three DisplayPort 2.1 outputs plus one HDMI 2.1a. This makes it suitable for fixed workstations where connectivity and expansion are known quantities.

The Intel Arc Graphics 4 Xe Mobile wins in the categories of power efficiency and physical footprint. Its 25 W TDP versus 230 W means it draws approximately one-ninth the power. Its IGP form factor requires no slot width, no power connectors, and no suggested PSU rating. The database records no dimensions for it, reflecting its integration into a portable device rather than a standalone card.

The mobile part's 3 nm process node versus the discrete card's 5 nm node also suggests it is built for energy efficiency. In a portable device, this translates to longer battery life and less thermal burden.

The mobile part also wins on release timing, appearing in the database on 2026-01-26 versus the Arc Pro B70's 2026-03-25. For platform designers, the earlier availability of the integrated part could influence product planning cycles.

Neither part has recorded benchmark scores, rival comparisons, or percentile data beyond a shared 50th percentile placeholder. The database shows zero wins for each in head-to-head competition. The specification analysis must therefore stand as the primary evidence for their respective strengths.