GPU Comparison
RADEON
AMD FirePro D500
CORE STATE
Tahiti
VRAM
3 GB
CLOCK SPEED
—
TDP
274 W
BUS WIDTH
384 bit
ARCHITECTURE
GCN 1.0
PROCESS
28 nm
LAUNCH DATE
2014
VS
GPU
Arc A770M
CORE STATE
DG2-512
VRAM
16 GB
CLOCK SPEED
2050 MHz
TDP
120 W
BUS WIDTH
256 bit
ARCHITECTURE
Xe-HPG
PROCESS
6 nm
LAUNCH DATE
—
PERFORMANCE BENCHMARKS
geekbench_vulkan
3dmark_3dmark_steel_nomad_dx12
geekbench_opencl
passmark_directx_10
passmark_directx_11
passmark_directx_12
passmark_directx_9
passmark_g2d
passmark_g3d
passmark_gpu_compute
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro D500
A770M
Core Specs
Shading Units
1,536
4,096
+166.7%
Shaders
1,536
4,096
+166.7%
TMUs
96
256
+166.7%
ROPs
32
128
+300.0%
Compute Units
24
—
Execution Units
—
512
Clocks
Base Clock
—
1650 MHz
Boost Clock
—
2050 MHz
GPU Clock
725 MHz
—
Memory Clock
1270 MHz
5.1 Gbps effective
2000 MHz
16 Gbps effective
Memory
Memory Size
3 GB
16 GB
VRAM (MB)
3,072
16,384
+433.3%
Memory Type
GDDR5
GDDR6
Memory Bus
384 bit
256 bit
Bandwidth
243.8 GB/s
512.0 GB/s
Cache
L1 Cache
16 KB (per CU)
—
L2 Cache
768 KB
16 MB
Performance
Pixel Rate
23.20 GPixel/s
262.4 GPixel/s
Texture Rate
69.60 GTexel/s
524.8 GTexel/s
FP32 (TFLOPS)
2.227 TFLOPS
16.79 TFLOPS
FP64 (TFLOPS)
556.8 GFLOPS (1:4)
—
FP16 (TFLOPS)
—
33.59 TFLOPS (2:1)
AI/RT
RT Cores
—
32
XMX Cores
—
512
Power
TDP
274 W
120 W
TDP (W)
274
120
-56.2%
Suggested PSU
600 W
—
Architecture
Architecture
GCN 1.0
Xe-HPG
GPU Name
Tahiti
DG2-512
Generation
FirePro Data Center
(Dx00)
Alchemist
(Arc 7 Mobile)
Process Size
28 nm
6 nm
Transistors
4,313 million
21,700 million
Die Size
352 mm²
406 mm²
Foundry
TSMC
TSMC
Density
12.3M / mm²
53.4M / mm²
API Support
DirectX
12 (11_1)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1 (1.2)
3.0
Shader Model
6.5 (5.1)
6.6
Physical
Slot Width
Dual-slot
IGP
Length
279 mm
11 inches
—
Outputs
6x mini-DisplayPort 1.21x SDI
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
PCIe 4.0 x16
Other
Production
End-of-life
End-of-life
Predecessor
FirePro Terascale
—
Successor
Radeon Instinct
—