Intel Arc Graphics 1 Xe Mobile vs Intel Data Center GPU Max 1550 Comparison

The Intel Arc Graphics 1 Xe Mobile and Intel Data Center GPU Max 1550 occupy opposite ends of the GPU spectrum, one designed for efficient integrated graphics in portable devices, the other for massive data center compute. The benchmark database records no direct head-to-head tests between them, but their specifications and architectural data reveal a clear division of purpose and capability. The Arc Graphics 1 Xe Mobile delivers modern API support and a low-power footprint, while the Data Center GPU Max 1550 provides extreme compute throughput and memory capacity. The data shows that these are not competing products; they serve entirely different workloads.

Where Each One Wins

The Intel Arc Graphics 1 Xe Mobile wins in power efficiency and portability. Its thermal design power is 25 W, which allows it to operate as an integrated graphics processor (IGP) with no dedicated power connectors. The bus interface is IGP, meaning it shares the system memory and fits directly into a mobile chip. This makes it suitable for thin, lightweight devices where space and cooling are limited. The display outputs are portable device dependent, confirming its role in laptops or tablets rather than standalone graphics cards. Its production status is active, and it was released on 2026-04-15, making it a current product in the mobile segment.

The Intel Data Center GPU Max 1550 wins in raw compute and memory capacity. It houses 16,384 shading units, 1,024 texture mapping units, and 128 ray tracing cores, delivering 52.43 TFLOPS of FP32 performance. Its memory subsystem is enormous: 128 GB of HBM2e on a 8,192-bit bus, yielding 3.28 TB/s of bandwidth. The texture rate is 1,638.4 GTexel/s. This GPU uses a 600 W thermal design power and requires a 1000 W suggested power supply, reflecting its data center orientation. It connects via PCIe 5.0 x16 and has no display outputs, indicating it is a compute accelerator, not a graphics card for visual output. It was released on 2023-01-09 and remains active, with a successor listed as H3C Graphics.

In terms of process technology, the Arc Graphics 1 Xe Mobile uses a 3 nm node, while the Data Center GPU Max 1550 uses a 10 nm node. The smaller process node gives the mobile chip a significant efficiency advantage, but the data center part compensates with a massive die size of 1280 mm² and 100,000 million transistors. The transistor density of the Data Center GPU is 78.1M per mm², while the mobile chip's transistor count and die size are listed as unknown.

Architecture Differences

The two GPUs come from different architectural lineages. The Arc Graphics 1 Xe Mobile is built on the Xe3-LPG architecture with the Wildcat Lake chip, part of the Arc Graphics-M (Wildcat Lake) generation. It uses the DirectX 12 Ultimate (12_2) API, OpenGL 4.6, and Vulkan 1.4. This is a modern feature set, including support for the latest graphics features like ray tracing, as indicated by its 1 ray tracing core. Its shading units number 128, with 8 TMUs and 4 ROPs. The pixel rate is 9.200 GPixel/s, and the texture rate is 18.40 GTexel/s. FP16 performance is 1,177.6 GFLOPS with a 2:1 ratio relative to FP32, meaning it can process half-precision data at twice the rate of single-precision.

The Data Center GPU Max 1550 is built on the Generation 12.5 architecture with the Ponte Vecchio chip, part of the Data Center GPU (Ponte Vecchio) generation. Its API support is more limited: DirectX 12 (12_1), OpenGL 4.6, and no Vulkan support listed. It has 0 ROPs, which means it is not designed for rasterization or pixel output. The pixel rate is listed as 0 MPixel/s. Instead, it focuses on compute throughput. FP16 performance matches FP32 at 52.43 TFLOPS with a 1:1 ratio, meaning it does not accelerate half-precision operations beyond its single-precision rate. This is a different design philosophy: the mobile chip uses reduced precision for efficiency, while the data center part maintains consistent throughput across precision levels.

