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Intel Data Center GPU Max Subsystem

Intel graphics card specifications and benchmark scores

128 GB
VRAM
1600
MHz Boost
2400W
TDP
8192
Bus Width
Ray Tracing XMX Cores

At a Glance

Intel
VRAM 128 GB
Boost Clock 1,600 MHz
Shaders 16,384
Bus Width 8192-bit
TDP 2400W
Memory Type HBM2e
RT Cores 128
Architecture Generation 12.5
nm
Process 10 nm
Released Jan 2023

Intel Data Center GPU Max Subsystem Specifications

GPU Core

Shader units and compute resources

The Intel Data Center GPU Max Subsystem GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
16,384
Shaders
16,384
TMUs
1,024
Execution Units
1024

Data Center GPU Max Subsystem Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the Data Center GPU Max Subsystem's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The Data Center GPU Max Subsystem by Intel dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

Base Clock
900 MHz
Base Clock
900 MHz
Boost Clock
1600 MHz
Boost Clock
1,600 MHz
Memory Clock
1565 MHz 3.1 Gbps effective
GDDR GDDR 6X 6X

Intel's Data Center GPU Max Subsystem Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The Data Center GPU Max Subsystem's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
128 GB
VRAM
131,072 MB
Memory Type
HBM2e
VRAM Type
HBM2e
Memory Bus
8192 bit
Bus Width
8192-bit
Bandwidth
3.21 TB/s

Data Center GPU Max Subsystem by Intel Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the Data Center GPU Max Subsystem, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
64 KB (per EU)
L2 Cache
408 MB

Data Center GPU Max Subsystem Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the Intel Data Center GPU Max Subsystem against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
52.43 TFLOPS
FP64 (Double)
52.43 TFLOPS (1:1)
FP16 (Half)
52.43 TFLOPS (1:1)
Pixel Rate
0 MPixel/s
Texture Rate
1,638.4 GTexel/s

Data Center GPU Max Subsystem Ray Tracing & AI

Hardware acceleration features

The Intel Data Center GPU Max Subsystem includes dedicated hardware for ray tracing and AI acceleration. RT cores handle real-time ray tracing calculations for realistic lighting, reflections, and shadows in supported games. Tensor cores (NVIDIA) or XMX cores (Intel) accelerate AI workloads including DLSS, FSR, and XeSS upscaling technologies. These features enable higher visual quality without proportional performance costs, making the Data Center GPU Max Subsystem capable of delivering both stunning graphics and smooth frame rates in modern titles.

RT Cores
128
XMX Cores
1024

Generation 12.5 Architecture & Process

Manufacturing and design details

The Intel Data Center GPU Max Subsystem is built on Intel's Generation 12.5 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the Data Center GPU Max Subsystem will perform in GPU benchmarks compared to previous generations.

Architecture
Generation 12.5
GPU Name
Ponte Vecchio
Process Node
10 nm
Foundry
Intel
Transistors
100,000 million
Die Size
1280 mm²
Density
78.1M / mm²

Power & Thermal

TDP and power requirements

Power specifications for the Intel Data Center GPU Max Subsystem determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the Data Center GPU Max Subsystem to maintain boost clocks without throttling.

TDP
2400 W
TDP
2400W
Power Connectors
1x 16-pin
Suggested PSU
2800 W

Data Center GPU Max Subsystem by Intel Physical & Connectivity

Dimensions and outputs

Physical dimensions of the Intel Data Center GPU Max Subsystem are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
Dual-slot
Length
267 mm 10.5 inches
Bus Interface
PCIe 5.0 x16
Display Outputs
No outputs
Display Outputs
No outputs

Intel API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the Intel Data Center GPU Max Subsystem. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
12 (12_1)
DirectX
12 (12_1)
OpenGL
4.6
OpenGL
4.6
OpenCL
3.0
Shader Model
6.6

Data Center GPU Max Subsystem Product Information

Release and pricing details

The Intel Data Center GPU Max Subsystem is manufactured by Intel as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the Data Center GPU Max Subsystem by Intel represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
Intel
Release Date
Jan 2023
Production
Active
Successor
H3C Graphics

About Intel Data Center GPU Max Subsystem

The Intel Data Center GPU Max Subsystem is a compute accelerator built on the Ponte Vecchio chip, using the Generation 12.5 architecture. Manufactured on Intel's 10 nm process, it integrates 100,000 million transistors on a 1280 mm² die, achieving a transistor density of 78.1M per mm². The card is equipped with 128 GB of HBM2e memory across an 8192-bit bus, providing 3.21 TB/s of bandwidth. Its clocks are set at a base of 900 MHz and a boost of 1600 MHz, while memory runs at 1565 MHz (3.1 Gbps effective). Compute performance reaches 52.43 TFLOPS in both FP32 and FP16 (1:1). The texture rate is 1638.4 GTexel/s, but the pixel rate is 0 MPixel/s due to 0 ROPs. It uses a PCIe 5.0 x16 interface. Released on 2023-01-09, it holds the 50th percentile in the database and is marked as Active. With no display outputs and a 2400 W TDP, it is clearly designed for data center use. The suggested PSU is 2800 W, and power comes via a single 16-pin connector. The card is dual-slot, measuring 267 mm (10.5 inches) in length. Its successor is the H3C Graphics.

Power and Cooling

The TDP is 2400 W, a substantial power draw that requires a dedicated power infrastructure. The suggested PSU is 2800 W, which leaves headroom for the rest of the system. Power is supplied through a single 16-pin connector. The card is dual-slot, with a length of 267 mm (10.5 inches). The high TDP means that adequate cooling is critical; the dual-slot design provides a large surface area for heat dissipation. The 2800 W PSU recommendation is above the TDP, ensuring stable operation under load. The single 16-pin connector is a modern standard, but the power requirement is extreme. No display outputs are present, so all power is directed to compute. The length of 267 mm is standard for a dual-slot card, but the power envelope is unique. The 2400 W TDP is a significant figure, and the 2800 W PSU recommendation reflects the need for a robust power supply. The dual-slot form factor helps manage the thermal output, but the power draw is a primary consideration for any deployment.

