AMD Instinct MI355X vs Intel Data Center GPU Max 1350 Comparison

AMD
RADEON

AMD Instinct MI355X

CORE STATE MI350 256CU
VRAM 288 GB
CLOCK SPEED 2400 MHz
TDP 1400 W
BUS WIDTH 8192 bit
ARCHITECTURE CDNA 4.0
nm
PROCESS 3 nm
LAUNCH DATE 2025
VS
Intel
GPU

Data Center GPU Max 1350

CORE STATE Ponte Vecchio
VRAM 96 GB
CLOCK SPEED 1550 MHz
TDP 450 W
BUS WIDTH 8192 bit
ARCHITECTURE Generation 12.5
nm
PROCESS 10 nm
LAUNCH DATE 2023

Analysis: AMD Instinct MI355X vs Intel Data Center GPU Max 1350

Head-to-Head Benchmarks

The recorded data contains no direct head-to-head benchmark results between the AMD Instinct MI355X and the Intel Data Center GPU Max 1350. Both products have an average benchmark score of 0 in the database, and both sit at the 50th percentile among all GPUs. Without measured performance comparisons, the analysis must rely on the architectural and specification differences to project relative capabilities.

The most significant mathematical gap appears in raw compute throughput. The AMD Instinct MI355X delivers 78.64 TFLOPS for both FP32 and FP16 operations, while the Intel Data Center GPU Max 1350 produces 44.44 TFLOPS in both precision formats. This represents a 77% advantage for the AMD part in peak floating-point throughput. In practical terms, the MI355X can process nearly double the arithmetic operations per second compared to the Intel accelerator, assuming both reach their rated peak efficiencies.

Memory bandwidth shows an even larger disparity. The MI355X achieves 8.19 TB/s from its HBM3e stack, whereas the Max 1350 reaches 2.46 TB/s from HBM2e. That is a 3.3x bandwidth advantage for AMD. For workloads that are memory-bound, such as large matrix multiplications or data movement through neural network layers, this difference can directly translate into faster iteration times. The Intel part's bandwidth, while substantially lower, still represents a capable figure for a 450 W accelerator.

Texture throughput follows the same pattern. The MI355X reaches 2,457.6 GTexel/s, compared to 1,388.8 GTexel/s for the Intel part, a 77% lead. Both parts have a pixel rate of 0 MPixel/s, confirming that neither is designed for traditional rasterization output. The absence of pixel processing capability makes both devices specialized for compute rather than graphics rendering.

Clock speeds reveal interesting contrasts. The AMD part operates at a 1000 MHz base clock and boosts to 2400 MHz. The Intel part runs at 750 MHz base and 1550 MHz boost. Even at its boost frequency, the Intel accelerator cannot match the AMD base clock. Higher clocks on the AMD side, combined with its larger shading unit count of 16,384 versus 14,336, explain part of the compute throughput gap. The Intel part includes 112 ray tracing cores, which the AMD part does not list, but this feature is irrelevant for data center compute workloads that do not involve ray-traced rendering.

Shading unit counts also differ. The AMD MI355X contains 16,384 shading units and 1,024 texture mapping units. The Intel Max 1350 contains 14,336 shading units and 896 texture mapping units. The AMD part leads by 14% in shading units and 14% in TMUs. These differences compound with the clock advantage to produce the observed FP32 and FP16 throughput gaps.

The database records no wins for either product in head-to-head benchmarks, and no benchmark entries exist for either accelerator. The percentage differences between rivals cannot be computed from empty arrays. This absence of measured data means the projected performance relationship rests entirely on specification analysis.

FAQ

Q: Which accelerator has higher memory bandwidth?

A: The AMD Instinct MI355X delivers 8.19 TB/s from 288 GB of HBM3e memory. The Intel Data Center GPU Max 1350 delivers 2.46 TB/s from 96 GB of HBM2e memory. The AMD part provides 3.3x the bandwidth and 3x the memory capacity.

Q: Do these GPUs support graphics APIs?

