Intel Arc B770 vs Intel Arc Graphics 2 Xe Mobile Comparison

Intel Arc B770 and Intel Arc Graphics 2 Xe Mobile occupy opposite ends of Intel’s graphics spectrum, one a discrete desktop board for high-throughput rendering, the other an integrated mobile processor for power-constrained systems. The database shows fundamental architectural divergence, with the B770 built on Xe2-HPG and the mobile part using Xe3-LPG. Every measurable specification, from execution resources to memory path, places the B770 far ahead. The mobile chip compensates with a leading-edge Intel 3 nm process and a 25 W envelope, but raw performance data indicates a gap of roughly 15 times in FP32 throughput.

FAQ

Q: What is the performance difference in FP32 compute between the two?

A: The Intel Arc B770 delivers 19.66 TFLOPS of FP32 throughput, while the Intel Arc Graphics 2 Xe Mobile provides 1,280.0 GFLOPS, which equals 1.28 TFLOPS. The desktop card is about 15.4 times faster in single-precision compute.

Q: How do memory configurations compare?

A: The B770 uses 16 GB of GDDR6 on a 256 bit bus with 512.0 GB/s of bandwidth. The mobile part uses system shared memory, with bandwidth listed as system dependent and a bus width listed as system shared.

Q: Which part has more shading units and ray tracing cores?

A: The B770 has 4096 shading units, 256 texture mapping units, 128 ROPs, and 32 ray tracing cores. The mobile chip has 256 shading units, 16 TMUs, 8 ROPs, and 2 ray tracing cores.

Q: What are the clock speeds of each?

A: The B770 runs at a base clock of 2100 MHz and a boost clock of 2400 MHz. The mobile part has a 300 MHz base clock and a 2500 MHz boost clock, so its boost is slightly higher despite the much lower base.

Q: What process nodes and foundries are used?

A: The B770 uses a 5 nm process from TSMC with a die size of 368 mm². The mobile chip uses a 3 nm process from Intel, with die size listed as unknown.

Q: What is the thermal design power of each?

A: The B770 has a TDP of 225 W and requires a 550 W suggested power supply. The mobile part has a TDP of 25 W and uses no power connectors.

Architecture Differences

The two graphics processors belong to different Intel architecture families. The B770 uses Xe2-HPG, which is the high-performance graphics architecture created for discrete GPUs in the Battlemage generation, specifically the Arc 7 series. The mobile part uses Xe3-LPG, a low-power graphics architecture designed for integrated use in the Arc Graphics-M generation based on the Wildcat Lake chip.

The manufacturing approach differs sharply. The B770 is fabricated on a 5 nm node at TSMC, with a die size of 368 mm² and transistor count listed as unknown. The mobile chip is built on Intel’s 3 nm node, with die size and transistor count both unknown. The 3 nm process gives the mobile chip a density advantage per area, but the B770 uses its larger die to fit massively more execution hardware.

Execution resources reveal the scale difference. The B770 contains 4096 shading units, 256 TMUs, 128 ROPs, and 32 ray tracing cores. The mobile part contains 256 shading units, 16 TMUs, 8 ROPs, and 2 ray tracing cores. That is a 16 times difference in shading units, a 16 times difference in TMUs, a 16 times difference in ROPs, and a 16 times difference in ray tracing cores. The B770 also supports higher pixel and texture rates, with 307.2 GPixel/s and 614.4 GTexel/s versus 20.00 GPixel/s and 40.00 GTexel/s for the mobile chip.

Memory architecture is a core differentiator. The B770 uses dedicated 16 GB GDDR6 memory on a 256 bit bus, reaching 512.0 GB/s of bandwidth. The mobile chip relies on system shared memory, with no dedicated VRAM, no fixed bus width, and bandwidth that is system dependent. This makes the B770 suitable for large textures and high-resolution buffers, while the mobile part depends entirely on the host system’s memory subsystem.

Clock behavior differs in an interesting way. The B770 runs at 2100 MHz base and 2400 MHz boost. The mobile chip has a 300 MHz base but a 2500 MHz boost, making its maximum clock 100 MHz higher than the desktop card. However, the mobile part’s low base clock and minimal execution units mean the higher boost does not translate into competitive throughput.

Power delivery and form factor also separate the two. The B770 is a dual-slot card with a 1x 6-pin plus 1x 8-pin power connector setup, a 225 W TDP, and a suggested 550 W power supply. The mobile part is an integrated graphics processor with no slot width, no power connectors, and a 25 W TDP. The B770 connects via PCIe 4.0 x16, while the mobile chip uses an IGP bus interface. Display outputs on the B770 include 1x HDMI 2.1a and 3x DisplayPort 2.1, while the mobile part’s outputs are portable device dependent. Both support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4.

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for these two products. There are no entries in the head-to-head benchmark list, no win counts, and no average benchmark scores. The comparison must therefore be made from the specification data, which is complete enough to establish a clear performance hierarchy.

FP32 compute is the clearest indicator. The B770 produces 19.66 TFLOPS, while the mobile chip produces 1,280.0 GFLOPS. Converting the mobile figure, that is 1.28 TFLOPS. The B770 is approximately 15.4 times faster in single-precision floating-point work. This is the dominant metric for general GPU compute and directly scales with shading unit count.

Memory bandwidth shows an even larger gap. The B770 provides 512.0 GB/s of dedicated GDDR6 bandwidth. The mobile chip’s bandwidth is system dependent, meaning it has no fixed figure in the database. In any practical system shared memory configuration, the mobile part would rely on the same memory channels as the CPU, subject to contention and lower effective throughput than dedicated VRAM. The B770’s fixed 512.0 GB/s is a hard advantage for bandwidth-intensive workloads.

