Intel Arc Graphics 2 Xe Mobile vs Intel Data Center GPU Max 1350 Comparison

Where Each One Wins

The Intel Arc Graphics 2 Xe Mobile and the Intel Data Center GPU Max 1350 occupy opposite ends of Intel's graphics spectrum, and the recorded specifications make the use-case separation unusually clear. The Arc Graphics 2 Xe Mobile is an integrated graphics processor (IGP) built for portable devices, with a 25 W TDP and system-shared memory. The Data Center GPU Max 1350 is an OAM module designed for compute environments, drawing 450 W and carrying 96 GB of dedicated HBM2e memory.

The Arc Graphics 2 Xe Mobile wins in efficiency and portability. Its 25 W power envelope allows it to operate as an IGP with no power connectors, meaning it draws entirely from the host platform. The Data Center GPU Max 1350 requires an 850 W suggested power supply, a figure that excludes it from any mobile or compact deployment. The mobile part also supports DirectX 12 Ultimate (12_2) and Vulkan 1.4, while the data center part lists DirectX 12 (12_1) and no Vulkan entry. For client-facing workloads, particularly those relying on modern graphics APIs, the mobile part has the feature advantage.

The Data Center GPU Max 1350 wins in raw compute. Its FP32 throughput is 44.44 TFLOPS, dwarfing the mobile part's 1,280.0 GFLOPS. FP16 performance is also one-sided: the data center part delivers 44.44 TFLOPS at a 1:1 ratio, while the mobile part reaches 2.560 TFLOPS with a 2:1 ratio. Texture rate tells the same story, with 1,388.8 GTexel/s versus 40.00 GTexel/s. The data center part also has 112 ray tracing cores, compared to 2 on the mobile part, and 14,336 shading units against 256.

Memory capacity separates the two absolutely. The Data Center GPU Max 1350 carries 96 GB of HBM2e across an 8192-bit bus, yielding 2.46 TB/s of bandwidth. The mobile part uses system-shared memory with bandwidth described as system dependent. No workload that requires large in-memory datasets or high-bandwidth access can be served by the mobile part in the same way.

Architecture Differences

The two GPUs come from different architectural lineages and manufacturing processes. The Arc Graphics 2 Xe Mobile uses the Wildcat Lake chip with Xe3-LPG architecture on Intel's 3 nm process. The Data Center GPU Max 1350 uses the Ponte Vecchio chip with Generation 12.5 architecture on a 10 nm process. The transistor counts reflect the scale gap: the data center part integrates 100,000 million transistors on a 1280 mm² die, with a transistor density of 78.1M per mm². The mobile part lists transistor count and die size as unknown, but its 3 nm node indicates a much smaller, denser implementation.

Clock behavior differs as well. The mobile part has a base clock of 300 MHz and a boost clock of 2500 MHz, a wide frequency range suited to bursty mobile workloads. The data center part runs at 750 MHz base and 1550 MHz boost, with memory clocked at 1200 MHz (2.4 Gbps effective). The mobile part's memory clock is listed as system shared, reinforcing its dependence on host memory.

Render output configuration marks another fundamental difference. The mobile part has 8 ROPs and a pixel rate of 20.00 GPixel/s. The data center part has 0 ROPs and a pixel rate of 0 MPixel/s, indicating it is not designed for traditional rasterized display output. Its display outputs are listed as "No outputs," while the mobile part's display outputs are portable device dependent. The data center part uses a PCIe 5.0 x16 bus interface, while the mobile part uses an IGP interface with no bus slot.

The API support sets them apart for software compatibility. The mobile part supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The data center part supports DirectX 12 (12_1) and OpenGL 4.6, with no Vulkan entry. The mobile part's newer DirectX feature level and Vulkan support make it more aligned with consumer graphics software stacks. The data center part's API list reflects its compute-oriented role rather than a client graphics role.

FAQ

Q: Which GPU has a higher boost clock?

A: The Intel Arc Graphics 2 Xe Mobile has a boost clock of 2500 MHz, compared to 1550 MHz for the Intel Data Center GPU Max 1350. The mobile part also has a lower base clock at 300 MHz versus 750 MHz.

Q: How much memory bandwidth does each GPU provide?

A: The Data Center GPU Max 1350 provides 2.46 TB/s through 96 GB of HBM2e on an 8192-bit bus. The Arc Graphics 2 Xe Mobile uses system shared memory with bandwidth listed as system dependent.

Q: What is the power consumption difference?

A: The Arc Graphics 2 Xe Mobile has a 25 W TDP and requires no power connectors. The Data Center GPU Max 1350 has a 450 W TDP and a suggested power supply of 850 W.

Q: Which GPU supports DirectX 12 Ultimate?

A: Only the Intel Arc Graphics 2 Xe Mobile supports DirectX 12 Ultimate (12_2). The Intel Data Center GPU Max 1350 supports DirectX 12 (12_1), a lower feature level.

Q: How do the FP32 performance figures compare?

A: The Data Center GPU Max 1350 delivers 44.44 TFLOPS of FP32 performance. The Arc Graphics 2 Xe Mobile delivers 1,280.0 GFLOPS, which is approximately 34.7 times less.

