GPU Comparison

AMD
RADEON

AMD FirePro W2100

CORE STATE Oland
VRAM 2 GB
CLOCK SPEED 680 MHz
TDP 26 W
BUS WIDTH 128 bit
ARCHITECTURE GCN 1.0
nm
PROCESS 28 nm
LAUNCH DATE 2014
VS
AMD
RADEON

Radeon 860M

CORE STATE Krackan Point
VRAM System Shared
CLOCK SPEED 3000 MHz
TDP 15 W
BUS WIDTH System Shared
ARCHITECTURE RDNA 3.5
nm
PROCESS 4 nm
LAUNCH DATE

PERFORMANCE BENCHMARKS

geekbench_opencl
4,093
22,759
geekbench_vulkan
4,497
30,043

DETAILED SPECIFICATIONS

SPECIFICATION
FirePro W2100
860M
Core Specs
Shading Units
320
512 +60.0%
Shaders
320
512 +60.0%
TMUs
20
32 +60.0%
ROPs
8
8 0.0%
Compute Units
5
8 +60.0%
Clocks
Base Clock
630 MHz
600 MHz
Boost Clock
680 MHz
3000 MHz
Memory Clock
900 MHz 1800 Mbps effective
System Shared
Memory
Memory Size
2 GB
System Shared
VRAM (MB)
2,048
Memory Type
DDR3
System Shared
Memory Bus
128 bit
System Shared
Bandwidth
28.80 GB/s
System Dependent
Cache
L1 Cache
16 KB (per CU)
128 KB per Array
L2 Cache
256 KB
1024 KB
L0 Cache
32 KB per WGP
Performance
Pixel Rate
5.440 GPixel/s
24.00 GPixel/s
Texture Rate
13.60 GTexel/s
96.00 GTexel/s
FP32 (TFLOPS)
435.2 GFLOPS
3.072 TFLOPS
FP64 (TFLOPS)
27.20 GFLOPS (1:16)
192.0 GFLOPS (1:16)
FP16 (TFLOPS)
6.144 TFLOPS (2:1)
AI/RT
RT Cores
8
Power
TDP
26 W
15 W
TDP (W)
26
15 -42.3%
Suggested PSU
200 W
Power Connectors
None
None
Architecture
Architecture
GCN 1.0
RDNA 3.5
GPU Name
Oland
Krackan Point
Generation
FirePro GCN (Wx100)
Navi III IGP (Strix Point Mobile)
Process Size
28 nm
4 nm
Transistors
950 million
Die Size
77 mm²
Foundry
TSMC
TSMC
Density
12.3M / mm²
API Support
DirectX
12 (11_1)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1 (1.2)
2.1
Shader Model
6.5 (5.1)
6.8
Physical
Slot Width
Single-slot
IGP
Length
168 mm 6.6 inches
Height
69 mm 2.7 inches
Outputs
2x DisplayPort 1.2
Portable Device Dependent
Bus Interface
PCIe 3.0 x8
PCIe 4.0 x8
Other
Production
End-of-life
Active
Predecessor
FirePro Terascale
Navi II IGP
Successor
Radeon Pro Polaris
View FirePro W2100 Details View Radeon 860M Details