AMD Instinct MI350X vs NVIDIA H200 NVL Comparison

Head-to-Head Benchmarks

The recorded data contains a single benchmark result for the NVIDIA H200 NVL, a Geekbench OpenCL score of 334,891. The AMD Instinct MI350X has no benchmark scores in the database, so a direct numerical comparison in this specific test is not possible. The available measurements, however, allow for meaningful analysis of the H200 NVL's standing against other accelerators.

The H200 NVL's OpenCL score places it in the 100th percentile among all GPUs in the database, indicating it outperforms nearly every other recorded accelerator. Its nearest rivals provide context for this result. The NVIDIA B200 scores 345,482, which is 3.1% higher than the H200 NVL. The NVIDIA B300 SXM6 AC scores 369,831, putting it 9.4% ahead. Conversely, the AMD Instinct MI300X scores 317,994, which is 5.3% behind the H200 NVL, and the NVIDIA L40S scores 295,763, trailing by 13.2%.

These figures show the H200 NVL sits in the upper tier of compute accelerators, behind only the newer B200 and B300 parts in the database. It holds a clear advantage over the previous-generation MI300X and the L40S. The MI350X, lacking any recorded benchmark scores, cannot be positioned within this ranking based on measured performance.

The Verdict

Based strictly on the data, the NVIDIA H200 NVL is a proven performer with a measured OpenCL score of 334,891 and a 100th percentile ranking. It outpaces the AMD Instinct MI300X by 5.3% and the NVIDIA L40S by 13.2% in the recorded benchmark. The AMD Instinct MI350X has no benchmark results in the database, so its actual performance cannot be verified or compared directly.

The H200 NVL is the choice for workloads where a validated benchmark score matters and where compatibility with the established Hopper architecture is a priority. Its 100th percentile ranking indicates it delivers top-tier compute performance among all recorded GPUs. The MI350X, on the other hand, is a newer design with a 2025 release date and a 3 nm process node, but its absence from the benchmark database means its performance characteristics are unverified. The data cannot confirm whether it would outperform the H200 NVL. The H200 NVL also benefits from a lower thermal design power of 600 W compared to the MI350X's 1000 W, which may be a practical consideration for system integration.

Architecture Differences

The two accelerators use fundamentally different architectures. The AMD Instinct MI350X is built on CDNA 4.0, while the NVIDIA H200 NVL uses the Hopper architecture. The MI350X is fabricated on a 3 nm process at TSMC, whereas the H200 NVL uses a 5 nm process, also at TSMC. The MI350X packs 185,000 million transistors on a die size of 2380 mm², giving a transistor density of 77.7 million transistors per mm². The H200 NVL contains 80,000 million transistors on an 814 mm² die, with a higher density of 98.3 million transistors per mm².

Memory configurations differ substantially. The MI350X features 288 GB of HBM3e memory on an 8192-bit bus, delivering 8.19 TB/s of bandwidth. The H200 NVL has 141 GB of HBM3e memory on a 6144-bit bus, providing 4.89 TB/s. The MI350X has more memory and significantly higher bandwidth, which could benefit workloads that are memory-capacity or memory-bandwidth bound.

Compute resources also differ. The MI350X has 16,384 shading units and 1,024 texture mapping units, with a texture rate of 2,252.8 GTexel/s. The H200 NVL has 16,896 shading units, 528 TMUs, and 24 ROPs, with a texture rate of 942.5 GTexel/s and a pixel rate of 42.84 GPixel/s. The MI350X reports a pixel rate of 0 MPixel/s and no ROPs, indicating it is not designed for rasterized graphics output. The H200 NVL has 528 tensor cores, while the MI350X does not list a tensor core count. Floating-point throughput differs as well: the MI350X delivers 72.09 TFLOPS for both FP32 and FP16 (1:1 ratio), while the H200 NVL delivers 60.32 TFLOPS FP32 and 120.6 TFLOPS FP16 (2:1 ratio). The MI350X has higher FP32 throughput, but the H200 NVL doubles its FP16 rate.

Clock speeds show the H200 NVL runs at a base clock of 1365 MHz and a boost clock of 1785 MHz, while the MI350X has a base of 1000 MHz and a boost of 2200 MHz. Memory clocks are 1593 MHz (6.4 Gbps effective) for the H200 NVL and 2000 MHz (8 Gbps effective) for the MI350X.

FAQ

Q: Which accelerator has a higher measured benchmark score?

A: Only the NVIDIA H200 NVL has a recorded benchmark score in the database. Its Geekbench OpenCL score is 334,891, placing it in the 100th percentile. The AMD Instinct MI350X has no recorded benchmark scores.

Q: How does the H200 NVL compare to its nearest rivals?