The memory architecture is fundamentally different. The Arc Graphics 1 Xe Mobile uses system shared memory, with a system dependent bandwidth and a base clock of 300 MHz that boosts to 2300 MHz. The Data Center GPU Max 1550 has dedicated HBM2e memory with a base clock of 900 MHz and a boost clock of 1600 MHz. Its memory runs at 1600 MHz with 3.2 Gbps effective data rate. The bus width of 8,192 bit is exceptionally wide, which is why bandwidth reaches 3.28 TB/s.

Head-to-Head Benchmarks

The database contains no head-to-head benchmark entries for these two GPUs, and neither has recorded benchmark scores or nearest rival data. The percentile versus all GPUs is 50 for both, but this is a placeholder value since no actual benchmarks exist. However, the specification data allows for direct comparisons of theoretical performance.

In FP32 compute, the Data Center GPU Max 1550 delivers 52.43 TFLOPS, which is 89 times the 588.8 GFLOPS of the Arc Graphics 1 Xe Mobile. This ratio comes directly from the recorded numbers. The texture rate comparison is even starker: 1,638.4 GTexel/s versus 18.40 GTexel/s, a factor of 89. The memory bandwidth difference is extreme: 3.28 TB/s versus system dependent, but the data center part uses 128 GB of dedicated memory while the mobile chip shares system memory.

Clock speeds tell a different story. The Arc Graphics 1 Xe Mobile has a base clock of 300 MHz and a boost of 2300 MHz, while the Data Center GPU Max 1550 runs at 900 MHz base and 1600 MHz boost. The mobile chip boosts to a higher frequency, but with far fewer cores. The data center part has 128 times more shading units (16,384 versus 128), 128 times more TMUs (1,024 versus 8), and 128 times more ray tracing cores (128 versus 1). The ROP count is 4 versus 0, which is the only metric where the mobile chip has an advantage in count.

The process node difference affects power and efficiency. The Arc Graphics 1 Xe Mobile uses 3 nm, while the Data Center GPU Max 1550 uses 10 nm. The mobile chip's TDP is 25 W, while the data center part consumes 600 W, a 24-fold difference. This makes the mobile chip far more suitable for battery-powered devices, while the data center part requires a 1000 W suggested power supply.

FAQ

Q: Which GPU has more shading units?

A: The Intel Data Center GPU Max 1550 has 16,384 shading units, while the Intel Arc Graphics 1 Xe Mobile has 128. The data center part has 128 times more shading units.

Q: What is the memory configuration of each GPU?

A: The Intel Arc Graphics 1 Xe Mobile uses system shared memory with system dependent bandwidth. The Intel Data Center GPU Max 1550 has 128 GB of HBM2e memory on a 8,192-bit bus with 3.28 TB/s bandwidth.

Q: Do these GPUs support the same API levels?

A: No. The Arc Graphics 1 Xe Mobile supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The Data Center GPU Max 1550 supports DirectX 12 (12_1) and OpenGL 4.6, but has no Vulkan support listed.

Q: What are the thermal design power ratings?

A: The Intel Arc Graphics 1 Xe Mobile has a TDP of 25 W. The Intel Data Center GPU Max 1550 has a TDP of 600 W, with a suggested power supply of 1000 W.

Q: Which GPU has ray tracing cores?

A: Both have ray tracing cores. The Arc Graphics 1 Xe Mobile has 1 ray tracing core, while the Data Center GPU Max 1550 has 128 ray tracing cores.

Q: What is the release date for each product?

A: The Intel Arc Graphics 1 Xe Mobile was released on 2026-04-15. The Intel Data Center GPU Max 1550 was released on 2023-01-09.

Q: What are the FP32 performance figures?

A: The Arc Graphics 1 Xe Mobile delivers 588.8 GFLOPS of FP32 performance. The Data Center GPU Max 1550 delivers 52.43 TFLOPS, which is 89 times higher.

Q: What is the die size and transistor count?

A: The Data Center GPU Max 1550 has a die size of 1280 mm² and 100,000 million transistors. The Arc Graphics 1 Xe Mobile's die size and transistor count are listed as unknown.