Ray Tracing and Feature Set

The GPU contains 128 RT cores, enabling hardware-accelerated ray tracing. The data pack does not specify a tensor core count, so that aspect is not quantified. API support includes DirectX 12 (12_1) and OpenGL 4.6; Vulkan support is not listed. FP32 and FP16 performance are both 52.43 TFLOPS, with FP16 at a 1:1 ratio, indicating balanced compute throughput. The texture rate is 1638.4 GTexel/s, while the pixel rate is 0 MPixel/s due to the absence of ROPs (0 ROPs). This configuration suggests that the card is optimized for compute and ray tracing, not for pixel output. The lack of ROPs and pixel rate confirms that it cannot generate display images. The 128 RT cores are a significant resource for ray tracing workloads, but the card's primary role is data center compute. The absence of a tensor core count in the data pack means that AI acceleration is not quantified, but the FP16 1:1 ratio suggests strong compute performance. The DirectX 12 (12_1) support indicates a modern feature level, while OpenGL 4.6 provides compatibility for legacy applications. The 52.43 TFLOPS FP32 figure is a measure of raw compute, and the texture rate of 1638.4 GTexel/s shows the card's ability to process textures.

Who Should Consider It

The data indicates that this card is not for consumer gaming. With no display outputs and 0 ROPs, it cannot drive a monitor. The 50th percentile rank among all GPUs in the database places it at the median, but this rank is based on the overall database, which includes consumer cards. For workloads that require large memory capacity and high bandwidth, the 128 GB VRAM and 3.21 TB/s bandwidth are compelling. Users running large-scale simulations, AI training, or scientific computing would benefit. The card's 2400 W TDP and 2800 W PSU recommendation mean it is suited for server environments with robust power delivery. It is not suitable for any resolution or settings-based gaming, as it lacks the output stage. The 52.43 TFLOPS FP32 performance is a measure of compute capability, not graphical rendering. The 128 GB memory capacity is a key advantage for large datasets. The 3.21 TB/s bandwidth ensures that data can be fed to the compute units without bottlenecks. The 50th percentile rank suggests that it performs at the median of the database, but that includes consumer cards; in a data center context, it is a specialized tool. The absence of display outputs means it cannot be used for desktop or workstation graphics.

How It Compares

The dataset provides no nearest rivals for this product. Therefore, a direct comparison against specific competitor cards is not possible from the available information. The card holds the 50th percentile in the overall GPU database, indicating a median performance position. Its successor is listed as the H3C Graphics, which may offer changes, but no scores are provided for that product either. Without rival scores or deltaPct values, the analysis relies solely on the absolute specifications. The 2400 W TDP and 2800 W PSU recommendation place it in a unique power class among GPUs. The lack of display outputs and ROPs differentiates it from consumer GPUs in the database. The 128 GB memory and 3.21 TB/s bandwidth are standout features that likely contribute to its median rank in compute-heavy benchmarks. The 52.43 TFLOPS FP32 performance is a high figure, but without rival data, it cannot be placed in context. The 50th percentile is a relative measure, and the card's position is likely influenced by the fact that it is a data center part. The successor H3C Graphics may offer improvements, but no comparative data is available. The absence of nearest rivals means that the card's performance is best understood through its own specifications.

Memory Subsystem

The memory subsystem is a defining feature of this card. It consists of 128 GB of HBM2e memory, connected via an 8192-bit bus. The memory clock runs at 1565 MHz, translating to 3.1 Gbps effective, and the total bandwidth reaches 3.21 TB/s. This is an enormous amount of bandwidth, designed for high-resolution compute tasks. For workloads that process large matrices or datasets, this bandwidth allows rapid data movement. The 128 GB capacity supports large models that cannot fit in smaller memory pools. The 8192-bit bus width is exceptionally wide, contributing to the high bandwidth. This memory configuration is geared toward data center workloads, not consumer display resolutions. The 3.21 TB/s bandwidth is more than sufficient for feeding the 52.43 TFLOPS compute throughput. The HBM2e type is a high-bandwidth memory standard, and the 128 GB capacity is a major advantage for memory-intensive applications. The memory clock of 1565 MHz (3.1 Gbps effective) is a specific figure that, combined with the 8192-bit bus, yields the 3.21 TB/s bandwidth. For high-resolution compute, such as large-scale physics simulations or deep learning, the bandwidth ensures that the GPU is not starved for data. The 128 GB capacity allows entire datasets to reside on the card, reducing the need for frequent host transfers.

FAQ

Q: What is the TDP of the Intel Data Center GPU Max Subsystem?

A: The TDP is 2400 W, which is a substantial power draw that requires a dedicated power infrastructure.

Q: What power supply is recommended for this GPU?

A: The suggested PSU is 2800 W, leaving headroom for the rest of the system.

Q: How many ray tracing cores does it have?

A: It has 128 RT cores, enabling hardware-accelerated ray tracing.

Q: What is the memory capacity and type?

A: It has 128 GB of HBM2e memory, connected via an 8192-bit bus.

Q: Does it have any display outputs?

A: No, it has no display outputs, confirming its data center role.

Q: What is the FP32 performance in TFLOPS?

A: It delivers 52.43 TFLOPS in FP32, and also 52.43 TFLOPS in FP16 (1:1).

Detailed benchmark scores and charts for the Intel Data Center GPU Max Subsystem are below.

Benchmark Scores

No benchmark data available for this GPU.

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