Intel Arc B770 vs Intel Data Center GPU Max Subsystem Comparison

Intel
GPU

Intel Arc B770

CORE STATE BMG-G31
VRAM 16 GB
CLOCK SPEED 2400 MHz
TDP 225 W
BUS WIDTH 256 bit
ARCHITECTURE Xe2-HPG
nm
PROCESS 5 nm
LAUNCH DATE 2026
VS
Intel
GPU

Data Center GPU Max Subsystem

CORE STATE Ponte Vecchio
VRAM 128 GB
CLOCK SPEED 1600 MHz
TDP 2400 W
BUS WIDTH 8192 bit
ARCHITECTURE Generation 12.5
nm
PROCESS 10 nm
LAUNCH DATE 2023

Analysis: Intel Arc B770 vs Intel Data Center GPU Max Subsystem

The Verdict

The Intel Arc B770 and Intel Data Center GPU Max Subsystem target entirely different segments, and the recorded data makes that separation explicit. The Arc B770 is a client-focused graphics card built on the Xe2-HPG architecture, designed for conventional rendering workloads with display outputs and a 225 W TDP. The Data Center GPU Max Subsystem is a compute-oriented accelerator with a 2400 W TDP, 128 GB of HBM2e memory, and no display outputs at all. Users seeking a standard desktop graphics card should select the Arc B770. Organizations deploying high-bandwidth compute accelerators without any video output requirement should select the Data Center GPU Max Subsystem. The two products do not compete in the same socket, power envelope, or use case, despite sharing the Intel manufacturer label.

Where Each One Wins

The Arc B770 wins in every client-facing metric that involves rendering to a screen. It provides 1x HDMI 2.1a and 3x DisplayPort 2.1 outputs, while the Data Center GPU Max Subsystem provides no outputs. The Arc B770 also operates within a 225 W TDP with a suggested power supply of 550 W, making it installable in conventional desktop configurations. Its base clock of 2100 MHz and boost clock of 2400 MHz are substantially higher than the 900 MHz base and 1600 MHz boost of the Data Center GPU.

The Data Center GPU Max Subsystem wins in raw compute throughput and memory capacity. It delivers 52.43 TFLOPS FP32 versus 19.66 TFLOPS for the Arc B770, a 2.67x advantage. Its FP16 throughput is 52.43 TFLOPS at 1:1 ratio, while the Arc B770 reaches 39.32 TFLOPS at a 2:1 ratio. Memory capacity is 128 GB versus 16 GB, an 8x difference. Memory bandwidth is 3.21 TB/s versus 512.0 GB/s, a 6.27x advantage. The Data Center GPU also uses a PCIe 5.0 x16 interface, while the Arc B770 uses PCIe 4.0 x16.

Architecture Differences

The Arc B770 uses the BMG-G31 chip built on Xe2-HPG architecture, fabricated on a 5 nm process at TSMC. Its die size is 368 mm². The Data Center GPU Max Subsystem uses the Ponte Vecchio chip on Generation 12.5 architecture, fabricated on a 10 nm process at Intel, with a die size of 1280 mm² and 100,000 million transistors. The transistor density of the Data Center GPU is recorded as 78.1M / mm².

The shading unit counts differ significantly: the Arc B770 has 4096 shading units, while the Data Center GPU has 16384, exactly 4x more. TMUs are 256 versus 1024, also a 4x difference. ROPs present a notable split: the Arc B770 has 128 ROPs, while the Data Center GPU has 0 ROPs, reflecting its lack of rasterization output stages. Ray tracing cores are 32 on the Arc B770 versus 128 on the Data Center GPU.

The memory subsystems use different technologies entirely. The Arc B770 uses 16 GB of GDDR6 on a 256 bit bus at 2000 MHz with 16 Gbps effective speed, producing 512.0 GB/s bandwidth. The Data Center GPU uses 128 GB of HBM2e on an 8192 bit bus at 1565 MHz with 3.1 Gbps effective speed, producing 3.21 TB/s bandwidth.

API support differs as well. The Arc B770 supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The Data Center GPU supports DirectX 12 (12_1) and OpenGL 4.6, with no Vulkan support recorded. Pixel rate for the Data Center GPU is listed as 0 MPixel/s, while the Arc B770 achieves 307.2 GPixel/s. Texture rate is 614.4 GTexel/s for the Arc B770 and 1,638.4 GTexel/s for the Data Center GPU.

