Intel Arc Graphics 1 Xe Mobile vs Intel Data Center GPU Max 1100 Comparison

Intel
GPU

Intel Arc Graphics 1 Xe Mobile

CORE STATE Wildcat Lake
VRAM System Shared
CLOCK SPEED 2300 MHz
TDP 25 W
BUS WIDTH System Shared
ARCHITECTURE Xe3-LPG
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Intel
GPU

Data Center GPU Max 1100

CORE STATE Ponte Vecchio
VRAM 48 GB
CLOCK SPEED 1550 MHz
TDP 300 W
BUS WIDTH 8192 bit
ARCHITECTURE Generation 12.5
nm
PROCESS 10 nm
LAUNCH DATE 2023

Analysis: Intel Arc Graphics 1 Xe Mobile vs Intel Data Center GPU Max 1100

Head-to-Head Benchmarks

The recorded data contains no direct head-to-head benchmark results for these two Intel graphics products. The database shows zero wins for each side, and no benchmark scores populate the comparison fields. This absence of measured performance data is itself informative: it means any direct performance comparison must be inferred from the architectural specifications and compute capability figures rather than from empirical testing results.

The raw compute numbers reveal a stark disparity. The Data Center GPU Max 1100 delivers 22.22 TFLOPS of FP32 performance, while the Arc Graphics 1 Xe Mobile delivers 588.8 GFLOPS. This represents a 37.7x difference in raw single-precision throughput. The FP16 comparison is similarly lopsided: the Data Center part achieves 22.22 TFLOPS at a 1:1 ratio, while the mobile chip manages 1,177.6 GFLOPS at a 2:1 ratio, meaning the former processes half-precision at roughly 18.9x the rate of the latter.

Texture processing tells a comparable story. The Data Center GPU Max 1100 achieves a texture rate of 694.4 GTexel/s, while the Arc Graphics 1 Xe Mobile manages 18.40 GTexel/s, a 37.7x gap that mirrors the FP32 difference. Pixel throughput, however, shows an unusual inversion in the specifications: the mobile part lists 9.200 GPixel/s, while the Data Center part lists 0 MPixel/s. This likely reflects the different roles of each product, as the Data Center GPU lacks display outputs entirely and is not designed for rasterized pixel generation in the traditional sense.

Memory bandwidth presents another massive separation. The Data Center GPU Max 1100 uses 48 GB of HBM2e memory across an 8192-bit bus, delivering 1.23 TB/s of bandwidth. The Arc Graphics 1 Xe Mobile uses system shared memory with bandwidth described as system dependent, which means its effective bandwidth cannot be quantified independently of the host platform. In practical terms, the Data Center part offers several orders of magnitude more memory bandwidth for data-intensive workloads.

Clock speeds differ substantially as well. The mobile chip has a base clock of 300 MHz and a boost clock of 2300 MHz, while the Data Center part runs at a 1000 MHz base and 1550 MHz boost. The mobile chip's higher boost clock reflects its thermal headroom in short bursts, but the Data Center GPU's far larger execution unit count more than compensates for its lower peak frequency. The mobile chip achieves its boost clock through a 2300 MHz ceiling, but the Data Center part maintains a higher floor at 1000 MHz.

Where Each One Wins

The Arc Graphics 1 Xe Mobile is designed for integrated use in portable devices. Its 25 W TDP, IGP slot width, and lack of power connectors position it for laptops and compact systems where power draw is constrained. It supports DirectX 12 Ultimate (12_2) and Vulkan 1.4, and it includes display outputs described as portable device dependent. For lightweight graphics tasks such as media playback, basic 3D acceleration, and everyday computing, this chip provides a functional graphics solution without requiring discrete power delivery.

The Data Center GPU Max 1100 is engineered for compute-heavy environments. Its 300 W TDP, dual-slot form factor, and 1x 12-pin power connector indicate a card designed for servers and workstations with substantial power delivery infrastructure. With 7,168 shading units, 448 TMUs, and 56 ray tracing cores, it targets workloads that demand massive parallel throughput. The 48 GB HBM2e memory with 1.23 TB/s bandwidth suits large datasets, scientific computing, and AI inference tasks that cannot fit in smaller memory pools.

The mobile part wins in portability, power efficiency, and display connectivity. The Data Center part wins in raw compute, memory capacity, memory bandwidth, and sustained throughput. Neither product is a substitute for the other. The Arc Graphics 1 Xe Mobile is a system component that enables graphics output on a host device, while the Data Center GPU Max 1100 is an accelerator that requires a host system to provide any visual output, as it has no display outputs of its own.

Architecture Differences

The two products come from entirely different architectural lineages. The Arc Graphics 1 Xe Mobile uses the Wildcat Lake chip built on the Xe3-LPG architecture, manufactured on a 3 nm process at Intel's foundry. The Data Center GPU Max 1100 uses the Ponte Vecchio chip built on Generation 12.5 architecture, manufactured on a 10 nm process. The process node difference is significant: 3 nm versus 10 nm represents a substantial generational leap in transistor density and power efficiency.

