Intel Arc G3 vs Intel Arc Pro B70 Comparison

Intel Arc G3 vs Intel Arc Pro B70

FAQ

Q: What are the core architectural generations of these two Intel GPUs?

A: The Intel Arc G3 uses the Xe3-LPG architecture on the Panther Lake chip, built on Intel’s 3 nm process. The Intel Arc Pro B70 uses the Xe2-HPG architecture on the BMG-G31 chip, built on TSMC’s 5 nm process.

Q: How much memory does each GPU have, and what type?

A: The Arc G3 shares system memory with no dedicated VRAM, with size, type, and bus width all listed as “System Shared.” The Arc Pro B70 has 32 GB of GDDR6 on a 256-bit bus, delivering 608.0 GB/s of bandwidth.

Q: What is the difference in shading unit count?

A: The Arc G3 has 1280 shading units, while the Arc Pro B70 has 4096 shading units. The B70 also has 256 texture mapping units versus 40, and 128 raster output units versus 20.

Q: What are the boost clock speeds for each card?

A: The Arc G3 boosts to 2400 MHz from a 300 MHz base. The Arc Pro B70 boosts to 2800 MHz from a 2280 MHz base.

Q: Which card has higher raw FP32 compute?

A: The Arc Pro B70 delivers 22.94 TFLOPS of FP32 performance, compared to 6.144 TFLOPS for the Arc G3. That is a substantial margin in raw throughput.

Q: What is the physical form factor and power requirement of each?

A: The Arc G3 is an IGP (integrated graphics processor) with no power connectors and a 25 W TDP, using a portable-device-dependent display output. The Arc Pro B70 is a dual-slot card, 267 mm long, 110 mm high, and 39 mm wide, with a 230 W TDP, one 8-pin power connector, and a suggested 550 W PSU.

The Verdict

The data points to two entirely different use cases. The Intel Arc G3, as an integrated GPU on the Panther Lake platform, is limited by its shared memory architecture and modest 25 W power envelope. Its 6.144 TFLOPS FP32 throughput and 1280 shading units place it in the entry-level integrated segment. The recorded percentile of 50 against all GPUs indicates mid-pack positioning among the entire database, but that percentile is shared with the Arc Pro B70, which has far more resources. For portable devices where power is constrained, the G3 is the only option listed.

The Intel Arc Pro B70, by contrast, is a dedicated, dual-slot add-in board with 32 GB of GDDR6 memory and 608.0 GB/s of bandwidth. Its 4096 shading units, 256 TMUs, and 128 ROPs deliver 22.94 TFLOPS FP32, nearly four times the G3’s throughput. The B70’s 2800 MHz boost clock and 358.4 GPixel/s pixel rate confirm it as a high-throughput workstation or prosumer part. Its launch MSRP is 949 USD. The B70 is the clear choice for workloads that demand dedicated memory bandwidth and sustained compute, while the G3 fits systems where physical space and thermal limits preclude a discrete card.

Head-to-Head Benchmarks

The recorded benchmark data shows no direct benchmark scores for either GPU, and the head-to-head benchmark list is empty. However, the specification tables provide ample quantitative comparison points. The most decisive gap is in FP32 compute: the Arc Pro B70 delivers 22.94 TFLOPS versus the Arc G3’s 6.144 TFLOPS. That is a 3.73 times advantage for the B70, a margin that will manifest in any shader-bound workload such as rendering or simulation.

Memory bandwidth tells a similar story. The B70’s 608.0 GB/s from 32 GB of GDDR6 on a 256-bit bus dwarfs the G3’s system-shared memory, which has bandwidth listed as “System Dependent.” Because the G3 has no dedicated VRAM, it competes with the CPU for memory access, which typically reduces effective bandwidth in real workloads. The B70’s dedicated 2375 MHz memory clock (19 Gbps effective) ensures predictable performance.

Pixel and texture throughput follow the same pattern. The B70 produces 358.4 GPixel/s and 716.8 GTexel/s, while the G3 produces 48.00 GPixel/s and 96.00 GTexel/s. The B70 is 7.47 times faster in pixel fill and 7.47 times faster in texture fill as well. These ratios mirror the ROP and TMU counts: 128 vs 20 ROPs and 256 vs 40 TMUs.

Clock speeds are also higher on the discrete card. The B70’s base clock of 2280 MHz exceeds the G3’s boost clock of 2400 MHz by a small margin, and the B70’s boost of 2800 MHz is 400 MHz higher than the G3’s boost. The G3’s extremely low 300 MHz base clock suggests aggressive power saving in idle or light-load states, typical of integrated parts.

Ray tracing hardware differs as well. The G3 includes 10 RT cores, while the B70 has 32 RT cores. With no benchmark scores recorded, the data cannot quantify the real-world delta, but the 3.2 times core count advantage suggests the B70 will handle ray-traced effects with significantly more throughput.

Both GPUs share the same API support: DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. This means software compatibility is identical, and the performance gap is purely a function of hardware resources.

