AMD Radeon RX 7900 GRE vs NVIDIA B200 SXM6 Comparison
AMD Radeon RX 7900 GRE
B200 SXM6
PERFORMANCE BENCHMARKS
Analysis: AMD Radeon RX 7900 GRE vs NVIDIA B200 SXM6
FAQ
Q: What is the average benchmark score for the AMD Radeon RX 7900 GRE?
A: The RX 7900 GRE has an average benchmark score of 32,456, placing it in the 77th percentile of all GPUs in the database. Its nearest rival is the AMD FirePro S10000 at 32,388, which is 0.2% behind.
Q: Does the NVIDIA B200 SXM6 have any recorded benchmark scores?
A: No. The B200 SXM6 has an empty benchmark array, an average score of 0, and a 50th percentile ranking. The database therefore contains no direct performance measurements for this accelerator.
Q: What memory configuration does each product use?
A: The RX 7900 GRE uses 16 GB of GDDR6 on a 256-bit bus with 576.0 GB/s bandwidth. The B200 SXM6 uses 180 GB of HBM3e on an 8192-bit bus with 8.19 TB/s bandwidth.
Q: What is the transistor count and die size for each chip?
A: The RX 7900 GRE's Navi 31 chip has 57,700 million transistors on a 529 mm² die. The B200 SXM6's GB100 chip has 208,000 million transistors on a 1628 mm² die.
Q: What are the FP32 and FP16 compute figures?
A: The RX 7900 GRE delivers 45.98 TFLOPS FP32 and 91.96 TFLOPS FP16 (2:1 ratio). The B200 SXM6 delivers 69.34 TFLOPS FP32 and 69.34 TFLOPS FP16 (1:1 ratio).
Q: What are the power requirements?
A: The RX 7900 GRE has a TDP of 260 W with a suggested 600 W PSU. The B200 SXM6 has a TDP of 1000 W with a suggested 1400 W PSU.
Architecture Differences
The two products represent fundamentally different design goals. The AMD Radeon RX 7900 GRE uses the Navi 31 chip built on RDNA 3.0 architecture, codenamed Plum Bonito, part of the Navi III (RX 7000) generation. It is fabricated on a 5 nm process at TSMC with 57,700 million transistors across a 529 mm² die, yielding a transistor density of 109.1M per mm². The B200 SXM6 uses the GB100 chip built on Blackwell architecture, part of the Server Blackwell (Bxx) generation, also on a 5 nm TSMC process but with 208,000 million transistors on a 1628 mm² die, giving a density of 127.8M per mm².
The compute layouts diverge sharply. The RX 7900 GRE has 5120 shading units, 320 texture mapping units, 160 ROPs, and 80 ray tracing cores. It has no tensor cores. The B200 SXM6 has 18,944 shading units, 592 TMUs, only 24 ROPs, and 592 tensor cores. It has no dedicated RT cores listed. The B200's ROP count is drastically lower than the RX 7900 GRE's, which explains the pixel rate difference: 43.92 GPixel/s versus 359.2 GPixel/s.
Memory architecture separates them further. The RX 7900 GRE runs GDDR6 at 2250 MHz (18 Gbps effective) with a 256-bit bus, delivering 576.0 GB/s. The B200 SXM6 runs HBM3e at 2000 MHz (8 Gbps effective) with an 8192-bit bus, delivering 8.19 TB/s, roughly 14 times the bandwidth. Clock behavior also contrasts: the RX 7900 GRE has a base clock of 1287 MHz and boost of 2245 MHz with a game clock of 1880 MHz, while the B200 SXM6 has a base of only 120 MHz and boost of 1830 MHz.
Interface and output differences matter for deployment. The RX 7900 GRE uses PCIe 4.0 x16 and provides 1x HDMI 2.1a, 2x DisplayPort 2.1, and 1x USB Type-C outputs. The B200 SXM6 uses PCIe 6.0 x16 and has no display outputs. The RX 7900 GRE supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4; the B200 SXM6 lists N/A for all three APIs. The RX 7900 GRE is a dual-slot card with 2x 8-pin power connectors, 276 mm length, 110 mm height, and 51 mm width. The B200 SXM6 is an SXM Module with no published dimensions and no power connector details.
