Intel Arc Graphics 2 Xe Mobile vs Intel Data Center GPU Max 1100 Comparison

Intel
GPU

Intel Arc Graphics 2 Xe Mobile

CORE STATE Wildcat Lake
VRAM System Shared
CLOCK SPEED 2500 MHz
TDP 25 W
BUS WIDTH System Shared
ARCHITECTURE Xe3-LPG
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Intel
GPU

Data Center GPU Max 1100

CORE STATE Ponte Vecchio
VRAM 48 GB
CLOCK SPEED 1550 MHz
TDP 300 W
BUS WIDTH 8192 bit
ARCHITECTURE Generation 12.5
nm
PROCESS 10 nm
LAUNCH DATE 2023

Analysis: Intel Arc Graphics 2 Xe Mobile vs Intel Data Center GPU Max 1100

Where Each One Wins

The recorded data shows two Intel GPUs that occupy entirely different corners of the market. The Intel Arc Graphics 2 Xe Mobile targets integrated graphics duty inside portable devices, while the Intel Data Center GPU Max 1100 is a dual-slot accelerator built for server racks. Their benchmark win counts stand at zero apiece, but that reflects the absence of recorded head-to-head scores rather than a lack of capability differences.

The Arc Graphics 2 Xe Mobile delivers a 1,280.0 GFLOPS FP32 throughput, a 2,500 MHz boost clock, and 2 ray tracing cores. Its 256 shading units and 16 texture mapping units feed a 20.00 GPixel/s pixel rate and 40.00 GTexel/s texture rate. These figures position it for lightweight workloads like media playback, basic 3D acceleration, and portable device display output. The architecture supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4, meaning it carries the full modern API feature set for consumer applications.

The Data Center GPU Max 1100 operates in a different performance class entirely. Its 22.22 TFLOPS FP32 throughput is roughly 17 times higher than the mobile part's 1,280.0 GFLOPS. The 7168 shading units, 448 TMUs, and 56 ray tracing cores deliver a 694.4 GTexel/s texture rate. The 48 GB HBM2e memory pool with 1.23 TB/s bandwidth and an 8192-bit bus width dwarfs the mobile GPU's system-shared memory architecture. This card has no display outputs, confirming its role as a compute-oriented accelerator rather than a graphics output device.

The mobile GPU wins on power efficiency and integration. Its 25 W TDP allows it to function as an IGP with no power connectors and no slot width. The data center part demands a 300 W TDP, a 1x 12-pin power connector, a 700 W suggested PSU, and occupies a dual-slot form factor with a 267 mm length. For portable devices, the Arc Graphics 2 Xe Mobile's system-shared memory and portable-device-dependent display outputs make it the only viable choice. For dense compute workloads, the Max 1100's massive memory bandwidth and raw shader throughput establish it as the clear winner.

Architecture Differences

The two GPUs come from different foundry processes and design generations. The Arc Graphics 2 Xe Mobile uses a 3 nm process node built by Intel, while the Data Center GPU Max 1100 uses a 10 nm process node also from Intel. The mobile part is based on the Wildcat Lake chip with the Xe3-LPG architecture, part of the Arc Graphics-M (Wildcat Lake) generation. The data center part uses the Ponte Vecchio chip with the Generation 12.5 architecture, part of the Data Center GPU (Ponte Vecchio) generation.

Transistor counts reveal the scale difference. The Max 1100 packs 100,000 million transistors across a 1280 mm² die, yielding a transistor density of 78.1M per mm². The Arc Graphics 2 Xe Mobile has an unknown transistor count and die size. The 10 nm process for Ponte Vecchio produces a massive physical package, while the 3 nm node for Wildcat Lake represents Intel's more advanced manufacturing technology.

Clock behavior differs substantially. The mobile GPU has a 300 MHz base clock and a 2,500 MHz boost clock. The data center GPU has a 1,000 MHz base clock and a 1,550 MHz boost clock. Despite the lower boost ceiling, the Max 1100 achieves far higher throughput because of its massive shader count. Memory clocks also diverge: the mobile part uses system-shared memory with no dedicated clock, while the Max 1100 runs HBM2e at 600 MHz with 1200 Mbps effective data rate.

The memory subsystem is the starkest architectural split. The Arc Graphics 2 Xe Mobile uses system-shared memory with a system-dependent bandwidth, meaning its performance scales with the host platform's memory configuration. The Max 1100 has 48 GB of dedicated HBM2e memory on a 8192-bit bus with a fixed 1.23 TB/s bandwidth. The mobile GPU's memory approach suits its IGP integration, while the dedicated HBM2e stack serves the data center part's compute workloads.