Specification Differences

The two GPUs diverge on nearly every physical and performance specification. The Arc G3 is built on a 3 nm process by Intel, while the Arc Pro B70 uses TSMC’s 5 nm process. Die size is unknown for the G3 but is 368 mm² for the B70. Transistor counts are listed as unknown for both.

Memory configuration is the largest difference. The G3 uses system-shared memory with no dedicated size, type, or bus width. The B70 has 32 GB of GDDR6, a 256-bit bus, and 608.0 GB/s of bandwidth. The G3’s memory clock is also system-shared, whereas the B70 runs at 2375 MHz (19 Gbps effective).

Compute resources differ by a factor of 3.2 in shading units: 1280 vs 4096. The TMU count is 40 vs 256, and the ROP count is 20 vs 128. RT cores are 10 vs 32. The G3 has no listed tensor cores, and neither does the B70.

Clock speeds: the G3 has a 300 MHz base and 2400 MHz boost. The B70 has a 2280 MHz base and 2800 MHz boost. The G3’s pixel rate is 48.00 GPixel/s, texture rate 96.00 GTexel/s, FP32 6.144 TFLOPS, and FP16 12.29 TFLOPS (2:1). The B70’s pixel rate is 358.4 GPixel/s, texture rate 716.8 GTexel/s, FP32 22.94 TFLOPS, and FP16 45.88 TFLOPS (2:1).

Power and physical design: the G3 is an IGP with 25 W TDP, no power connectors, and no suggested PSU. The B70 is dual-slot, 267 mm by 110 mm by 39 mm, with a 230 W TDP, one 8-pin connector, and a suggested 550 W PSU. The G3 uses an IGP bus interface, while the B70 uses PCIe 5.0 x16.

Display outputs: the G3’s are “Portable Device Dependent,” meaning they vary by the host device. The B70 has 1x HDMI 2.1a and 3x DisplayPort 2.1.

Release dates differ: the G3 was released on 2026-05-31, and the B70 on 2026-03-25. The G3’s production status is “Active,” while the B70’s production status is null in the database. The B70 has a launch MSRP of 949 USD; the G3 has no MSRP listed.

Architecture Differences

The architectural split between the two is fundamental. The Arc G3 uses the Xe3-LPG architecture, which is part of the Arc Graphics-M (Panther Lake) generation. Xe3-LPG is a low-power variant designed for integrated use. The G3’s 3 nm process node from Intel is the smaller of the two processes, but the chip is clearly optimized for efficiency over throughput, given its 25 W TDP and shared memory design.

The Arc Pro B70 uses the Xe2-HPG architecture from the Battlemage (Pro Series) generation. Xe2-HPG is a high-performance graphics architecture aimed at discrete cards. The B70 is built on TSMC’s 5 nm process, which is larger than Intel’s 3 nm node but still advanced. The B70’s die size of 368 mm² is substantial, accommodating 4096 shading units, 256 TMUs, 128 ROPs, and 32 RT cores.

The memory architecture is a key differentiator. The G3 has no dedicated VRAM; it relies on system memory, which is shared with the CPU. This design limits bandwidth to what the host platform provides, and the database lists it as “System Dependent.” The B70 uses 32 GB of GDDR6 on a 256-bit bus, which is a conventional discrete GPU memory subsystem. The 608.0 GB/s bandwidth is a fixed, dedicated resource that does not compete with CPU traffic.

Clock behavior also reflects the architectural intent. The G3’s base clock of 300 MHz is extremely low, suggesting the GPU stays in a deep idle state until needed, then ramps to 2400 MHz. The B70’s base clock of 2280 MHz is close to its boost of 2800 MHz, indicating a design that maintains high clocks under load without the same power-saving extremes.

The ray tracing hardware differs in count: 10 RT cores on the G3 versus 32 on the B70. Both support DirectX 12 Ultimate, which includes ray tracing, so the API capability is present on both. The B70’s higher RT core count should provide more headroom for ray-traced workloads, but no benchmark scores are available to confirm the practical difference.

The G3 has no power connectors and is listed as an IGP, meaning it is soldered or integrated into a motherboard or portable device. The B70 is a standalone card with a dual-slot cooler, a 267 mm length, and a single 8-pin power connector. The B70 also requires a 550 W suggested PSU, a figure that reflects the entire system’s power draw, not just the GPU’s 230 W TDP.

The G3’s display outputs depend on the host portable device, which is typical for integrated GPUs. The B70 offers fixed display outputs: one HDMI 2.1a and three DisplayPort 2.1, which is a standard configuration for a professional or workstation card.

The process node difference, 3 nm for the G3 versus 5 nm for the B70, does not automatically confer an advantage in the other direction. The G3 uses its smaller node to fit into a low-power integrated package, while the B70 uses a larger node to deliver high clock speeds and high throughput. The G3’s transistor count and die size are unknown, so the density comparison cannot be made from the recorded data.