Head-to-Head Benchmarks
The head-to-head benchmark list between the RX 7900 GRE and B200 SXM6 is empty. There are no direct comparative measurements recorded, and wins for each side are zero. The database contains benchmarks only for the RX 7900 GRE across ten tests: 3DMark Steel Nomad DX12 (4814), Geekbench OpenCL (175758), Geekbench Vulkan (99850), Passmark DirectX 10 (139), Passmark DirectX 11 (300), Passmark DirectX 12 (107), Passmark DirectX 9 (310), Passmark G2D (1180), Passmark G3D (27089), and Passmark GPU Compute (15016).
The B200 SXM6 has no benchmark entries at all. Its average score of 0 and 50th percentile placement reflect an absence of data rather than a measured performance level. The RX 7900 GRE's average of 32,456 places it in the 77th percentile, with close rivals including the AMD FirePro S10000 (32,388, 0.2% behind), AMD FirePro S9300 X2 (32,540, 0.3% ahead), AMD Radeon RX 590 GME (32,601, 0.4% ahead), and AMD Radeon Pro 570X (32,176, 0.9% behind).
Without head-to-head data, the comparison relies on architectural and specification analysis. The B200 SXM6's FP32 output of 69.34 TFLOPS exceeds the RX 7900 GRE's 45.98 TFLOPS by roughly 51%. Texture rate similarly favors the B200: 1,083.4 GTexel/s versus 718.4 GTexel/s, about 51% higher. Memory bandwidth is where the B200 SXM6 dominates most decisively, offering 8.19 TB/s against 576.0 GB/s, a 14.2 times advantage.
The RX 7900 GRE counters with a pixel rate of 359.2 GPixel/s versus the B200's 43.92 GPixel/s, an 8.2 times advantage for AMD. The RX 7900 GRE also has 160 ROPs against 24, and its FP16 throughput of 91.96 TFLOPS exceeds its own FP32 figure due to the 2:1 ratio, while the B200's FP16 matches its FP32 at 69.34 TFLOPS. The RX 7900 GRE's boost clock of 2245 MHz is higher than the B200's 1830 MHz, and its base clock of 1287 MHz dwarfs the B200's 120 MHz.
The Verdict
The data indicates two products built for entirely separate purposes. The RX 7900 GRE is a client-side graphics card with display outputs, DirectX and Vulkan support, and a full benchmark record. The B200 SXM6 is a server accelerator with no display outputs, no graphics API support, and no recorded benchmarks. Direct numerical comparison is therefore limited to specification-level analysis.
For graphics workloads, the RX 7900 GRE is the only one of the two with relevant measurement data. Its 77th percentile ranking and average score of 32,456 show it performs within a narrow band around its nearest rivals, all within 0.9% of its average. The B200 SXM6's 50th percentile with zero average score cannot be interpreted as a performance level.
For compute-heavy workloads, the B200 SXM6's specifications suggest a different class of capability. Its FP32 output is 51% higher, its texture rate is 51% higher, and its memory bandwidth is over 14 times higher. The B200 also carries 592 tensor cores, a feature absent from the RX 7900 GRE entirely. The RX 7900 GRE does have 80 ray tracing cores, which the B200 lacks, and its pixel throughput is 8.2 times higher.
The choice depends on the workload context. The RX 7900 GRE suits tasks requiring rasterization, display output, and graphics API compatibility. The B200 SXM6 suits tasks requiring massive memory capacity, extreme bandwidth, and tensor compute, assuming the absence of benchmark data is acceptable for the intended use. The RX 7900 GRE was released on 2023-07-26 with a launch MSRP of 549 USD. The B200 SXM6 was released on 2024-10-31 with a launch MSRP of 34,999 USD.
