GPU Comparison
RADEON
AMD FirePro S10000
CORE STATE
Tahiti
VRAM
3 GB
CLOCK SPEED
950 MHz
TDP
375 W
BUS WIDTH
384 bit
ARCHITECTURE
GCN 1.0
PROCESS
28 nm
LAUNCH DATE
2012
VS
RADEON
Radeon 860M
CORE STATE
Krackan Point
VRAM
System Shared
CLOCK SPEED
3000 MHz
TDP
15 W
BUS WIDTH
System Shared
ARCHITECTURE
RDNA 3.5
PROCESS
4 nm
LAUNCH DATE
—
PERFORMANCE BENCHMARKS
geekbench_opencl
geekbench_vulkan
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro S10000
860M
Core Specs
Shading Units
1,792
512
-71.4%
Shaders
1,792
512
-71.4%
TMUs
112
32
-71.4%
ROPs
32
8
-75.0%
Compute Units
28
8
-71.4%
Clocks
Base Clock
825 MHz
600 MHz
Boost Clock
950 MHz
3000 MHz
Memory Clock
1250 MHz
5 Gbps effective
System Shared
Memory
Memory Size
3 GB
System Shared
VRAM (MB)
3,072
—
Memory Type
GDDR5
System Shared
Memory Bus
384 bit
System Shared
Bandwidth
240.0 GB/s
System Dependent
Cache
L1 Cache
16 KB (per CU)
128 KB per Array
L2 Cache
768 KB
1024 KB
L0 Cache
—
32 KB per WGP
Performance
Pixel Rate
30.40 GPixel/s
24.00 GPixel/s
Texture Rate
106.4 GTexel/s
96.00 GTexel/s
FP32 (TFLOPS)
3.405 TFLOPS
3.072 TFLOPS
FP64 (TFLOPS)
851.2 GFLOPS (1:4)
192.0 GFLOPS (1:16)
FP16 (TFLOPS)
—
6.144 TFLOPS (2:1)
AI/RT
RT Cores
—
8
Power
TDP
375 W
15 W
TDP (W)
375
15
-96.0%
Suggested PSU
750 W
—
Power Connectors
2x 8-pin
None
Architecture
Architecture
GCN 1.0
RDNA 3.5
GPU Name
Tahiti
Krackan Point
Generation
FirePro Server
(Sx000)
Navi III IGP
(Strix Point Mobile)
Process Size
28 nm
4 nm
Transistors
4,313 million
—
Die Size
352 mm²
—
Foundry
TSMC
TSMC
Density
12.3M / mm²
—
API Support
DirectX
12 (11_1)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1 (1.2)
2.1
Shader Model
6.5 (5.1)
6.8
Physical
Slot Width
Dual-slot
IGP
Length
305 mm
12 inches
—
Height
111 mm
4.4 inches
—
Outputs
1x DVI4x mini-DisplayPort 1.2
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
PCIe 4.0 x8
Other
Launch Price
3,599 USD
—
Production
End-of-life
Active
Predecessor
FirePro Terascale
Navi II IGP
Successor
Radeon Pro GCN
—