A: The Intel Data Center GPU Max 1350 supports DirectX 12 (12_1) and OpenGL 4.6. The AMD Instinct MI355X lists N/A for DirectX, OpenGL, and Vulkan. Neither device has display outputs, confirming both are compute-focused accelerators.

Q: What is the thermal design power difference?

A: The AMD Instinct MI355X has a TDP of 1400 W and a suggested power supply of 1800 W. The Intel Data Center GPU Max 1350 has a TDP of 450 W and a suggested power supply of 850 W. The Intel part consumes less than one-third the power of the AMD part.

Q: How do the manufacturing processes compare?

A: The AMD Instinct MI355X uses a 3 nm process from TSMC. The Intel Data Center GPU Max 1350 uses a 10 nm process from Intel's own foundry. The AMD chip contains 185,000 million transistors on a 2380 mm² die, while the Intel chip contains 100,000 million transistors on a 1280 mm² die.

Q: Do both accelerators have the same memory bus width?

A: Yes, both use an 8192-bit memory bus. However, the AMD part pairs this with HBM3e memory at 2000 MHz (8 Gbps effective), while the Intel part uses HBM2e at 1200 MHz (2.4 Gbps effective). The same bus width with faster memory gives AMD its bandwidth advantage.

Q: Which accelerator has a higher transistor density?

A: The Intel Data Center GPU Max 1350 has a slightly higher transistor density at 78.1M per mm², compared to 77.7M per mm² for the AMD Instinct MI355X. The difference is less than 1%, making the two effectively comparable in packing efficiency despite different process nodes.

Architecture Differences

The AMD Instinct MI355X uses the CDNA 4.0 architecture, built on a 3 nm process at TSMC. The chip is designated MI350 256CU and belongs to the Instinct (MIx) generation. Its predecessor is Radeon Instinct. The Intel Data Center GPU Max 1350 uses the Generation 12.5 architecture, known as Ponte Vecchio, built on Intel's 10 nm process. It belongs to the Data Center GPU (Ponte Vecchio) generation and has the successor H3C Graphics.

The transistor counts differ substantially. AMD packs 185,000 million transistors into a 2380 mm² die, while Intel packs 100,000 million transistors into a 1280 mm² die. Transistor density is nearly identical: 77.7M per mm² for AMD versus 78.1M per mm² for Intel. The similar density with a far larger die explains why AMD can fit nearly twice the transistor count.

Memory architecture marks a clear generational split. The AMD part uses HBM3e, the latest high-bandwidth memory generation, while the Intel part uses HBM2e. Both connect through an 8192-bit bus, but the memory clock differs: 2000 MHz (8 Gbps effective) for AMD versus 1200 MHz (2.4 Gbps effective) for Intel. The combination of newer memory technology and higher clock speed produces the 8.19 TB/s versus 2.46 TB/s bandwidth gap.

Compute resources also differ. AMD provides 16,384 shading units and 1,024 TMUs, with no ray tracing cores listed. Intel provides 14,336 shading units, 896 TMUs, and 112 ray tracing cores. The presence of ray tracing cores on the Intel part is notable, as it suggests a hardware capability for ray intersection calculations, even though the device has no display outputs and appears oriented toward compute tasks. The AMD part's architecture does not list ray tracing hardware.

API support separates the two as well. Intel lists DirectX 12 (12_1) and OpenGL 4.6 support, while AMD lists N/A across all graphics APIs. This could indicate that the Intel accelerator retains some graphics-related capability in its hardware stack, while the AMD part is purely compute-oriented. Neither device has display outputs, so any graphics API support would not connect to physical displays.

Both parts use PCIe 5.0 x16 as the bus interface and come in OAM Module slot form. Neither has traditional power connectors listed; the AMD part explicitly lists "None" for power connectors, consistent with OAM modules that receive power through the module connector. The Intel part does not list power connector information.

