Intel Arc Graphics 4 Xe Mobile vs Intel Data Center GPU Max 1550 Comparison

Intel
GPU

Intel Arc Graphics 4 Xe Mobile

CORE STATE Panther Lake
VRAM System Shared
CLOCK SPEED 2300 MHz
TDP 25 W
BUS WIDTH System Shared
ARCHITECTURE Xe3-LPG
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Intel
GPU

Data Center GPU Max 1550

CORE STATE Ponte Vecchio
VRAM 128 GB
CLOCK SPEED 1600 MHz
TDP 600 W
BUS WIDTH 8192 bit
ARCHITECTURE Generation 12.5
nm
PROCESS 10 nm
LAUNCH DATE 2023

Analysis: Intel Arc Graphics 4 Xe Mobile vs Intel Data Center GPU Max 1550

Head-to-Head Benchmarks

The recorded database contains no direct head-to-head benchmark entries for the Intel Arc Graphics 4 Xe Mobile and the Intel Data Center GPU Max 1550. Both parts hold a percentile ranking of 50 against all GPUs, and both carry an average benchmark score of zero in the database. The absence of measured results means the comparison relies entirely on architectural and specification data rather than empirical test scores.

The most striking contrast appears in raw compute capacity. The Data Center GPU Max 1550 delivers 52.43 TFLOPS of FP32 throughput, while the Arc Graphics 4 Xe Mobile manages 2.355 TFLOPS. The data center part is roughly 22 times higher in FP32 output, a gap that reflects its 16384 shading units against a mere 512 on the mobile part. Texture rate tells a similar story: 1,638.4 GTexel/s versus 73.60 GTexel/s, a factor of about 22. The pixel rate comparison is inverted in an unusual way, because the data center GPU reports 0 MPixel/s while the mobile part reports 36.80 GPixel/s. The Max 1550 has zero ROPs, so it cannot produce a conventional pixel fill rate; the Arc part has 16 ROPs and a measurable pixel throughput.

Memory bandwidth separates the two even more dramatically. The Max 1550 accesses 128 GB of HBM2e across an 8192-bit bus, yielding 3.28 TB/s of bandwidth. The Arc Graphics 4 Xe Mobile uses system shared memory, with bandwidth described as system dependent. The mobile GPU has no dedicated VRAM footprint, no fixed bus width, and no standalone memory clock; the data center part operates its memory at 1600 MHz with 3.2 Gbps effective speed.

Clock behavior also diverges. The mobile chip runs a base of 300 MHz and boosts to 2300 MHz, a 2000 MHz range. The data center chip starts higher at 900 MHz base but boosts to only 1600 MHz, a modest 700 MHz range. Despite the lower clocks, the data center GPU relies on its massive core count to dominate throughput. The mobile part compensates for fewer cores with a higher peak clock, but the 2300 MHz boost cannot bridge a 22-fold shading unit deficit.

FP16 performance reveals a philosophical split. The Arc Graphics 4 Xe Mobile reaches 4.710 TFLOPS at a 2:1 ratio, meaning it halves FP32 rate to double FP16 throughput. The Data Center GPU Max 1550 achieves 52.43 TFLOPS at a 1:1 ratio, so its FP16 and FP32 rates are identical. The data center part does not rely on ratio-based acceleration; it simply has enough raw hardware to sustain the same throughput in both precisions.

The Verdict

The data positions these two products in entirely different segments. The Arc Graphics 4 Xe Mobile is an integrated graphics processor built into a Panther Lake chip, consuming 25 W and occupying an IGP slot. The Data Center GPU Max 1550 is a 600 W OAM module with a suggested PSU of 1000 W, a PCIe 5.0 x16 interface, and no display outputs. No benchmark scores bridge the two, so any purchase decision must rest on the specification deltas.

The mobile part wins on power efficiency, clock headroom, and display capability. It operates at 25 W, boosts to 2300 MHz, and supports portable device dependent outputs. The data center part cannot output video at all; its display output field reads "No outputs." The Arc part also reaches DirectX 12 Ultimate (12_2) and Vulkan 1.4, while the Max 1550 tops out at DirectX 12 (12_1) with no Vulkan entry. For graphics API completeness, the integrated part is ahead.