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The Intel Data Center GPU Max Subsystem delivers 52.43 TFLOPS FP32, which is 2.67x the 19.66 TFLOPS of the Intel Arc B770.

Q: Can the Intel Data Center GPU Max Subsystem drive a display?

A: No. The recorded display outputs for the Data Center GPU Max Subsystem are listed as "No outputs", while the Arc B770 provides 1x HDMI 2.1a and 3x DisplayPort 2.1.

Q: What are the memory capacity and bandwidth differences?

A: The Data Center GPU Max Subsystem has 128 GB of HBM2e on an 8192 bit bus with 3.21 TB/s bandwidth. The Arc B770 has 16 GB of GDDR6 on a 256 bit bus with 512.0 GB/s bandwidth.

Q: How do the power requirements compare?

A: The Arc B770 has a 225 W TDP and a suggested power supply of 550 W. The Data Center GPU Max Subsystem has a 2400 W TDP and a suggested power supply of 2800 W.

Q: Which GPU supports Vulkan?

A: The Arc B770 supports Vulkan 1.4. The Data Center GPU Max Subsystem has no Vulkan support recorded in the database.

Q: What are the release dates of these two products?

A: The Intel Data Center GPU Max Subsystem was released on January 9, 2023. The Intel Arc B770 has a release date of December 31, 2025.

Head-to-Head Benchmarks

The database records no direct head-to-head benchmark results between the Arc B770 and the Data Center GPU Max Subsystem, and neither product has individual benchmark scores or nearest rivals listed. The comparison must therefore be drawn from the architectural and specification data recorded for each product.

The largest single advantage for the Data Center GPU Max Subsystem appears in FP32 throughput. At 52.43 TFLOPS, it more than doubles the 19.66 TFLOPS of the Arc B770. The FP16 comparison is more nuanced: the Data Center GPU sustains 52.43 TFLOPS at a 1:1 ratio, meaning it does not accelerate FP16 beyond its FP32 rate. The Arc B770 reaches 39.32 TFLOPS but does so at a 2:1 ratio, indicating its FP16 rate is derived from FP32 hardware with a doubling mechanism. Even with that ratio difference, the Data Center GPU still leads in absolute FP16 throughput.

Memory bandwidth is another decisive margin. The Data Center GPU's 3.21 TB/s is 6.27x the 512.0 GB/s of the Arc B770. The bus width difference drives this: 8192 bit versus 256 bit, a 32x difference in bus width, partially offset by the Arc B770's higher effective memory speed of 16 Gbps versus 3.1 Gbps.

Texture rate favors the Data Center GPU at 1,638.4 GTexel/s versus 614.4 GTexel/s, a 2.67x advantage that mirrors the shading unit and TMU ratios. Pixel rate is the reverse case: the Arc B770 produces 307.2 GPixel/s, while the Data Center GPU produces 0 MPixel/s because it has no ROPs. This makes the Arc B770 the only viable choice for any workload that requires rasterization output.

Clock speeds favor the Arc B770. Its 2100 MHz base clock is 2.33x the Data Center GPU's 900 MHz, and its 2400 MHz boost is 1.5x the 1600 MHz boost. This clock advantage partially compensates for the Data Center GPU's larger shader count in latency-sensitive workloads, though the raw throughput gap remains substantial.

Specification Differences

The two products differ in nearly every recorded specification field. The Arc B770 uses the BMG-G31 chip on Xe2-HPG architecture, while the Data Center GPU uses Ponte Vecchio on Generation 12.5. The process node is 5 nm at TSMC for the Arc B770 versus 10 nm at Intel for the Data Center GPU. Die size is 368 mm² versus 1280 mm². Transistor count is unknown for the Arc B770 versus 100,000 million for the Data Center GPU.

Clock specifications diverge sharply. Base clock is 2100 MHz versus 900 MHz. Boost clock is 2400 MHz versus 1600 MHz. Memory clock is 2000 MHz with 16 Gbps effective for the Arc B770 versus 1565 MHz with 3.1 Gbps effective for the Data Center GPU.

