Intel Arc Graphics 4 Xe Mobile vs NVIDIA Rubin GPU Comparison

Head-to-Head Benchmarks

The database records no direct head-to-head benchmark entries for the Intel Arc Graphics 4 Xe Mobile and the NVIDIA Rubin GPU. Both products hold a 50th percentile rank among all GPUs in the database, and neither has an average benchmark score recorded. The absence of measured performance data means that a direct numerical comparison of their compute capabilities is not possible from the recorded information.

The Intel Arc Graphics 4 Xe Mobile achieves a peak FP32 throughput of 2.355 TFLOPS, while the NVIDIA Rubin GPU delivers 130.0 TFLOPS. In FP16 compute, the Intel part reaches 4.710 TFLOPS (2:1 ratio), whereas the NVIDIA part reaches 260.0 TFLOPS (2:1 ratio). These figures indicate the NVIDIA Rubin GPU operates in a substantially higher performance tier, but the lack of benchmark scores prevents any statement about real-world application performance.

Pixel and texture throughput differ significantly. The Intel Arc Graphics 4 Xe Mobile sustains 36.80 GPixel/s and 73.60 GTexel/s. The NVIDIA Rubin GPU sustains 54.41 GPixel/s and 2,031.2 GTexel/s. The texture rate difference is particularly large, reflecting the NVIDIA part's 896 TMUs versus the Intel part's 32 TMUs.

The NVIDIA Rubin GPU also holds a 288 GB memory capacity with HBM4 type memory and a 16384 bit bus width, yielding a bandwidth of 22.1 TB/s. The Intel Arc Graphics 4 Xe Mobile uses System Shared memory, with bandwidth listed as System Dependent. No memory size, bus width, or bandwidth figures are recorded for the Intel part.

Given that both parts have zero recorded benchmark scores and no head-to-head entries, the database cannot substantiate any performance ranking beyond the raw specification sheet. The win count in the database is zero for each product.

Architecture Differences

The Intel Arc Graphics 4 Xe Mobile is built on the Xe3-LPG architecture, part of the Arc Graphics-M (Panther Lake) generation. Its chip is codenamed Panther Lake, fabricated on a 3 nm process at Intel. The NVIDIA Rubin GPU uses the Rubin architecture, with the GR100 chip, fabricated on a 3 nm process at TSMC. Both use a 3 nm process node, but the foundry differs.

Transistor counts diverge sharply. The Intel part has an unknown transistor count and die size. The NVIDIA part contains 336,000 million transistors on a 1456 mm² die, with a transistor density of 230.8M / mm². The NVIDIA part also lists a predecessor, Server Blackwell, while the Intel part has no predecessor or successor recorded.

The Intel Arc Graphics 4 Xe Mobile integrates 512 shading units, 32 TMUs, 16 ROPs, and 4 ray tracing cores. It has no recorded tensor cores. The NVIDIA Rubin GPU integrates 28,672 shading units, 896 TMUs, 24 ROPs, and 896 tensor cores. Its ray tracing core count is not recorded in the database.

The Intel part supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The NVIDIA part lists N/A for DirectX, OpenGL, and Vulkan, reflecting its server-oriented design with no display outputs. The Intel part has display outputs listed as Portable Device Dependent, while the NVIDIA part has no outputs.

The Intel Arc Graphics 4 Xe Mobile is an IGP with a slot width of IGP and no power connectors. The NVIDIA Rubin GPU is an SXM Module with a suggested PSU of 2700 W and uses a PCIe 6.0 x16 bus interface. The Intel part uses an IGP bus interface.

FAQ

Q: What is the process node for each GPU?

A: Both the Intel Arc Graphics 4 Xe Mobile and the NVIDIA Rubin GPU are fabricated on a 3 nm process. The Intel part is made at Intel, while the NVIDIA part is made at TSMC.

Q: How much memory does the NVIDIA Rubin GPU have?

A: The NVIDIA Rubin GPU has 288 GB of HBM4 memory on a 16384 bit bus, with a bandwidth of 22.1 TB/s. The Intel Arc Graphics 4 Xe Mobile uses System Shared memory with system-dependent bandwidth.

Q: What is the FP32 compute performance of each part?

A: The Intel Arc Graphics 4 Xe Mobile delivers 2.355 TFLOPS FP32, while the NVIDIA Rubin GPU delivers 130.0 TFLOPS FP32. The NVIDIA part is substantially higher in raw compute throughput.

Q: Does the Intel Arc Graphics 4 Xe Mobile support ray tracing?