API support shows a notable difference in DirectX versions. The mobile GPU supports DirectX 12 Ultimate (12_2), while the data center GPU supports DirectX 12 (12_1). Both support OpenGL 4.6. Vulkan support exists on the mobile part at version 1.4, but the data center part has null Vulkan support in the database. The mobile part's newer DirectX feature level aligns with its consumer-facing role.

FAQ

Q: Which GPU has the higher boost clock?

A: The Intel Arc Graphics 2 Xe Mobile boosts to 2,500 MHz, while the Intel Data Center GPU Max 1100 boosts to 1,550 MHz.

Q: What memory configurations do these two GPUs use?

A: The Arc Graphics 2 Xe Mobile uses system-shared memory with system-dependent bandwidth. The Data Center GPU Max 1100 has 48 GB of HBM2e memory on an 8192-bit bus with 1.23 TB/s bandwidth.

Q: Do both GPUs support ray tracing?

A: Yes. The Arc Graphics 2 Xe Mobile has 2 ray tracing cores, and the Data Center GPU Max 1100 has 56 ray tracing cores.

Q: What is the power consumption difference?

A: The Arc Graphics 2 Xe Mobile has a 25 W TDP and no power connectors. The Data Center GPU Max 1100 has a 300 W TDP, requires a 1x 12-pin power connector, and needs a 700 W suggested PSU.

Q: Which GPU supports newer DirectX features?

A: The Arc Graphics 2 Xe Mobile supports DirectX 12 Ultimate (12_2). The Data Center GPU Max 1100 supports DirectX 12 (12_1), which is one feature level behind.

Q: What form factors do these GPUs use?

A: The Arc Graphics 2 Xe Mobile is an IGP with no slot width and no power connectors. The Data Center GPU Max 1100 is a dual-slot card measuring 267 mm in length with a PCIe 5.0 x16 interface.

Specification Differences

| Specification | Intel Arc Graphics 2 Xe Mobile | Intel Data Center GPU Max 1100 |

|---|---|---|

| Process node | 3 nm | 10 nm |

| Transistors | Unknown | 100,000 million |

| Die size | Unknown | 1280 mm² |

| Transistor density | Not specified | 78.1M per mm² |

| Base clock | 300 MHz | 1,000 MHz |

| Boost clock | 2,500 MHz | 1,550 MHz |

| Memory size | System Shared | 48 GB |

| Memory type | System Shared | HBM2e |

| Memory bus width | System Shared | 8192 bit |

| Memory bandwidth | System Dependent | 1.23 TB/s |

| Shading units | 256 | 7168 |

| Texture mapping units | 16 | 448 |

| Raster output units | 8 | 0 |

| Ray tracing cores | 2 | 56 |

| Pixel rate | 20.00 GPixel/s | 0 MPixel/s |

| Texture rate | 40.00 GTexel/s | 694.4 GTexel/s |

| FP32 performance | 1,280.0 GFLOPS | 22.22 TFLOPS |

| FP16 performance | 2.560 TFLOPS (2:1) | 22.22 TFLOPS (1:1) |

| TDP | 25 W | 300 W |

| Slot width | IGP | Dual-slot |

| Power connectors | None | 1x 12-pin |

| Suggested PSU | Not specified | 700 W |

| Bus interface | IGP | PCIe 5.0 x16 |

| Display outputs | Portable Device Dependent | No outputs |

| DirectX support | 12 Ultimate (12_2) | 12 (12_1) |

| Vulkan support | 1.4 | Not specified |

| Release date | April 15, 2026 | January 9, 2023 |

| Length | Not specified | 267 mm (10.5 inches) |

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark entries between these two GPUs, and both parts show zero recorded wins in comparative testing. The average benchmark scores are zero for both, and both sit at the 50th percentile against all GPUs in the database. This means the quantitative comparison must rely on the recorded specification data rather than measured workload performance.

The FP32 compute gap is the largest single differential. The Data Center GPU Max 1100 delivers 22.22 TFLOPS, which is 17.4 times the 1,280.0 GFLOPS of the Arc Graphics 2 Xe Mobile. In FP16 workloads, the Max 1100 maintains 22.22 TFLOPS at a 1:1 ratio, while the mobile GPU reaches 2.560 TFLOPS at a 2:1 ratio. The data center part therefore sustains its peak throughput across both precision formats, whereas the mobile part halves its FP16 rate relative to FP32.