Specification Differences
The two products differ across nearly every recorded specification field.
- Process node: both use 5 nm TSMC, but transistor counts differ: 57,700 million (RX 7900 GRE) versus 208,000 million (B200 SXM6).
- Die size: 529 mm² versus 1628 mm².
- Transistor density: 109.1M / mm² versus 127.8M / mm².
- Base clock: 1287 MHz versus 120 MHz.
- Boost clock: 2245 MHz versus 1830 MHz.
- Game clock: 1880 MHz (RX 7900 GRE only; B200 has none).
- Memory clock: 2250 MHz 18 Gbps effective versus 2000 MHz 8 Gbps effective.
- Memory size: 16 GB versus 180 GB.
- Memory type: GDDR6 versus HBM3e.
- Bus width: 256 bit versus 8192 bit.
- Bandwidth: 576.0 GB/s versus 8.19 TB/s.
- Shading units: 5120 versus 18,944.
- TMUs: 320 versus 592.
- ROPs: 160 versus 24.
- RT cores: 80 versus none.
- Tensor cores: none versus 592.
- Pixel rate: 359.2 GPixel/s versus 43.92 GPixel/s.
- Texture rate: 718.4 GTexel/s versus 1,083.4 GTexel/s.
- FP32: 45.98 TFLOPS versus 69.34 TFLOPS.
- FP16: 91.96 TFLOPS (2:1) versus 69.34 TFLOPS (1:1).
- TDP: 260 W versus 1000 W.
- Slot width: dual-slot versus SXM Module.
- Power connectors: 2x 8-pin versus none listed.
- Suggested PSU: 600 W versus 1400 W.
- Bus interface: PCIe 4.0 x16 versus PCIe 6.0 x16.
- Display outputs: 1x HDMI 2.1a, 2x DisplayPort 2.1, 1x USB Type-C versus no outputs.
- APIs: DirectX 12 Ultimate, OpenGL 4.6, Vulkan 1.4 versus N/A for all.
- Dimensions: 276 mm length, 110 mm height, 51 mm width versus none recorded.
- Release date: 2023-07-26 versus 2024-10-31.
- Predecessor: Navi II versus Server Hopper.
- Successor: Navi IV versus Server Rubin.
Where Each One Wins
The RX 7900 GRE wins in every graphics-oriented category. It has 160 ROPs against 24, delivering 359.2 GPixel/s against 43.92 GPixel/s. Its 80 ray tracing cores provide hardware RT support that the B200 lacks entirely. Its FP16 output of 91.96 TFLOPS exceeds the B200's 69.34 TFLOPS, and it does so with a 260 W TDP against 1000 W. The RX 7900 GRE also provides display outputs, graphics API compatibility, and a higher boost clock. Its benchmark record includes results across DirectX 10, 11, 12, 9, OpenCL, Vulkan, G2D, G3D, and GPU compute tests, with a 77th percentile standing.
The B200 SXM6 wins in compute capacity and memory scale. Its FP32 of 69.34 TFLOPS is 51% higher than the RX 7900 GRE's 45.98 TFLOPS. Its texture rate of 1,083.4 GTexel/s exceeds the RX 7900 GRE's 718.4 GTexel/s by the same margin. Its 180 GB of HBM3e memory with 8.19 TB/s bandwidth dwarfs the 16 GB GDDR6 at 576.0 GB/s, offering over 11 times the capacity and 14 times the bandwidth. The B200's 592 tensor cores enable tensor operations that the RX 7900 GRE cannot perform. Its PCIe 6.0 x16 interface doubles the generation of the RX 7900 GRE's PCIe 4.0 x16.
The data implies a clear split: the RX 7900 GRE for graphics rendering, ray tracing, and display-driven workloads; the B200 SXM6 for large-scale compute, tensor processing, and memory-bound server tasks. The absence of benchmark data for the B200 means its wins are specification-based, while the RX 7900 GRE's wins are backed by recorded measurements. Both products remain in active production.