The data center part wins on every metric of raw computational scale. It has 32 times more shading units, 32 times more texture mapping units, 32 times more ray tracing cores, 128 GB of dedicated HBM2e, and a 3.28 TB/s memory bus. Its 100,000 million transistors on a 1280 mm² die dwarf the mobile part's unspecified transistor count and die size. The Max 1550 also uses a 10 nm process, while the Arc part uses a 3 nm process; the newer node helps the small chip reach high clocks at low power, but it does not change the core count disparity.

The verdict from the database is unambiguous: the Max 1550 exists for compute-heavy data center workloads, and the Arc Graphics 4 Xe Mobile exists for integrated graphics in mobile systems. Neither replaces the other.

Where Each One Wins

The Arc Graphics 4 Xe Mobile wins in scenarios that require a display output, a low power envelope, or a modern graphics API feature set. Its 25 W TDP suits thin-and-light portable devices. Its 2300 MHz boost clock and 4.710 TFLOPS FP16 throughput provide enough compute for lightweight graphics and media tasks. The 36.80 GPixel/s pixel rate confirms it can drive a display pipeline, and the DirectX 12 Ultimate (12_2) plus Vulkan 1.4 support aligns with current consumer graphics standards. The 3 nm process node suggests a design focused on efficiency within a small die. The base clock of 300 MHz indicates aggressive power gating; the chip can idle extremely low and ramp to 2300 MHz when needed.

The Data Center GPU Max 1550 wins in scenarios that demand massive parallel throughput, large memory capacity, or high bandwidth. Its 52.43 TFLOPS FP32 and FP16 rates suit dense compute kernels. The 128 GB HBM2e pool with 3.28 TB/s bandwidth handles large datasets without host memory sharing. The 16384 shading units and 1024 TMUs feed that bandwidth effectively, and the 128 ray tracing cores provide hardware acceleration for ray-traced workloads. The 1000 W suggested PSU requirement and 600 W TDP indicate a server-class installation with dedicated power delivery. The PCIe 5.0 x16 bus interface provides a high-speed host link, and the 1600 MHz base clock with 1600 MHz boost shows the part runs at a sustained, high-frequency operating point under load.

The measured data also shows asymmetric production status. Both parts are listed as Active, but the Max 1550 has a successor named H3C Graphics, while the mobile part has no successor. The Max 1550 also has a release date of 2023-01-09, while the mobile part is dated 2026-01-26, suggesting the mobile GPU is a newer design.

FAQ

Q: Which GPU has more shading units?

A: The Data Center GPU Max 1550 has 16384 shading units, while the Arc Graphics 4 Xe Mobile has 512, a 32-fold difference.

Q: What is the memory configuration of each GPU?

A: The Data Center GPU Max 1550 has 128 GB of HBM2e on an 8192-bit bus with 3.28 TB/s bandwidth. The Arc Graphics 4 Xe Mobile uses system shared memory with system dependent bandwidth and a system shared bus width.

Q: Does either GPU support display outputs?

A: The Arc Graphics 4 Xe Mobile supports portable device dependent outputs. The Data Center GPU Max 1550 has no outputs.

Q: What is the maximum FP32 throughput for each part?

A: The Data Center GPU Max 1550 delivers 52.43 TFLOPS, and the Arc Graphics 4 Xe Mobile delivers 2.355 TFLOPS.

Q: How do their power requirements differ?

A: The Arc Graphics 4 Xe Mobile has a 25 W TDP and no power connectors. The Data Center GPU Max 1550 has a 600 W TDP and a suggested PSU of 1000 W.

Q: Which GPU has the higher boost clock?

A: The Arc Graphics 4 Xe Mobile boosts to 2300 MHz, while the Data Center GPU Max 1550 boosts to 1600 MHz.

Architecture Differences

The two GPUs come from different architectural families. The Arc Graphics 4 Xe Mobile uses the Xe3-LPG architecture on the Panther Lake chip, part of the Arc Graphics-M generation. The Data Center GPU Max 1550 uses Generation 12.5 on the Ponte Vecchio chip, part of the Data Center GPU generation. The mobile part is built on a 3 nm process at Intel's foundry. The data center part uses a 10 nm process, also at Intel's foundry, but packs 100,000 million transistors onto a 1280 mm² die with a transistor density of 78.1M per mm². The mobile part has unknown transistor count, die size, and density.

Ray tracing hardware differs in scale. The mobile part has 4 RT cores; the data center part has 128 RT cores. Neither lists tensor cores in the database. The mobile part has 32 TMUs and 16 ROPs; the data center part has 1024 TMUs and 0 ROPs. The zero ROP count on the Max 1550 explains its 0 MPixel/s pixel rate and confirms it is not designed for rasterized display output.