Texture throughput shows a similar magnitude of separation. The Max 1100 processes 694.4 GTexel/s versus 40.00 GTexel/s for the mobile GPU, a 17.4-fold advantage. The pixel rate comparison is inverted due to the Max 1100 having zero ROPs: the mobile GPU renders 20.00 GPixel/s, while the data center part records 0 MPixel/s. This confirms the Max 1100 is not designed for traditional rasterization output, while the mobile part handles pixel processing as its primary display function.

Memory bandwidth presents the most lopsided ratio. The Max 1100's 1.23 TB/s over an 8192-bit HBM2e interface compares against a system-dependent figure for the mobile GPU. The mobile part has no dedicated memory bandwidth because it shares system memory, making its effective throughput contingent on the host platform. The 48 GB capacity of the Max 1100 also contrasts with the mobile GPU's reliance on shared system memory, which has no fixed allocation.

The shading unit count explains the compute disparity. The Max 1100 has 7168 shading units against 256 for the mobile part, a 28-fold difference in raw execution resources. The 448 TMUs of the data center card versus 16 TMUs on the mobile part mirrors this scaling. Ray tracing cores follow the same pattern, with 56 on the Max 1100 versus 2 on the Arc Graphics 2 Xe Mobile.

Clock speeds partially offset the resource gap. The mobile GPU's 2,500 MHz boost exceeds the Max 1100's 1,550 MHz boost by 950 MHz. The base clocks show a 700 MHz advantage for the data center part, but the mobile GPU's higher boost ceiling indicates it can reach proportionally higher per-core throughput when power and thermals allow. The 3 nm process node likely enables this clock advantage despite the much smaller execution footprint.

The release timeline shows the Max 1100 launched on January 9, 2023, while the Arc Graphics 2 Xe Mobile arrived on April 15, 2026. The data center part has a successor listed as H3C Graphics, while the mobile part's predecessor is HD Graphics-M. Both GPUs remain in active production status according to the database.

DETAILED SPECIFICATIONS

SPECIFICATION
Graphics 2 Xe Mobile
Data Center GPU Max 1100
Core Specs
Shading Units
256
7,168 +2700.0%
Shaders
256
7,168 +2700.0%
TMUs
16
448 +2700.0%
ROPs
8
0 -100.0%
Execution Units
4
448 +11100.0%
Clocks
Base Clock
300 MHz
1000 MHz
Boost Clock
2500 MHz
1550 MHz
Memory Clock
System Shared
600 MHz 1200 Mbps effective
Memory
Memory Size
System Shared
48 GB
VRAM (MB)
49,152
Memory Type
System Shared
HBM2e
Memory Bus
System Shared
8192 bit
Bandwidth
System Dependent
1.23 TB/s
Cache
L1 Cache
64 KB (per EU)
64 KB (per EU)
L2 Cache
16 MB
204 MB
Performance
Pixel Rate
20.00 GPixel/s
0 MPixel/s
Texture Rate
40.00 GTexel/s
694.4 GTexel/s
FP32 (TFLOPS)
1,280.0 GFLOPS
22.22 TFLOPS
FP64 (TFLOPS)
160.0 GFLOPS (1:8)
22.22 TFLOPS (1:1)
FP16 (TFLOPS)
2.560 TFLOPS (2:1)
22.22 TFLOPS (1:1)
AI/RT
RT Cores
2
56 +2700.0%
XMX Cores
32
448 +1300.0%
Power
TDP
25 W
300 W
TDP (W)
25
300 +1100.0%
Suggested PSU
700 W
Power Connectors
None
1x 12-pin
Architecture
Architecture
Xe3-LPG
Generation 12.5
GPU Name
Wildcat Lake
Ponte Vecchio
Generation
Arc Graphics-M (Wildcat Lake)
Data Center GPU (Ponte Vecchio)
Process Size
3 nm
10 nm
Transistors
unknown
100,000 million
Die Size
unknown
1280 mm²
Foundry
Intel
Intel
Density
78.1M / mm²
API Support
DirectX
12 Ultimate (12_2)
12 (12_1)
OpenGL
4.6
4.6
Vulkan
1.4
OpenCL
3.0
3.0
Shader Model
6.9
6.6
Physical
Slot Width
IGP
Dual-slot
Length
267 mm 10.5 inches
Outputs
Portable Device Dependent
No outputs
Bus Interface
IGP
PCIe 5.0 x16
Other
Production
Active
Active
Predecessor
HD Graphics-M
Successor
H3C Graphics
View Arc Graphics 2 Xe Mobile Details View Data Center GPU Max 1100 Details