NVIDIA H100 PCIe 96 GB vs NVIDIA Rubin GPU Comparison

NVIDIA
GEFORCE

NVIDIA H100 PCIe 96 GB

CORE STATE GH100
VRAM 96 GB
CLOCK SPEED 1837 MHz
TDP 700 W
BUS WIDTH 5120 bit
ARCHITECTURE Hopper
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
NVIDIA
GEFORCE

Rubin GPU

CORE STATE GR100
VRAM 288 GB
CLOCK SPEED 2267 MHz
TDP 2300 W
BUS WIDTH 16384 bit
ARCHITECTURE Rubin
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: NVIDIA H100 PCIe 96 GB vs NVIDIA Rubin GPU

Head-to-Head Benchmarks

The database contains no recorded benchmark scores for either the NVIDIA H100 PCIe 96 GB or the NVIDIA Rubin GPU. The average benchmark score for both entries is 0, and the head-to-head benchmark array is empty. Consequently, there are no direct performance comparisons, no win counts for either processor (both stand at 0 wins), and no percentile differentials from nearest rivals to analyze. The data indicates that both products are listed as Active in production status, but neither has accumulated measurable performance data in the database at this time.

What the recorded data does show is a stark contrast in theoretical specifications. The H100 PCIe 96 GB delivers 62.08 TFLOPS of FP32 compute and 248.3 TFLOPS of FP16 compute (4:1 ratio), while the Rubin GPU lists 130.0 TFLOPS of FP32 and 260.0 TFLOPS of FP16 (2:1 ratio). These figures represent the peak computational capabilities as recorded, not measured benchmark outcomes. The FP32 figure for Rubin is approximately 2.09 times the H100's value, and the FP16 figure is roughly 1.05 times higher. However, without actual benchmark scores, these numbers remain theoretical maximums rather than validated performance results.

The texture rate differential is notable: the H100 records 969.9 GTexel/s, while Rubin records 2,031.2 GTexel/s, a factor of about 2.09. Pixel rates show 44.09 GPixel/s for the H100 versus 54.41 GPixel/s for Rubin, a 1.23 times difference. These metrics derive from the shading unit counts (16,896 for H100 versus 28,672 for Rubin) and TMU counts (528 versus 896), combined with the recorded clock speeds. The H100's boost clock is 1837 MHz, while Rubin's boost clock is 2267 MHz, a 430 MHz difference that contributes to Rubin's higher throughput figures.

FAQ

Q: What is the difference in memory capacity between the two GPUs?

A: The H100 PCIe 96 GB features 96 GB of HBM3 memory, while the NVIDIA Rubin GPU features 288 GB of HBM4 memory. The Rubin GPU's memory capacity is three times larger.

Q: How do the memory bandwidth figures compare?

A: The H100 PCIe 96 GB records a memory bandwidth of 3.36 TB/s across a 5120-bit bus. The Rubin GPU records 22.1 TB/s across a 16384-bit bus. The Rubin bandwidth is approximately 6.58 times higher.

Q: What are the transistor counts for each chip?

A: The H100 uses the GH100 chip with 80,000 million transistors on an 814 mm² die. The Rubin uses the GR100 chip with 336,000 million transistors on a 1456 mm² die. The Rubin chip has 4.2 times more transistors.

Q: What process nodes are used for each GPU?

A: The H100 PCIe 96 GB is fabricated on a 5 nm process at TSMC. The Rubin GPU is fabricated on a 3 nm process at TSMC. Transistor density is 98.3M per mm² for the H100 and 230.8M per mm² for the Rubin.

Q: What are the power requirements for each GPU?

A: The H100 PCIe 96 GB has a TDP of 700 W and a suggested PSU of 1100 W, using an 8-pin EPS power connector. The Rubin GPU has a TDP of 2300 W and a suggested PSU of 2700 W, with no power connector listed in the data.

Q: What interface does each GPU use to connect to the host system?

A: The H100 PCIe 96 GB uses PCIe 5.0 x16. The Rubin GPU uses PCIe 6.0 x16. Both are listed as having no display outputs.

Architecture Differences

The two GPUs belong to entirely different architectural generations. The H100 PCIe 96 GB is built on the Hopper architecture, designated as Server Hopper (Hxx), while the Rubin GPU is built on the Rubin architecture, designated as Server Rubin (Rxx). The H100's predecessor is listed as Server Ada, and its successor is Server Blackwell. The Rubin's predecessor is Server Blackwell, and it has no successor recorded.

The process technology differs by node size: the H100 uses a 5 nm process, while the Rubin uses a 3 nm process, both fabricated by TSMC. This node difference contributes to the transistor density gap, with the H100 at 98.3M transistors per mm² and Rubin at 230.8M per mm². The raw transistor counts are 80,000 million for the H100's GH100 chip versus 336,000 million for the Rubin's GR100 chip.

Shader configuration diverges significantly. The H100 contains 16,896 shading units, 528 TMUs, 24 ROPs, and 528 tensor cores. The Rubin contains 28,672 shading units, 896 TMUs, 24 ROPs, and 896 tensor cores. Neither product lists RT cores in the database. The shading unit count increases by a factor of 1.70, the TMU count doubles, and the tensor core count increases from 528 to 896, a 1.70 factor.