The transistor counts reflect this scale difference. The Data Center GPU Max 1100 integrates 100,000 million transistors on a 1280 mm² die, with a transistor density of 78.1M per mm². The mobile chip's transistor count and die size are listed as unknown, but its integrated nature and 25 W TDP suggest a much smaller implementation. The Data Center GPU's die size of 1280 mm² is among the largest in the database, which is consistent with its role as a high-throughput accelerator.

The memory subsystems are fundamentally different. The mobile part uses system shared memory with a system dependent bandwidth figure, meaning it relies on the host's memory controller and has no dedicated video memory. The Data Center part uses 48 GB of HBM2e memory with a 8192-bit bus and a fixed 1.23 TB/s bandwidth. The memory clock for the Data Center part is listed as 600 MHz with 1200 Mbps effective, while the mobile part's memory clock is system shared.

The API support differs in notable ways. The mobile part supports DirectX 12 Ultimate (12_2), which includes features like mesh shaders and variable rate shading, and it supports Vulkan 1.4. The Data Center part supports only DirectX 12 (12_1) and has no Vulkan support listed. Both support OpenGL 4.6. The mobile part has one ray tracing core, while the Data Center part has 56, but the mobile part's support for the newer DirectX feature set suggests it is aimed at consumer workloads, while the Data Center part prioritizes compute over graphics features.

The bus interfaces differ completely. The mobile part uses an integrated graphics processor (IGP) interface, meaning it is built into the host processor. The Data Center part uses PCIe 5.0 x16, a discrete expansion interface. The Data Center part requires a 700 W suggested PSU, while the mobile part has no power connectors and no suggested PSU. The Data Center part measures 267 mm or 10.5 inches in length, while the mobile part has no listed dimensions because it is integrated into a processor package.

The release dates are separated by roughly three years. The Data Center GPU Max 1100 was released on January 9, 2023, while the Arc Graphics 1 Xe Mobile was released on April 15, 2026. The mobile part lists the HD Graphics-M as its predecessor, while the Data Center part lists the H3C Graphics as its successor. The production status for both is listed as active.

FAQ

Q: Which GPU has higher FP32 compute performance?

A: The Intel Data Center GPU Max 1100 delivers 22.22 TFLOPS of FP32 performance, while the Intel Arc Graphics 1 Xe Mobile delivers 588.8 GFLOPS. The Data Center part is approximately 37.7x faster in raw single-precision throughput.

Q: What memory configurations do these GPUs use?

A: The Data Center GPU Max 1100 uses 48 GB of HBM2e memory on an 8192-bit bus with 1.23 TB/s bandwidth. The Arc Graphics 1 Xe Mobile uses system shared memory with system dependent bandwidth, meaning it has no dedicated video memory.

Q: Do both GPUs support ray tracing?

A: Yes. The Arc Graphics 1 Xe Mobile has 1 ray tracing core, while the Data Center GPU Max 1100 has 56 ray tracing cores. The mobile part supports DirectX 12 Ultimate (12_2), which includes ray tracing features, while the Data Center part supports only DirectX 12 (12_1).

Q: What are the power requirements for each GPU?

A: The Arc Graphics 1 Xe Mobile has a 25 W TDP, uses an IGP slot width, has no power connectors, and requires no suggested PSU. The Data Center GPU Max 1100 has a 300 W TDP, uses a dual-slot form factor, requires a 1x 12-pin power connector, and has a 700 W suggested PSU.

Q: Can the Data Center GPU Max 1100 output video to a display?

A: No. The Data Center GPU Max 1100 has no display outputs listed. The Arc Graphics 1 Xe Mobile has display outputs described as portable device dependent, meaning it can drive displays on systems where it is integrated.

Q: Which GPU supports the newer DirectX version?

A: The Arc Graphics 1 Xe Mobile supports DirectX 12 Ultimate (12_2), which is the newer feature set. The Data Center GPU Max 1100 supports DirectX 12 (12_1). The mobile part also supports Vulkan 1.4, while the Data Center part has no Vulkan support listed.

The Verdict

The data indicates two products with opposite design philosophies. The Arc Graphics 1 Xe Mobile is an integrated graphics solution for portable devices, built on a 3 nm process, consuming 25 W, and supporting modern graphics APIs including DirectX 12 Ultimate and Vulkan 1.4. It delivers 588.8 GFLOPS of FP32 performance and 1,177.6 GFLOPS of FP16 performance, with a 2300 MHz boost clock and system shared memory.

The Data Center GPU Max 1100 is a discrete accelerator for compute environments, built on a 10 nm process with 100,000 million transistors, consuming 300 W, and providing 22.22 TFLOPS of both FP32 and FP16 performance. Its 48 GB HBM2e memory with 1.23 TB/s bandwidth and 7,168 shading units position it for large-scale parallel workloads.

