AMD Instinct MI350X vs Intel Data Center GPU Max 1350 Comparison

The Verdict

The recorded data positions the AMD Instinct MI350X as the higher-throughput accelerator for compute-heavy workloads, while the Intel Data Center GPU Max 1350 offers a lower-power alternative with graphics API support. The MI350X delivers 72.09 TFLOPS FP32 and FP16, against 44.44 TFLOPS for the Intel part, a 62% advantage in raw floating-point throughput. Memory capacity favors AMD at 288 GB versus 96 GB, and bandwidth reaches 8.19 TB/s compared to 2.46 TB/s. The MI350X uses a 3 nm TSMC process, the Intel chip uses Intel's 10 nm node, and the transistor counts differ at 185,000 million versus 100,000 million.

The Intel Data Center GPU Max 1350 draws 450 W, while the MI350X draws 1000 W, so the data indicates the Intel part fits deployments with tighter power envelopes. The MI350X has no display outputs and no supported graphics APIs, making it a pure compute accelerator. The Intel part supports DirectX 12 (12_1) and OpenGL 4.6, giving it a broader feature set for environments that require graphics API compatibility. For organizations prioritizing peak compute and memory capacity, the MI350X is the stronger choice. For those constrained by power or needing API support, the Intel part is the only option among the two.

Architecture Differences

The AMD Instinct MI350X is built on CDNA 4.0 architecture, fabricated by TSMC on a 3 nm process. The chip, designated MI350 256CU, contains 185,000 million transistors on a 2380 mm² die, yielding a transistor density of 77.7 million per square millimeter. The Intel Data Center GPU Max 1350 uses Generation 12.5 architecture, built on Intel's 10 nm process. Its Ponte Vecchio chip packs 100,000 million transistors on a 1280 mm² die, with a density of 78.1 million per square millimeter. Despite the larger absolute transistor count, the density figures are nearly identical, differing by only 0.4M per mm².

The MI350X uses 288 GB of HBM3e memory across an 8192-bit bus, delivering 8.19 TB/s of bandwidth. The Intel part uses 96 GB of HBM2e memory on the same 8192-bit bus width, but bandwidth drops to 2.46 TB/s. Memory clock rates differ substantially: the MI350X runs at 2000 MHz with 8 Gbps effective, while the Intel part runs at 1200 MHz with 2.4 Gbps effective.

Shading unit counts favor AMD at 16384 versus 14336 for Intel. Texture mapping units stand at 1024 versus 896. The Intel part includes 112 ray tracing cores; the MI350X lists no ray tracing cores. Neither part has ROPs, and both report 0 MPixel/s pixel rate. Texture fill rates are 2,252.8 GTexel/s for the MI350X and 1,388.8 GTexel/s for the Intel part.

Clock speeds differ as well. The MI350X has a 1000 MHz base clock and 2200 MHz boost. The Intel part runs at 750 MHz base and 1550 MHz boost. Power delivery reflects the performance gap: the MI350X is rated at 1000 W TDP with a suggested 1400 W power supply, while the Intel part draws 450 W with a suggested 850 W power supply. Both use PCIe 5.0 x16 interfaces and come as OAM modules. The MI350X has no power connectors listed; the Intel entry does not specify connectors. The MI350X measures 102 mm in length and 165 mm in width; the Intel entry lists no dimensions. The MI350X has no display outputs, matching the Intel part's "No outputs" designation.

Release timing differs by roughly two years. The Intel Data Center GPU Max 1350 launched on 2023-01-09, while the AMD Instinct MI350X launched on 2025-06-11. The Intel part shows an active production status and lists a successor named H3C Graphics. The MI350X lists Radeon Instinct as its predecessor and no successor.

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The AMD Instinct MI350X delivers 72.09 TFLOPS FP32, which is 62% higher than the Intel Data Center GPU Max 1350's 44.44 TFLOPS.

Q: How much memory does each accelerator provide?

A: The MI350X offers 288 GB of HBM3e memory. The Intel Data Center GPU Max 1350 offers 96 GB of HBM2e memory.

Q: What are the power requirements for these cards?

A: The MI350X has a 1000 W TDP and suggests a 1400 W power supply. The Intel part has a 450 W TDP and suggests an 850 W power supply.

Q: Does either card support graphics APIs?

A: The Intel Data Center GPU Max 1350 supports DirectX 12 (12_1) and OpenGL 4.6. The MI350X lists N/A for DirectX, OpenGL, and Vulkan, and has no display outputs.

Q: Which GPU uses a more advanced manufacturing process?

A: The MI350X uses a 3 nm process from TSMC. The Intel part uses Intel's 10 nm process.

Q: What memory bandwidth does each card achieve?