Clock behavior also differs. The H100 has a base clock of 1665 MHz and a boost clock of 1837 MHz. The Rubin has a base clock of 700 MHz and a boost clock of 2267 MHz. The Rubin's base clock is significantly lower, but its boost clock is substantially higher. Memory clocks show 1313 MHz (5.3 Gbps effective) for the H100 versus 2695 MHz (10.8 Gbps effective) for the Rubin.

Memory architecture changes completely. The H100 uses HBM3 with 96 GB capacity, a 5120-bit bus, and 3.36 TB/s bandwidth. The Rubin uses HBM4 with 288 GB capacity, a 16384-bit bus, and 22.1 TB/s bandwidth. The bus width triples, and the memory type advances one generation.

Form factor and power delivery differ as well. The H100 is a dual-slot card with 8-pin EPS power connectors. The Rubin is an SXM Module with no power connector specified. The H100's dimensions are 268 mm in length and 111 mm in height; the Rubin has no dimensions recorded. The H100's TDP is 700 W with a suggested PSU of 1100 W. The Rubin's TDP is 2300 W with a suggested PSU of 2700 W.

The Rubin lists its API support as N/A for DirectX, OpenGL, and Vulkan, while the H100 lists null values for these fields. Both are listed as having no display outputs, consistent with server-oriented products.

The Verdict

The recorded data presents a clear generational progression from the H100 PCIe 96 GB to the NVIDIA Rubin GPU. The Rubin GPU exceeds the H100 in every quantitative specification recorded in the database: shading units (28,672 versus 16,896), TMUs (896 versus 528), tensor cores (896 versus 528), FP32 throughput (130.0 TFLOPS versus 62.08 TFLOPS), FP16 throughput (260.0 TFLOPS versus 248.3 TFLOPS), memory capacity (288 GB versus 96 GB), memory bandwidth (22.1 TB/s versus 3.36 TB/s), and transistor count (336,000 million versus 80,000 million).

The H100 PCIe 96 GB retains advantages in base clock speed (1665 MHz versus 700 MHz) and form factor (dual-slot PCIe card versus SXM Module). The H100 also uses a more established PCIe 5.0 interface, while the Rubin uses PCIe 6.0. The H100's TDP of 700 W is substantially lower than the Rubin's 2300 W, and its suggested PSU is 1100 W versus 2700 W for the Rubin. However, for compute-focused workloads where the database records theoretical peak performance, the Rubin GPU delivers higher figures across the board.

The release dates in the database show the H100 launching on 2023-03-20 and the Rubin on 2025-12-31, placing them roughly two and a half years apart. The H100's production status is Active, and the Rubin's production status is also Active, though the Rubin is a newer product with no successor listed. The H100's successor is Server Blackwell, which itself is the Rubin's predecessor, confirming the Rubin as the later entry in the product line.

Based strictly on the recorded specifications, the Rubin GPU is the higher-performance part for raw compute throughput, memory capacity, and bandwidth. The H100 PCIe 96 GB is the more power-efficient and physically compact option. Neither product has benchmark scores in the database, so the verdict rests entirely on specification comparison.

Specification Differences

The following fields differ between the two GPUs in the database:

  • Chip: GH100 versus GR100
  • Architecture: Hopper versus Rubin
  • Generation: Server Hopper (Hxx) versus Server Rubin (Rxx)
  • Process node: 5 nm versus 3 nm
  • Transistors: 80,000 million versus 336,000 million
  • Die size: 814 mm² versus 1456 mm²
  • Transistor density: 98.3M / mm² versus 230.8M / mm²
  • Base clock: 1665 MHz versus 700 MHz
  • Boost clock: 1837 MHz versus 2267 MHz
  • Memory clock: 1313 MHz (5.3 Gbps effective) versus 2695 MHz (10.8 Gbps effective)
  • Memory size: 96 GB versus 288 GB
  • Memory type: HBM3 versus HBM4
  • Memory bus width: 5120 bit versus 16384 bit
  • Memory bandwidth: 3.36 TB/s versus 22.1 TB/s
  • Shading units: 16,896 versus 28,672
  • TMUs: 528 versus 896
  • Tensor cores: 528 versus 896
  • Pixel rate: 44.09 GPixel/s versus 54.41 GPixel/s
  • Texture rate: 969.9 GTexel/s versus 2,031.2 GTexel/s
  • FP32 performance: 62.08 TFLOPS versus 130.0 TFLOPS
  • FP16 performance: 248.3 TFLOPS (4:1) versus 260.0 TFLOPS (2:1)
  • TDP: 700 W versus 2300 W
  • Slot width: Dual-slot versus SXM Module
  • Power connectors: 8-pin EPS versus null
  • Suggested PSU: 1100 W versus 2700 W
  • Bus interface: PCIe 5.0 x16 versus PCIe 6.0 x16
  • APIs: null versus N/A for DirectX, OpenGL, and Vulkan
  • Dimensions: 268 mm length, 111 mm height versus null
  • Release date: 2023-03-20 versus 2025-12-31
  • Predecessor: Server Ada versus Server Blackwell
  • Successor: Server Blackwell versus null

Fields that remain identical: manufacturer (NVIDIA), foundry (TSMC), ROPs (24), display outputs (No outputs), and production status (Active).