The choice between them depends entirely on the workload context. Systems requiring integrated graphics with display output and low power consumption should use the Arc Graphics 1 Xe Mobile. Systems requiring maximum compute throughput, large memory capacity, and high bandwidth should use the Data Center GPU Max 1100. The Data Center part cannot output video, and the mobile part cannot match the compute density of the Data Center part. The 3 nm process of the mobile chip indicates a modern, efficient design, while the 10 nm process of the Data Center chip reflects its 2023 release and focus on raw throughput over efficiency. The mobile part's 2026 release date and newer architecture suggest it benefits from three additional years of process and design improvements, but the raw execution resources of the Data Center part remain unmatched in this comparison.

Specification Differences

| Specification | Intel Arc Graphics 1 Xe Mobile | Intel Data Center GPU Max 1100 |

|---|---|---|

| Architecture | Xe3-LPG | Generation 12.5 |

| Process Node | 3 nm | 10 nm |

| Transistors | unknown | 100,000 million |

| Die Size | unknown | 1280 mm² |

| Transistor Density | null | 78.1M / mm² |

| Base Clock | 300 MHz | 1000 MHz |

| Boost Clock | 2300 MHz | 1550 MHz |

| Memory Size | System Shared | 48 GB |

| Memory Type | System Shared | HBM2e |

| Memory Bus Width | System Shared | 8192 bit |

| Memory Bandwidth | System Dependent | 1.23 TB/s |

| Memory Clock | System Shared | 600 MHz, 1200 Mbps effective |

| Shading Units | 128 | 7168 |

| TMUs | 8 | 448 |

| ROPs | 4 | 0 |

| Ray Tracing Cores | 1 | 56 |

| Pixel Rate | 9.200 GPixel/s | 0 MPixel/s |

| Texture Rate | 18.40 GTexel/s | 694.4 GTexel/s |

| FP32 Performance | 588.8 GFLOPS | 22.22 TFLOPS |

| FP16 Performance | 1,177.6 GFLOPS (2:1) | 22.22 TFLOPS (1:1) |

| TDP | 25 W | 300 W |

| Slot Width | IGP | Dual-slot |

| Power Connectors | None | 1x 12-pin |

| Suggested PSU | null | 700 W |

| Bus Interface | IGP | PCIe 5.0 x16 |

| Display Outputs | Portable Device Dependent | No outputs |

| DirectX Support | 12 Ultimate (12_2) | 12 (12_1) |

| Vulkan Support | 1.4 | null |

| Length | null | 267 mm (10.5 inches) |

| Release Date | 2026-04-15 | 2023-01-09 |

| Predecessor | HD Graphics-M | null |

| Successor | null | H3C Graphics |

DETAILED SPECIFICATIONS

SPECIFICATION
Graphics 1 Xe Mobile
Data Center GPU Max 1100
Core Specs
Shading Units
128
7,168 +5500.0%
Shaders
128
7,168 +5500.0%
TMUs
8
448 +5500.0%
ROPs
4
0 -100.0%
Execution Units
2
448 +22300.0%
Clocks
Base Clock
300 MHz
1000 MHz
Boost Clock
2300 MHz
1550 MHz
Memory Clock
System Shared
600 MHz 1200 Mbps effective
Memory
Memory Size
System Shared
48 GB
VRAM (MB)
49,152
Memory Type
System Shared
HBM2e
Memory Bus
System Shared
8192 bit
Bandwidth
System Dependent
1.23 TB/s
Cache
L1 Cache
64 KB (per EU)
64 KB (per EU)
L2 Cache
16 MB
204 MB
Performance
Pixel Rate
9.200 GPixel/s
0 MPixel/s
Texture Rate
18.40 GTexel/s
694.4 GTexel/s
FP32 (TFLOPS)
588.8 GFLOPS
22.22 TFLOPS
FP64 (TFLOPS)
73.60 GFLOPS (1:8)
22.22 TFLOPS (1:1)
FP16 (TFLOPS)
1,177.6 GFLOPS (2:1)
22.22 TFLOPS (1:1)
AI/RT
RT Cores
1
56 +5500.0%
XMX Cores
32
448 +1300.0%
Power
TDP
25 W
300 W
TDP (W)
25
300 +1100.0%
Suggested PSU
700 W
Power Connectors
None
1x 12-pin
Architecture
Architecture
Xe3-LPG
Generation 12.5
GPU Name
Wildcat Lake
Ponte Vecchio
Generation
Arc Graphics-M (Wildcat Lake)
Data Center GPU (Ponte Vecchio)
Process Size
3 nm
10 nm
Transistors
unknown
100,000 million
Die Size
unknown
1280 mm²
Foundry
Intel
Intel
Density
78.1M / mm²
API Support
DirectX
12 Ultimate (12_2)
12 (12_1)
OpenGL
4.6
4.6
Vulkan
1.4
OpenCL
3.0
3.0
Shader Model
6.9
6.6
Physical
Slot Width
IGP
Dual-slot
Length
267 mm 10.5 inches
Outputs
Portable Device Dependent
No outputs
Bus Interface
IGP
PCIe 5.0 x16
Other
Production
Active
Active
Predecessor
HD Graphics-M
Successor
H3C Graphics
View Arc Graphics 1 Xe Mobile Details View Data Center GPU Max 1100 Details