A: The H200 NVL is 3.1% behind the NVIDIA B200, 9.4% behind the NVIDIA B300 SXM6 AC, 5.3% ahead of the AMD Instinct MI300X, and 13.2% ahead of the NVIDIA L40S.

Q: Which accelerator has more memory?

A: The AMD Instinct MI350X has 288 GB of HBM3e memory, while the NVIDIA H200 NVL has 141 GB of HBM3e memory.

Q: What are the power requirements for each accelerator?

A: The AMD Instinct MI350X has a thermal design power of 1000 W and a suggested PSU of 1400 W. The NVIDIA H200 NVL has a TDP of 600 W and a suggested PSU of 1000 W.

Q: When was each accelerator released?

A: The AMD Instinct MI350X was released on June 11, 2025. The NVIDIA H200 NVL was released on November 17, 2024.

Q: What form factors do the two accelerators use?

A: The AMD Instinct MI350X uses an OAM module form factor with dimensions of 102 mm length and 165 mm width. The NVIDIA H200 NVL is a dual-slot card measuring 267 mm in length and 111 mm in height.

Where Each One Wins

The AMD Instinct MI350X wins on raw memory specifications. Its 288 GB of HBM3e memory and 8.19 TB/s bandwidth are substantially higher than the H200 NVL's 141 GB and 4.89 TB/s. For workloads that require loading very large models or datasets entirely into memory, the MI350X has a structural advantage in capacity and bandwidth. Its FP32 throughput of 72.09 TFLOPS also exceeds the H200 NVL's 60.32 TFLOPS, which may matter for applications relying on single-precision compute. The MI350X also has a higher boost clock at 2200 MHz versus 1785 MHz, and a larger transistor count at 185,000 million versus 80,000 million.

The NVIDIA H200 NVL wins on measured performance and efficiency metrics. Its Geekbench OpenCL score of 334,891 with a 100th percentile ranking provides verified compute capability, while the MI350X has no recorded score. The H200 NVL's FP16 throughput of 120.6 TFLOPS is nearly double the MI350X's 72.09 TFLOPS, making it the stronger choice for mixed-precision workloads. Its 600 W TDP is 400 W lower than the MI350X's 1000 W, which translates to lower power draw and a smaller suggested PSU. The H200 NVL is also a production-active part with a dual-slot form factor and an 8-pin EPS power connector, whereas the MI350X uses an OAM module with no power connectors listed.

Specification Differences

The two accelerators differ across nearly every recorded specification. The AMD Instinct MI350X uses a CDNA 4.0 architecture on a 3 nm process, while the NVIDIA H200 NVL uses Hopper on a 5 nm process. The MI350X has 185,000 million transistors on a 2380 mm² die with a density of 77.7 million per mm²; the H200 NVL has 80,000 million transistors on an 814 mm² die with 98.3 million per mm².

Memory capacity and bandwidth favor the MI350X: 288 GB at 8.19 TB/s versus 141 GB at 4.89 TB/s. The bus width is 8192 bits for the MI350X and 6144 bits for the H200 NVL. Both use HBM3e memory. Clock speeds differ: the MI350X runs at 1000 MHz base and 2200 MHz boost, while the H200 NVL runs at 1365 MHz base and 1785 MHz boost. Memory clocks are 2000 MHz (8 Gbps effective) for the MI350X and 1593 MHz (6.4 Gbps effective) for the H200 NVL.

Shading units are close: 16,384 for the MI350X and 16,896 for the H200 NVL. Texture mapping units are 1,024 versus 528. The MI350X has no ROPs and a 0 MPixel/s pixel rate, while the H200 NVL has 24 ROPs and a 42.84 GPixel/s pixel rate. Texture rates are 2,252.8 GTexel/s for the MI350X and 942.5 GTexel/s for the H200 NVL. The H200 NVL has 528 tensor cores; the MI350X does not list a tensor core count. FP32 throughput is 72.09 TFLOPS for the MI350X and 60.32 TFLOPS for the H200 NVL. FP16 throughput is 72.09 TFLOPS (1:1) for the MI350X and 120.6 TFLOPS (2:1) for the H200 NVL.

Power specifications show the MI350X at 1000 W TDP with a 1400 W suggested PSU, while the H200 NVL is at 600 W TDP with a 1000 W suggested PSU. The MI350X is an OAM module with no power connectors, measuring 102 mm by 165 mm. The H200 NVL is a dual-slot card with an 8-pin EPS connector, measuring 267 mm by 111 mm. Both use a PCIe 5.0 x16 bus interface and have no display outputs. The H200 NVL is marked as active in production status, while the MI350X has no production status recorded. Release dates are June 11, 2025 for the MI350X and November 17, 2024 for the H200 NVL.