Q: Are both GPUs currently in production?

A: Yes, both are listed as active in production. The Arc Graphics 2 Xe Mobile has a release date of April 15, 2026, while the Data Center GPU Max 1350 was released on January 9, 2023.

Specification Differences

The two GPUs differ across nearly every measured specification. The process node is 3 nm for the mobile part and 10 nm for the data center part. The data center part uses the Ponte Vecchio chip with 100,000 million transistors on a 1280 mm² die. The mobile part uses the Wildcat Lake chip with unknown transistor count and die size.

Shading units number 256 on the mobile part versus 14,336 on the data center part. Texture mapping units are 16 versus 896. Render output units are 8 versus 0. Ray tracing cores are 2 versus 112. Neither part lists tensor cores.

Clock speeds diverge in both directions. The mobile part has a 300 MHz base and 2500 MHz boost. The data center part has a 750 MHz base and 1550 MHz boost. Memory clocks are system shared for the mobile part and 1200 MHz (2.4 Gbps effective) for the data center part.

Memory capacity ranges from system shared on the mobile part to 96 GB of HBM2e on the data center part. Bus width is system shared versus 8192 bit. Bandwidth is system dependent versus 2.46 TB/s.

Pixel rate is 20.00 GPixel/s on the mobile part and 0 MPixel/s on the data center part. Texture rate is 40.00 GTexel/s versus 1,388.8 GTexel/s. FP32 is 1,280.0 GFLOPS versus 44.44 TFLOPS. FP16 is 2.560 TFLOPS (2:1) versus 44.44 TFLOPS (1:1).

Power and physical specifications differ completely. The mobile part has a 25 W TDP, IGP slot width, no power connectors, and an IGP bus interface. The data center part has a 450 W TDP, OAM Module slot width, an 850 W suggested PSU, and PCIe 5.0 x16 interface. Display outputs are portable device dependent on the mobile part and absent on the data center part.

API support differs on DirectX and Vulkan. The mobile part supports DirectX 12 Ultimate (12_2) and Vulkan 1.4. The data center part supports DirectX 12 (12_1) and has no Vulkan entry. Both support OpenGL 4.6.

Release timing separates them by more than three years. The data center part launched on January 9, 2023, and has a listed successor, the H3C Graphics. The mobile part launched on April 15, 2026, and lists its predecessor as HD Graphics-M.

Head-to-Head Benchmarks

The database records no direct benchmark scores for either GPU. Both parts have an average benchmark score of 0 and a percentile versus all GPUs of 50. The nearest rival lists are empty for both items, so the comparison must rest entirely on the specification data.

The largest single numerical gap appears in FP32 compute. The Data Center GPU Max 1350 delivers 44.44 TFLOPS, which is 34.7 times the 1,280.0 GFLOPS of the Arc Graphics 2 Xe Mobile. In FP16, the data center part again delivers 44.44 TFLOPS, while the mobile part reaches 2.560 TFLOPS. The data center part's 1:1 FP16 ratio means it does not trade precision for speed, while the mobile part's 2:1 ratio indicates half-rate FP16 execution.

Texture rate shows a similar order of magnitude difference. The data center part processes 1,388.8 GTexel/s against 40.00 GTexel/s for the mobile part, a factor of 34.7. The shading unit count scales in the same proportion: 14,336 versus 256, also a factor of 56. The texture mapping unit count of 896 versus 16 is a factor of 56 as well. The data center part's 112 ray tracing cores versus 2 gives it a 56 to 1 advantage in that resource.

Memory bandwidth is the most extreme differentiator. The data center part's 2.46 TB/s is not directly comparable to the mobile part's system dependent bandwidth, since the latter depends entirely on the host platform's memory subsystem. The 96 GB capacity versus system shared memory means the data center part can hold datasets that would never fit in a mobile platform's shared pool.

The mobile part counters with clock speed and API currency. Its 2500 MHz boost clock exceeds the data center part's 1550 MHz by 950 MHz, a 61.3% higher boost. Its DirectX 12 Ultimate (12_2) support and Vulkan 1.4 support give it a software feature set that the data center part lacks. Its pixel rate of 20.00 GPixel/s, while modest, is infinitely higher than the data center part's 0 MPixel/s, confirming that rasterization output is simply not a function the data center part performs.

Power efficiency follows the expected pattern. The mobile part delivers 1,280.0 GFLOPS within a 25 W TDP, while the data center part delivers 44.44 TFLOPS within a 450 W TDP. Per watt, the mobile part provides 51.2 GFLOPS per watt against 98.8 GFLOPS per watt for the data center part, meaning the data center part is roughly 1.9 times more compute efficient despite its much larger absolute power draw. The mobile part's advantage lies in its ability to function without any external power delivery, while the data center part requires a suggested 850 W power supply.

The two GPUs are not substitutes. One is an integrated graphics solution for portable devices with modern client API support and minimal power draw. The other is a compute-oriented OAM module with massive memory capacity, extreme bandwidth, and no display outputs. Every meaningful specification confirms that the Data Center GPU Max 1350 is built for throughput-heavy datacenter workloads, while the Arc Graphics 2 Xe Mobile is built for integration into mobile systems where power and physical footprint are constrained.