Where Each One Wins

The H100 PCIe 96 GB wins in the following categories based on recorded data:

  • Lower power draw: 700 W TDP versus 2300 W for the Rubin, with a suggested PSU of 1100 W versus 2700 W. The H100's power requirements are roughly one third of the Rubin's.
  • Compact form factor: The H100 is a dual-slot PCIe card with defined dimensions (268 mm length, 111 mm height). The Rubin is an SXM Module with no dimensions recorded.
  • Higher base clock: 1665 MHz versus 700 MHz. This suggests the H100 maintains a higher minimum operating frequency.
  • Established interface: PCIe 5.0 x16 is the previous generation compared to PCIe 6.0 x16, which may offer broader compatibility with existing server platforms.

The NVIDIA Rubin GPU wins in the following categories:

  • Compute throughput: FP32 performance is 130.0 TFLOPS versus 62.08 TFLOPS, more than double. FP16 performance is 260.0 TFLOPS versus 248.3 TFLOPS, a smaller but still positive margin.
  • Memory capacity: 288 GB versus 96 GB, a threefold increase. This directly impacts the size of datasets that can reside on the GPU.
  • Memory bandwidth: 22.1 TB/s versus 3.36 TB/s, a 6.58 times advantage. This benefits memory-bound workloads.
  • Memory bus width: 16384 bit versus 5120 bit, allowing for wider data paths.
  • Texture throughput: 2,031.2 GTexel/s versus 969.9 GTexel/s, roughly double.
  • Pixel throughput: 54.41 GPixel/s versus 44.09 GPixel/s, a 1.23 times advantage.
  • Shader resources: 28,672 shading units versus 16,896, and 896 tensor cores versus 528.
  • Transistor budget: 336,000 million versus 80,000 million, enabling the larger compute and memory resources.
  • Newer process node: 3 nm versus 5 nm, with higher transistor density (230.8M / mm² versus 98.3M / mm²).
  • Newer memory type: HBM4 versus HBM3.
  • Newer bus interface: PCIe 6.0 x16 versus PCIe 5.0 x16.

The specification comparison shows the Rubin GPU as the dominant part for peak compute and memory performance, while the H100 PCIe 96 GB remains relevant for deployments where power, physical space, and established platform support take priority. The database contains no benchmark scores to validate real-world performance, so these conclusions derive entirely from the recorded specification sheets.

DETAILED SPECIFICATIONS

SPECIFICATION
H100 PCIe 96 GB
Rubin GPU
Core Specs
Shading Units
16,896
28,672 +69.7%
Shaders
16,896
28,672 +69.7%
TMUs
528
896 +69.7%
ROPs
24
24 0.0%
SM Count
132
224 +69.7%
Clocks
Base Clock
1665 MHz
700 MHz
Boost Clock
1837 MHz
2267 MHz
Memory Clock
1313 MHz 5.3 Gbps effective
2695 MHz 10.8 Gbps effective
Memory
Memory Size
96 GB
288 GB
VRAM (MB)
98,304
294,912 +200.0%
Memory Type
HBM3
HBM4
Memory Bus
5120 bit
16384 bit
Bandwidth
3.36 TB/s
22.1 TB/s
Cache
L1 Cache
256 KB (per SM)
256 KB (per SM)
L2 Cache
50 MB
128 MB
Performance
Pixel Rate
44.09 GPixel/s
54.41 GPixel/s
Texture Rate
969.9 GTexel/s
2,031.2 GTexel/s
FP32 (TFLOPS)
62.08 TFLOPS
130.0 TFLOPS
FP64 (TFLOPS)
31.04 TFLOPS (1:2)
32.50 TFLOPS (1:4)
FP16 (TFLOPS)
248.3 TFLOPS (4:1)
260.0 TFLOPS (2:1)
AI/RT
Tensor Cores
528
896 +69.7%
Power
TDP
700 W
2300 W
TDP (W)
700
2,300 +228.6%
Suggested PSU
1100 W
2700 W
Power Connectors
8-pin EPS
Architecture
Architecture
Hopper
Rubin
GPU Name
GH100
GR100
Generation
Server Hopper (Hxx)
Server Rubin (Rxx)
Process Size
5 nm
3 nm
Transistors
80,000 million
336,000 million
Die Size
814 mm²
1456 mm²
Foundry
TSMC
TSMC
Density
98.3M / mm²
230.8M / mm²
API Support
OpenCL
3.0
3.0
CUDA
9.0
10.7
Physical
Slot Width
Dual-slot
SXM Module
Length
268 mm 10.6 inches
Height
111 mm 4.4 inches
Outputs
No outputs
No outputs
Bus Interface
PCIe 5.0 x16
PCIe 6.0 x16
Other
Production
Active
Active
Predecessor
Server Ada
Server Blackwell
Successor
Server Blackwell
View H100 PCIe 96 GB Details View Rubin GPU Details