A: The MI350X reaches 8.19 TB/s. The Intel part reaches 2.46 TB/s.

Specification Differences

| Specification | AMD Instinct MI350X | Intel Data Center GPU Max 1350 |

|---|---|---|

| Architecture | CDNA 4.0 | Generation 12.5 |

| Process Node | 3 nm (TSMC) | 10 nm (Intel) |

| Transistors | 185,000 million | 100,000 million |

| Die Size | 2380 mm² | 1280 mm² |

| Transistor Density | 77.7M / mm² | 78.1M / mm² |

| Base Clock | 1000 MHz | 750 MHz |

| Boost Clock | 2200 MHz | 1550 MHz |

| Memory Clock | 2000 MHz, 8 Gbps effective | 1200 MHz, 2.4 Gbps effective |

| Memory Size | 288 GB | 96 GB |

| Memory Type | HBM3e | HBM2e |

| Memory Bandwidth | 8.19 TB/s | 2.46 TB/s |

| Shading Units | 16384 | 14336 |

| TMUs | 1024 | 896 |

| RT Cores | None | 112 |

| Texture Rate | 2,252.8 GTexel/s | 1,388.8 GTexel/s |

| FP32 | 72.09 TFLOPS | 44.44 TFLOPS |

| FP16 | 72.09 TFLOPS (1:1) | 44.44 TFLOPS (1:1) |

| TDP | 1000 W | 450 W |

| Suggested PSU | 1400 W | 850 W |

| DirectX | N/A | 12 (12_1) |

| OpenGL | N/A | 4.6 |

| Dimensions | 102 mm x 165 mm | Not specified |

| Release Date | 2025-06-11 | 2023-01-09 |

Fields that match include memory bus width (8192 bit for both), pixel rate (0 MPixel/s for both), slot width (OAM Module for both), bus interface (PCIe 5.0 x16 for both), and display outputs (none for both).

Head-to-Head Benchmarks

No direct head-to-head benchmark scores exist in the database for these two accelerators, and neither has recorded benchmark scores or nearest rivals. The average benchmark score for both is 0, and both sit at the 50th percentile against all GPUs in the database. The comparison therefore rests on the specification data recorded for each part.

The largest numerical advantage for the AMD Instinct MI350X appears in memory bandwidth. At 8.19 TB/s, it delivers 3.33 times the bandwidth of the Intel part's 2.46 TB/s. This gap stems from both the memory type upgrade, HBM3e versus HBM2e, and the higher memory clock of 2000 MHz versus 1200 MHz, while the bus width remains identical at 8192 bits.

Memory capacity shows a similar pattern. The MI350X carries 288 GB, exactly three times the 96 GB found on the Intel Data Center GPU Max 1350. For workloads that need large resident datasets or model weights, the data indicates the AMD part can hold three times more data on-package.

Compute throughput follows the same direction. FP32 and FP16 performance both measure 72.09 TFLOPS on the MI350X versus 44.44 TFLOPS on the Intel part, a 27.65 TFLOPS difference. Texture fill rate favors AMD at 2,252.8 GTexel/s versus 1,388.8 GTexel/s. The shading unit count of 16384 exceeds the Intel part's 14336 by 2048 units, and the TMU count of 1024 exceeds 896 by 128 units.

Clock speeds contribute to these gaps. The MI350X boosts to 2200 MHz, which is 650 MHz higher than the Intel part's 1550 MHz boost. The base clock advantage is 250 MHz, 1000 MHz versus 750 MHz.

The Intel Data Center GPU Max 1350 holds advantages in several areas. Power draw is less than half: 450 W versus 1000 W, a 550 W difference. The suggested power supply drops from 1400 W to 850 W. The Intel part includes 112 ray tracing cores, which the MI350X does not list. Graphics API support exists only on the Intel part, with DirectX 12 (12_1) and OpenGL 4.6, while the MI350X lists N/A for all three major graphics APIs.

Transistor density is marginally higher on the Intel part at 78.1M per mm² versus 77.7M per mm², a 0.4M per mm² difference that reflects the different process nodes and die sizes. The Intel part launched earlier, in January 2023 versus June 2025 for the MI350X, and it has an active production status while the MI350X's status is not recorded.

The data shows two accelerators aimed at different points in the deployment spectrum. The MI350X concentrates on maximum compute, memory capacity, and bandwidth, all at a 1000 W power envelope. The Intel part trades raw throughput for a 450 W power draw and adds graphics API support that the AMD part entirely lacks. For FP32-heavy workloads, the MI350X is 62% ahead. For power-sensitive installations or any use requiring DirectX or OpenGL, the Intel Data Center GPU Max 1350 is the only one of the two with the necessary features.