Specification Differences

The AMD Instinct MI355X and Intel Data Center GPU Max 1350 differ across nearly every major specification category. The process node differs: 3 nm for AMD versus 10 nm for Intel. The foundry differs: TSMC for AMD versus Intel for the Intel part. Transistor count differs: 185,000 million versus 100,000 million. Die size differs: 2380 mm² versus 1280 mm².

Clock speeds differ in both base and boost. AMD runs at 1000 MHz base and 2400 MHz boost. Intel runs at 750 MHz base and 1550 MHz boost. Memory clocks differ: 2000 MHz (8 Gbps effective) for AMD versus 1200 MHz (2.4 Gbps effective) for Intel.

Memory capacity differs: 288 GB for AMD versus 96 GB for Intel. Memory type differs: HBM3e versus HBM2e. Bandwidth differs: 8.19 TB/s versus 2.46 TB/s. The bus width is the same at 8192 bit.

Compute unit counts differ. AMD has 16,384 shading units and 1,024 TMUs. Intel has 14,336 shading units and 896 TMUs. Intel includes 112 ray tracing cores; AMD lists none. Pixel rate is 0 MPixel/s for both.

Texture rate differs: 2,457.6 GTexel/s for AMD versus 1,388.8 GTexel/s for Intel. FP32 and FP16 throughput differ: 78.64 TFLOPS for AMD versus 44.44 TFLOPS for Intel, with both running at a 1:1 ratio between the two precisions.

TDP differs significantly: 1400 W for AMD versus 450 W for Intel. Suggested PSU differs: 1800 W versus 850 W. Dimensions are only listed for AMD: 102 mm length and 165 mm width. Intel dimensions are not recorded.

API support differs: Intel lists DirectX 12 (12_1) and OpenGL 4.6, while AMD lists N/A for all. Release dates differ: AMD released on June 11, 2025, while Intel released on January 9, 2023. The Intel part has an active production status; AMD's production status is not recorded.

Where Each One Wins

The AMD Instinct MI355X wins in every raw performance specification recorded in the database. It leads in FP32 throughput with 78.64 TFLOPS versus 44.44 TFLOPS. It leads in FP16 throughput by the same margin. It leads in memory bandwidth with 8.19 TB/s versus 2.46 TB/s. It leads in memory capacity with 288 GB versus 96 GB. It leads in texture rate with 2,457.6 GTexel/s versus 1,388.8 GTexel/s. It leads in shading units, TMUs, base clock, and boost clock.

The Intel Data Center GPU Max 1350 wins in power efficiency. Its 450 W TDP is less than one-third of the AMD part's 1400 W TDP. Its suggested PSU of 850 W is less than half the AMD part's 1800 W suggestion. For deployments with power constraints, the Intel part delivers 44.44 TFLOPS at 450 W, while the AMD part delivers 78.64 TFLOPS at 1400 W. On a per-watt basis, the Intel part achieves approximately 0.099 TFLOPS per watt, while the AMD part achieves approximately 0.056 TFLOPS per watt, making Intel more efficient in FP32 throughput per unit of power.

The Intel part also wins on ray tracing capability, with 112 ray tracing cores present in its hardware. The AMD part lists no ray tracing cores. For any compute workload that leverages ray intersection hardware, the Intel accelerator has a structural advantage, though the absence of display outputs limits the practical application of this feature.

The Intel part wins on production status clarity. Its production status is recorded as Active, while the AMD part's production status is not recorded. This gives the Intel accelerator a confirmed availability signal in the database.

The AMD part wins on memory technology generation. HBM3e represents a newer memory standard than HBM2e, and the 8.19 TB/s bandwidth reflects this advancement. The 288 GB capacity also positions the AMD part for larger models and datasets that exceed the 96 GB capacity of the Intel part.

The Verdict

The data points to a straightforward performance hierarchy. The AMD Instinct MI355X dominates the Intel Data Center GPU Max 1350 in compute throughput, memory bandwidth, memory capacity, and clock speeds. Its 78.64 TFLOPS FP32 output is 77% higher than the Intel part's 44.44 TFLOPS. Its 8.19 TB/s bandwidth is 3.3x higher. Its 288 GB memory capacity is 3x higher. For workloads that scale with raw compute and memory resources, the AMD accelerator is the stronger choice.