Pixel and texture throughput follow the same pattern. The B770 reaches 307.2 GPixel/s and 614.4 GTexel/s. The mobile chip reaches 20.00 GPixel/s and 40.00 GTexel/s. The B770 is 15.36 times faster in pixel rate and 15.36 times faster in texture rate. These rates align exactly with the 16 times difference in ROPs and TMUs, confirming that the execution units scale proportionally.

FP16 compute shows a similar ratio. The B770 delivers 39.32 TFLOPS with a 2:1 ratio to FP32. The mobile chip delivers 2.560 TFLOPS with a 2:1 ratio. The B770 is 15.36 times faster in half-precision compute.

The mobile chip’s only clock advantage is its 2500 MHz boost versus 2400 MHz on the B770. That 100 MHz difference is negligible compared to the execution resource gap. The B770’s higher base clock of 2100 MHz versus 300 MHz also means the desktop part sustains high throughput without relying on boost behavior.

The Verdict

The data indicates that the Intel Arc B770 is the superior performer in every quantified specification. It has 16 times the shading units, 16 times the TMUs, 16 times the ROPs, and 16 times the ray tracing cores of the mobile part. Its FP32 throughput of 19.66 TFLOPS is roughly 15.4 times the mobile chip’s 1,280.0 GFLOPS. Its dedicated 16 GB GDDR6 memory with 512.0 GB/s bandwidth is not comparable to system shared memory with system dependent bandwidth.

The Intel Arc Graphics 2 Xe Mobile is not designed to compete with the B770. Its role is integrated graphics for portable devices, with a 25 W TDP and no power connectors. Its base clock of 300 MHz and 256 shading units place it in a completely different performance class. The 3 nm Intel process gives it a modern manufacturing advantage, but the database does not record any benchmark scores to suggest that translates into competitive rendering throughput.

For any workload requiring sustained GPU compute, large memory pools, or high bandwidth, the B770 is the correct choice based on the recorded data. For ultra-low-power portable systems where discrete graphics is impossible, the mobile part is the only option of the two. The verdict is unambiguous: the B770 dominates all measured specifications, and the mobile chip serves a power-constrained integration role.

Specification Differences

The two products differ in nearly every field in the database. The B770 uses the BMG-G31 chip with Xe2-HPG architecture, while the mobile part uses the Wildcat Lake chip with Xe3-LPG architecture. Process node is 5 nm at TSMC for the B770 versus 3 nm at Intel for the mobile part. Die size is 368 mm² for the B770, unknown for the mobile chip.

Clock speeds differ: 2100 MHz base and 2400 MHz boost for the B770, versus 300 MHz base and 2500 MHz boost for the mobile part. Memory is 16 GB GDDR6 on a 256 bit bus with 512.0 GB/s bandwidth for the B770, versus system shared memory with system dependent bandwidth for the mobile chip.

Execution units differ by a factor of 16: 4096 shading units, 256 TMUs, 128 ROPs, 32 ray tracing cores for the B770, versus 256 shading units, 16 TMUs, 8 ROPs, 2 ray tracing cores for the mobile part. Pixel rate is 307.2 GPixel/s versus 20.00 GPixel/s. Texture rate is 614.4 GTexel/s versus 40.00 GTexel/s. FP32 is 19.66 TFLOPS versus 1,280.0 GFLOPS. FP16 is 39.32 TFLOPS versus 2.560 TFLOPS.

TDP is 225 W for the B770 versus 25 W for the mobile part. The B770 is dual-slot with 1x 6-pin and 1x 8-pin power connectors and a 550 W suggested power supply. The mobile part is an IGP with no power connectors and no suggested PSU. Bus interface is PCIe 4.0 x16 for the B770 versus IGP for the mobile chip. Display outputs are 1x HDMI 2.1a and 3x DisplayPort 2.1 for the B770, versus portable device dependent for the mobile part.

API support is identical: both use DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. Production status is listed only for the mobile part, marked active. Release dates differ, with the B770 dated 2025-12-31 and the mobile part 2026-04-15. Predecessors are Alchemist for the B770 and HD Graphics-M for the mobile chip. Neither has a successor listed, and neither has a launch MSRP in the database.

Where Each One Wins

The Intel Arc B770 wins in every compute and graphics throughput category recorded in the database. Its 19.66 TFLOPS FP32 performance suits heavy compute workloads. Its 512.0 GB/s memory bandwidth and 16 GB GDDR6 capacity support large data sets and high-resolution textures. Its 307.2 GPixel/s fill rate and 614.4 GTexel/s texture rate handle high-resolution rendering. Its 32 ray tracing cores provide dedicated hardware for ray-traced effects. Its 225 W TDP and dual-slot design indicate a part intended for full-size desktop systems with adequate cooling and power delivery.

The Intel Arc Graphics 2 Xe Mobile wins in power efficiency. Its 25 W TDP is 200 W lower than the B770. It requires no power connectors and no suggested PSU, making it suitable for portable devices. Its 3 nm Intel process is more advanced than the 5 nm TSMC node used by the B770. Its boost clock of 2500 MHz is actually 100 MHz higher than the B770’s boost clock, though this does not compensate for the 16 times difference in execution units. Its system shared memory model eliminates the need for dedicated VRAM, reducing cost and complexity in integrated designs.

The use-case split is clear from the data. The B770 is for desktop systems requiring maximum throughput in compute, rendering, and gaming. The mobile part is for portable devices where 25 W power draw and integrated packaging are mandatory. The B770’s dedicated 16 GB GDDR6 and 512.0 GB/s bandwidth are features the mobile chip cannot match, while the mobile chip’s 25 W TDP and integrated form factor are features the B770 does not offer. Neither product is a substitute for the other; the database records them as complementary entries in Intel’s graphics lineup.