The data center GPU uses a 1600 MHz memory clock with 3.2 Gbps effective speed, while the mobile GPU ties its memory clock to the system. The Max 1550 connects via PCIe 5.0 x16; the mobile part connects via an IGP interface. The mobile GPU has no power connectors, and the data center module uses an OAM form factor with no listed power connector details.

Specification Differences

The two parts differ on nearly every recorded specification. The mobile chip runs at 300 MHz base and 2300 MHz boost; the data center chip runs at 900 MHz base and 1600 MHz boost. The mobile part has 512 shading units, 32 TMUs, 16 ROPs, and 4 RT cores; the data center part has 16384 shading units, 1024 TMUs, 0 ROPs, and 128 RT cores. Pixel rate is 36.80 GPixel/s for the mobile part and 0 MPixel/s for the data center part. Texture rate is 73.60 GTexel/s versus 1,638.4 GTexel/s. FP32 throughput is 2.355 TFLOPS versus 52.43 TFLOPS. FP16 throughput is 4.710 TFLOPS at a 2:1 ratio versus 52.43 TFLOPS at a 1:1 ratio.

Memory size is system shared versus 128 GB. Memory type is system shared versus HBM2e. Bus width is system shared versus 8192 bit. Bandwidth is system dependent versus 3.28 TB/s. TDP is 25 W versus 600 W. Slot width is IGP versus OAM Module. Bus interface is IGP versus PCIe 5.0 x16. Display outputs are portable device dependent versus none. DirectX support is 12 Ultimate (12_2) versus 12 (12_1). OpenGL support is 4.6 on both, but Vulkan support is 1.4 on the mobile part and absent on the data center part. The suggested PSU is listed only for the data center part at 1000 W. Release dates are 2026-01-26 for the mobile part and 2023-01-09 for the data center part. The data center part has a successor, H3C Graphics, while the mobile part has none.

DETAILED SPECIFICATIONS

SPECIFICATION
Graphics 4 Xe Mobile
Data Center GPU Max 1550
Core Specs
Shading Units
512
16,384 +3100.0%
Shaders
512
16,384 +3100.0%
TMUs
32
1,024 +3100.0%
ROPs
16
0 -100.0%
Execution Units
8
1,024 +12700.0%
Clocks
Base Clock
300 MHz
900 MHz
Boost Clock
2300 MHz
1600 MHz
Memory Clock
System Shared
1600 MHz 3.2 Gbps effective
Memory
Memory Size
System Shared
128 GB
VRAM (MB)
131,072
Memory Type
System Shared
HBM2e
Memory Bus
System Shared
8192 bit
Bandwidth
System Dependent
3.28 TB/s
Cache
L1 Cache
64 KB (per EU)
64 KB (per EU)
L2 Cache
16 MB
408 MB
Performance
Pixel Rate
36.80 GPixel/s
0 MPixel/s
Texture Rate
73.60 GTexel/s
1,638.4 GTexel/s
FP32 (TFLOPS)
2.355 TFLOPS
52.43 TFLOPS
FP64 (TFLOPS)
294.4 GFLOPS (1:8)
52.43 TFLOPS (1:1)
FP16 (TFLOPS)
4.710 TFLOPS (2:1)
52.43 TFLOPS (1:1)
AI/RT
RT Cores
4
128 +3100.0%
XMX Cores
32
1,024 +3100.0%
Power
TDP
25 W
600 W
TDP (W)
25
600 +2300.0%
Suggested PSU
1000 W
Power Connectors
None
Architecture
Architecture
Xe3-LPG
Generation 12.5
GPU Name
Panther Lake
Ponte Vecchio
Generation
Arc Graphics-M (Panther Lake)
Data Center GPU (Ponte Vecchio)
Process Size
3 nm
10 nm
Transistors
unknown
100,000 million
Die Size
unknown
1280 mm²
Foundry
Intel
Intel
Density
78.1M / mm²
API Support
DirectX
12 Ultimate (12_2)
12 (12_1)
OpenGL
4.6
4.6
Vulkan
1.4
OpenCL
3.0
3.0
Shader Model
6.9
6.6
Physical
Slot Width
IGP
OAM Module
Outputs
Portable Device Dependent
No outputs
Bus Interface
IGP
PCIe 5.0 x16
Other
Production
Active
Active
Successor
H3C Graphics
View Arc Graphics 4 Xe Mobile Details View Data Center GPU Max 1550 Details