GPU Comparison
RADEON
AMD Radeon R9 M295X
CORE STATE
Amethyst
VRAM
4 GB
CLOCK SPEED
—
TDP
250 W
BUS WIDTH
256 bit
ARCHITECTURE
GCN 3.0
PROCESS
28 nm
LAUNCH DATE
2014
VS
GPU
Arc A770M
CORE STATE
DG2-512
VRAM
16 GB
CLOCK SPEED
2050 MHz
TDP
120 W
BUS WIDTH
256 bit
ARCHITECTURE
Xe-HPG
PROCESS
6 nm
LAUNCH DATE
—
PERFORMANCE BENCHMARKS
geekbench_metal
geekbench_opencl
geekbench_vulkan
3dmark_3dmark_steel_nomad_dx12
passmark_directx_10
passmark_directx_11
passmark_directx_12
passmark_directx_9
passmark_g2d
passmark_g3d
passmark_gpu_compute
DETAILED SPECIFICATIONS
SPECIFICATION
R9 M295X
A770M
Core Specs
Shading Units
2,048
4,096
+100.0%
Shaders
2,048
4,096
+100.0%
TMUs
128
256
+100.0%
ROPs
32
128
+300.0%
Compute Units
32
—
Execution Units
—
512
Clocks
Base Clock
—
1650 MHz
Boost Clock
—
2050 MHz
GPU Clock
723 MHz
—
Memory Clock
1250 MHz
5 Gbps effective
2000 MHz
16 Gbps effective
Memory
Memory Size
4 GB
16 GB
VRAM (MB)
4,096
16,384
+300.0%
Memory Type
GDDR5
GDDR6
Memory Bus
256 bit
256 bit
Bandwidth
160.0 GB/s
512.0 GB/s
Cache
L1 Cache
16 KB (per CU)
—
L2 Cache
512 KB
16 MB
Performance
Pixel Rate
23.14 GPixel/s
262.4 GPixel/s
Texture Rate
92.54 GTexel/s
524.8 GTexel/s
FP32 (TFLOPS)
2.961 TFLOPS
16.79 TFLOPS
FP64 (TFLOPS)
185.1 GFLOPS (1:16)
—
FP16 (TFLOPS)
2.961 TFLOPS (1:1)
33.59 TFLOPS (2:1)
AI/RT
RT Cores
—
32
XMX Cores
—
512
Power
TDP
250 W
120 W
TDP (W)
250
120
-52.0%
Power Connectors
None
—
Architecture
Architecture
GCN 3.0
Xe-HPG
GPU Name
Amethyst
DG2-512
Generation
Gem System
(R9 M200)
Alchemist
(Arc 7 Mobile)
Process Size
28 nm
6 nm
Transistors
5,000 million
21,700 million
Die Size
366 mm²
406 mm²
Foundry
TSMC
TSMC
Density
13.7M / mm²
53.4M / mm²
API Support
DirectX
12 (12_0)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1
3.0
Shader Model
6.5
6.6
Physical
Slot Width
MXM Module
IGP
Outputs
Portable Device Dependent
Portable Device Dependent
Bus Interface
MXM-B (3.0)
PCIe 4.0 x16
Other
Production
End-of-life
End-of-life
Predecessor
Solar System
—
Successor
Polaris Mobile
—