Memory configuration: 16 GB GDDR6 on a 256 bit bus versus 128 GB HBM2e on an 8192 bit bus. Bandwidth is 512.0 GB/s versus 3.21 TB/s. Shading units are 4096 versus 16384. TMUs are 256 versus 1024. ROPs are 128 versus 0. Ray tracing cores are 32 versus 128.

Power and physical specifications: TDP is 225 W versus 2400 W. The Arc B770 uses 1x 6-pin plus 1x 8-pin power connectors, while the Data Center GPU uses 1x 16-pin. Suggested PSU is 550 W versus 2800 W. Both are dual-slot cards. The Arc B770 has no recorded length, while the Data Center GPU is 267 mm or 10.5 inches long.

Interface and outputs: the Arc B770 uses PCIe 4.0 x16 and provides 1x HDMI 2.1a plus 3x DisplayPort 2.1. The Data Center GPU uses PCIe 5.0 x16 and provides no display outputs. API support: DirectX 12 Ultimate (12_2) versus DirectX 12 (12_1), OpenGL 4.6 for both, and Vulkan 1.4 for the Arc B770 with no Vulkan recorded for the Data Center GPU.

Production status is recorded only for the Data Center GPU, listed as Active. Its successor is the H3C Graphics. The Arc B770 has a predecessor listed as Alchemist. The Data Center GPU has no predecessor recorded. Release dates are January 9, 2023 for the Data Center GPU and December 31, 2025 for the Arc B770. Neither product has a launch MSRP recorded in the database, and no benchmark scores or nearest rivals are available for either.

DETAILED SPECIFICATIONS

SPECIFICATION
B770
Data Center GPU Max Subsystem
Core Specs
Shading Units
4,096
16,384 +300.0%
Shaders
4,096
16,384 +300.0%
TMUs
256
1,024 +300.0%
ROPs
128
0 -100.0%
Execution Units
32
1,024 +3100.0%
Clocks
Base Clock
2100 MHz
900 MHz
Boost Clock
2400 MHz
1600 MHz
Memory Clock
2000 MHz 16 Gbps effective
1565 MHz 3.1 Gbps effective
Memory
Memory Size
16 GB
128 GB
VRAM (MB)
16,384
131,072 +700.0%
Memory Type
GDDR6
HBM2e
Memory Bus
256 bit
8192 bit
Bandwidth
512.0 GB/s
3.21 TB/s
Cache
L1 Cache
64 KB (per EU)
L2 Cache
16 MB
408 MB
Performance
Pixel Rate
307.2 GPixel/s
0 MPixel/s
Texture Rate
614.4 GTexel/s
1,638.4 GTexel/s
FP32 (TFLOPS)
19.66 TFLOPS
52.43 TFLOPS
FP64 (TFLOPS)
2.458 TFLOPS (1:8)
52.43 TFLOPS (1:1)
FP16 (TFLOPS)
39.32 TFLOPS (2:1)
52.43 TFLOPS (1:1)
AI/RT
RT Cores
32
128 +300.0%
XMX Cores
256
1,024 +300.0%
Power
TDP
225 W
2400 W
TDP (W)
225
2,400 +966.7%
Suggested PSU
550 W
2800 W
Power Connectors
1x 6-pin + 1x 8-pin
1x 16-pin
Architecture
Architecture
Xe2-HPG
Generation 12.5
GPU Name
BMG-G31
Ponte Vecchio
Generation
Battlemage (Arc 7)
Data Center GPU (Ponte Vecchio)
Process Size
5 nm
10 nm
Transistors
unknown
100,000 million
Die Size
368 mm²
1280 mm²
Foundry
TSMC
Intel
Density
78.1M / mm²
API Support
DirectX
12 Ultimate (12_2)
12 (12_1)
OpenGL
4.6
4.6
Vulkan
1.4
OpenCL
3.0
3.0
Shader Model
6.6
6.6
Physical
Slot Width
Dual-slot
Dual-slot
Length
267 mm 10.5 inches
Outputs
1x HDMI 2.1a3x DisplayPort 2.1
No outputs
Bus Interface
PCIe 4.0 x16
PCIe 5.0 x16
Other
Production
Active
Predecessor
Alchemist
Successor
H3C Graphics
View Arc B770 Details View Data Center GPU Max Subsystem Details