A: Yes, the Intel part has 4 ray tracing cores. The NVIDIA Rubin GPU has no recorded ray tracing core count in the database.

Q: What is the power requirement for the NVIDIA Rubin GPU?

A: The NVIDIA Rubin GPU has a TDP of 2300 W and a suggested PSU of 2700 W. It is an SXM Module with no power connectors listed. The Intel part has a TDP of 25 W and no power connectors.

Q: What APIs does each GPU support?

A: The Intel Arc Graphics 4 Xe Mobile supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The NVIDIA Rubin GPU lists N/A for DirectX, OpenGL, and Vulkan, and has no display outputs.

Specification Differences

The two GPUs differ across nearly every recorded specification. The Intel Arc Graphics 4 Xe Mobile has a base clock of 300 MHz and a boost clock of 2300 MHz. The NVIDIA Rubin GPU has a base clock of 700 MHz and a boost clock of 2267 MHz. Memory clock differs: the Intel part uses System Shared memory, while the NVIDIA part runs at 2695 MHz (10.8 Gbps effective).

Shading units: 512 (Intel) versus 28,672 (NVIDIA). TMUs: 32 (Intel) versus 896 (NVIDIA). ROPs: 16 (Intel) versus 24 (NVIDIA). Ray tracing cores: 4 (Intel) versus not recorded (NVIDIA). Tensor cores: not recorded (Intel) versus 896 (NVIDIA).

Pixel rate: 36.80 GPixel/s (Intel) versus 54.41 GPixel/s (NVIDIA). Texture rate: 73.60 GTexel/s (Intel) versus 2,031.2 GTexel/s (NVIDIA). FP32: 2.355 TFLOPS (Intel) versus 130.0 TFLOPS (NVIDIA). FP16: 4.710 TFLOPS (Intel) versus 260.0 TFLOPS (NVIDIA).

TDP: 25 W (Intel) versus 2300 W (NVIDIA). Slot width: IGP (Intel) versus SXM Module (NVIDIA). Bus interface: IGP (Intel) versus PCIe 6.0 x16 (NVIDIA). Display outputs: Portable Device Dependent (Intel) versus No outputs (NVIDIA).

Process node is identical (3 nm), but the foundry differs: Intel for the Arc part, TSMC for the Rubin part. Transistors, die size, and transistor density are unknown for the Intel part; the NVIDIA part records 336,000 million transistors, 1456 mm², and 230.8M / mm².

API support: the Intel part lists DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The NVIDIA part lists N/A for all three. Release dates differ: the Intel part is dated 2026-01-26, while the NVIDIA part is dated 2025-12-31.

Where Each One Wins

The Intel Arc Graphics 4 Xe Mobile is positioned as an integrated graphics solution for mobile devices. Its 25 W TDP, IGP slot width, and portable-device-dependent display outputs indicate a design focused on low power and system integration. The 4 ray tracing cores and support for DirectX 12 Ultimate, OpenGL 4.6, and Vulkan 1.4 make it suitable for graphics API workloads on portable hardware. The System Shared memory configuration means it relies on the host system's memory, which is appropriate for an IGP.

The NVIDIA Rubin GPU is a server-class accelerator. Its 288 GB HBM4 memory, 22.1 TB/s bandwidth, and 896 tensor cores point toward high-bandwidth compute workloads, including large-scale data processing and AI inference. The absence of display outputs and N/A API support confirm it is not intended for client graphics rendering. The PCIe 6.0 x16 interface and SXM Module form factor target dense server deployment. Its 2300 W TDP and 2700 W suggested PSU reflect a power-hungry, high-throughput design.

In terms of raw throughput, the NVIDIA part leads in every recorded compute metric: FP32 (130.0 TFLOPS versus 2.355 TFLOPS), FP16 (260.0 TFLOPS versus 4.710 TFLOPS), texture rate (2,031.2 GTexel/s versus 73.60 GTexel/s), and pixel rate (54.41 GPixel/s versus 36.80 GPixel/s). The Intel part leads in portability, power efficiency by an order of magnitude (25 W versus 2300 W), and graphics API compatibility.

The database records no benchmark scores for either product, so no measured performance wins can be attributed. The specification sheet alone indicates that the NVIDIA Rubin GPU is built for maximum compute density, while the Intel Arc Graphics 4 Xe Mobile is built for integration into mobile systems with modest power envelopes. Each part wins in its intended deployment class: the Intel part for portable devices, the NVIDIA part for server-scale compute.