The Intel Data Center GPU Max 1350 offers a different trade-off. Its 450 W TDP makes it suitable for power-constrained environments where the 1400 W requirement of the AMD part is not feasible. Its 112 ray tracing cores provide hardware functionality absent from the AMD part. Its earlier release date of January 9, 2023, compared to June 11, 2025, means it has been available for a longer period.

The absence of benchmark scores in the database means these conclusions rest on specification analysis rather than measured performance. The average benchmark score of 0 for both parts and the empty head-to-head benchmark array indicate that no recorded performance data exists for either accelerator. The percentile ranking of 50 for both parts reflects this lack of measurement rather than an actual performance tie.

The transistor density figures of 77.7M per mm² for AMD and 78.1M per mm² for Intel show that both manufacturers achieved similar packing efficiency despite different process nodes. The AMD part's advantage comes from its larger die, not from superior density. The Intel part's smaller die and lower power draw indicate a more conservative design that prioritizes efficiency over peak throughput.

For deployments prioritizing maximum compute and memory resources, the AMD Instinct MI355X delivers the highest recorded specifications in this comparison. For deployments prioritizing power efficiency and ray tracing hardware, the Intel Data Center GPU Max 1350 provides the relevant capabilities. The database records no measured performance data to override these specification-based projections.

DETAILED SPECIFICATIONS

SPECIFICATION
Instinct MI355X
Data Center GPU Max 1350
Core Specs
Shading Units
16,384
14,336 -12.5%
Shaders
16,384
14,336 -12.5%
TMUs
1,024
896 -12.5%
ROPs
0
0 0.0%
Compute Units
256
Execution Units
896
Clocks
Base Clock
1000 MHz
750 MHz
Boost Clock
2400 MHz
1550 MHz
Memory Clock
2000 MHz 8 Gbps effective
1200 MHz 2.4 Gbps effective
Memory
Memory Size
288 GB
96 GB
VRAM (MB)
294,912
98,304 -66.7%
Memory Type
HBM3e
HBM2e
Memory Bus
8192 bit
8192 bit
Bandwidth
8.19 TB/s
2.46 TB/s
Cache
L1 Cache
32 KB (per CU)
64 KB (per EU)
L2 Cache
32 MB
408 MB
L3 Cache
256 MB
Performance
Pixel Rate
0 MPixel/s
0 MPixel/s
Texture Rate
2,457.6 GTexel/s
1,388.8 GTexel/s
FP32 (TFLOPS)
78.64 TFLOPS
44.44 TFLOPS
FP64 (TFLOPS)
39.32 TFLOPS (1:2)
44.44 TFLOPS (1:1)
FP16 (TFLOPS)
78.64 TFLOPS (1:1)
44.44 TFLOPS (1:1)
AI/RT
RT Cores
112
XMX Cores
896
Matrix Cores
1,024
Power
TDP
1400 W
450 W
TDP (W)
1,400
450 -67.9%
Suggested PSU
1800 W
850 W
Power Connectors
None
Architecture
Architecture
CDNA 4.0
Generation 12.5
GPU Name
MI350 256CU
Ponte Vecchio
Generation
Instinct (MIx)
Data Center GPU (Ponte Vecchio)
Process Size
3 nm
10 nm
Transistors
185,000 million
100,000 million
Die Size
2380 mm²
1280 mm²
Foundry
TSMC
Intel
Density
77.7M / mm²
78.1M / mm²
API Support
DirectX
12 (12_1)
OpenGL
4.6
OpenCL
3.0
3.0
Shader Model
6.6
Physical
Slot Width
OAM Module
OAM Module
Length
102 mm 4 inches
Outputs
No outputs
No outputs
Bus Interface
PCIe 5.0 x16
PCIe 5.0 x16
Other
Production
Active
Predecessor
Radeon Instinct
Successor
H3C Graphics
View Instinct MI355X Details View Data Center GPU Max 1350 Details