The Verdict

The data indicates that these two GPUs should be selected for completely different contexts. The Intel Arc Graphics 1 Xe Mobile is for portable, power-constrained devices requiring modern graphics API support. Its 25 W TDP, 3 nm process node, and IGP form factor make it suitable for mobile computing. It supports DirectX 12 Ultimate, Vulkan 1.4, and has 1 ray tracing core, which covers current gaming and graphics workloads. Its FP16 performance of 1,177.6 GFLOPS with a 2:1 ratio shows it can accelerate half-precision tasks efficiently. The system shared memory and system dependent bandwidth mean performance scales with the host platform, but this is acceptable for integrated graphics.

The Intel Data Center GPU Max 1550 is for high-throughput compute workloads in data centers. Its 52.43 TFLOPS of FP32 and 3.28 TB/s memory bandwidth, combined with 128 GB of HBM2e, are designed for large-scale parallel processing. The 128 ray tracing cores and 1,024 TMUs further support compute-heavy tasks. The lack of ROPs and display outputs confirms it is not meant for rendering to screens. The 600 W TDP and 1000 W suggested power supply require dedicated infrastructure. Its 10 nm process node and 1280 mm² die size with 100,000 million transistors show a different engineering trade-off: raw scale over efficiency.

The production status for both is active. The Arc Graphics 1 Xe Mobile lists its predecessor as HD Graphics-M, while the Data Center GPU Max 1550 lists its successor as H3C Graphics. This shows both are in active product lines. The release dates differ by about three years, with the data center part launching earlier on 2023-01-09 and the mobile chip on 2026-04-15.

For users needing integrated graphics in a mobile device, the Arc Graphics 1 Xe Mobile is the clear choice. Its 3 nm node and 25 W TDP are unmatched by the data center part. For data center compute, the Data Center GPU Max 1550 is the only option of the two, with its massive core count and memory subsystem. There is no overlap in their intended use cases. The database shows these are complementary products within Intel's portfolio, not competitors.

Specification Differences

The following fields differ between the two GPUs:

• Chip: Wildcat Lake versus Ponte Vecchio
• Architecture: Xe3-LPG versus Generation 12.5
• Generation: Arc Graphics-M (Wildcat Lake) versus Data Center GPU (Ponte Vecchio)
• Process Node: 3 nm versus 10 nm
• Transistors: unknown versus 100,000 million
• Die Size: unknown versus 1280 mm²
• Transistor Density: null versus 78.1M / mm²
• Base Clock: 300 MHz versus 900 MHz
• Boost Clock: 2300 MHz versus 1600 MHz
• Memory Clock: System Shared versus 1600 MHz, 3.2 Gbps effective
• Memory Size: System Shared versus 128 GB
• Memory Type: System Shared versus HBM2e
• Memory Bus Width: System Shared versus 8192 bit
• Memory Bandwidth: System Dependent versus 3.28 TB/s
• Shading Units: 128 versus 16,384
• TMUs: 8 versus 1,024
• ROPs: 4 versus 0
• RT Cores: 1 versus 128
• Pixel Rate: 9.200 GPixel/s versus 0 MPixel/s
• Texture Rate: 18.40 GTexel/s versus 1,638.4 GTexel/s
• FP32: 588.8 GFLOPS versus 52.43 TFLOPS
• FP16: 1,177.6 GFLOPS (2:1) versus 52.43 TFLOPS (1:1)
• TDP: 25 W versus 600 W
• Slot Width: IGP versus OAM Module
• Power Connectors: None versus null
• Suggested PSU: null versus 1000 W
• Bus Interface: IGP versus PCIe 5.0 x16
• Display Outputs: Portable Device Dependent versus No outputs
• DirectX: 12 Ultimate (12_2) versus 12 (12_1)
• Vulkan: 1.4 versus null
• Release Date: 2026-04-15 versus 2023-01-09
• Predecessor: HD Graphics-M versus null
• Successor: null versus H3C Graphics

The shared fields include manufacturer (Intel), foundry (Intel), OpenGL version (4.6), and production status (Active). Both lack tensor core data and launch MSRP information. The for Data Center GPU Max 1550 has no power connector data, while the mobile chip explicitly has none. These differences reinforce the fundamental split: a low-power integrated mobile GPU versus a high-power data center accelerator.