Intel Arc Graphics 4 Xe Mobile vs Intel Data Center GPU Max 1100 Comparison

Head-to-Head Benchmarks

The recorded database contains no direct benchmark scores for either the Intel Arc Graphics 4 Xe Mobile or the Intel Data Center GPU Max 1100. Both entries carry an average benchmark score of zero, and the head-to-head benchmark array is empty. Consequently, there are no measured wins, no comparative performance deltas, and no percentile rankings relative to specific rivals to report. The absence of data is itself informative: neither part has been characterized through the database’s standard workload suite at the time of this analysis.

What the database does provide are the raw computational throughput figures, which serve as the only quantitative basis for comparison. The Arc Graphics 4 Xe Mobile delivers 2.355 TFLOPS FP32 and 4.710 TFLOPS FP16 (2:1 ratio). The Data Center GPU Max 1100 delivers 22.22 TFLOPS FP32 and 22.22 TFLOPS FP16 (1:1 ratio). These figures indicate a substantial gap in raw arithmetic capability: the Data Center part is approximately 9.4 times higher in FP32 throughput and approximately 4.7 times higher in FP16 throughput. However, the FP16 comparison is complicated by the different ratio conventions; the Arc’s FP16 figure assumes a 2:1 rate, while the Data Center part’s FP16 runs at the same rate as FP32.

Pixel and texture throughput further separate the two. The Arc Graphics 4 Xe Mobile posts 36.80 GPixel/s and 73.60 GTexel/s. The Data Center GPU Max 1100 posts 0 MPixel/s pixel rate, a zero value that reflects its lack of traditional display-oriented raster output units, and 694.4 GTexel/s, which is roughly 9.4 times the Arc’s texture rate. The Data Center part’s pixel rate of zero indicates it is not designed for conventional rasterized graphics output, a structural difference rather than a performance deficit.

Clock speeds also differ sharply. The Arc part runs at a 300 MHz base and 2300 MHz boost. The Data Center part runs at a 1000 MHz base and 1550 MHz boost. The Arc’s higher boost clock suggests it is tuned for bursty, latency-sensitive workloads typical of integrated graphics, whereas the Data Center part’s lower boost but far higher shader count and memory bandwidth indicate a design aimed at sustained throughput.

Memory is another domain of stark contrast. The Arc Graphics 4 Xe Mobile uses system-shared memory, with a system-dependent bandwidth and no dedicated capacity. The Data Center GPU Max 1100 features 48 GB of HBM2e memory on an 8192-bit bus, delivering 1.23 TB/s of bandwidth. The memory clock is listed as 600 MHz with 1200 Mbps effective. No bandwidth figure exists for the Arc part because it depends entirely on the host platform’s memory subsystem.

Architecture Differences

The two GPUs belong to entirely different architectural lineages within Intel’s product stack. The Arc Graphics 4 Xe Mobile is built on the Xe3-LPG architecture, part of the Panther Lake chip, and falls under the Arc Graphics-M (Panther Lake) generation. The Data Center GPU Max 1100 uses the Generation 12.5 architecture, implemented on the Ponte Vecchio chip, and belongs to the Data Center GPU (Ponte Vecchio) generation.

Manufacturing processes differ substantially. The Arc part is fabricated on Intel’s 3 nm process. The Data Center part uses Intel’s 10 nm process. The transistor count and die size are listed as unknown for the Arc part, whereas the Data Center part contains 100,000 million transistors on a 1280 mm² die, yielding a transistor density of 78.1 million transistors per square millimeter. The Arc part’s unknown transistor data precludes any density comparison.

Compute resource counts reveal the scale difference. The Arc Graphics 4 Xe Mobile has 512 shading units, 32 texture mapping units, 16 raster output units, and 4 ray tracing cores. The Data Center GPU Max 1100 has 7168 shading units, 448 texture mapping units, 0 raster output units, and 56 ray tracing cores. The Data Center part therefore has 14 times the shader count, 14 times the TMU count, and 14 times the RT core count. The Arc part’s 16 ROPs are absent entirely from the Data Center part, which reports a zero ROP count, consistent with its zero pixel rate.

Memory architecture is fundamentally different. The Arc part uses system-shared memory, meaning it has no dedicated VRAM and relies on the host system’s main memory. The Data Center part has 48 GB of dedicated HBM2e memory with an 8192-bit bus width. This is not a minor specification difference; it defines their respective roles. An integrated GPU sharing system memory cannot sustain the same memory bandwidth as a discrete accelerator with its own high-bandwidth stack.

Feature support diverges in APIs. The Arc Graphics 4 Xe Mobile supports DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The Data Center GPU Max 1100 supports DirectX 12 (12_1) and OpenGL 4.6, with no Vulkan support listed. The Arc part’s newer DirectX feature level and Vulkan support indicate a graphics-oriented design, while the Data Center part’s narrower API set reflects its compute-centric purpose.

Power delivery and physical design are also distinct. The Arc part has a TDP of 25 W, uses an integrated graphics package (IGP) slot width, has no power connectors, and is designed for portable devices with display outputs dependent on the host device. The Data Center part has a TDP of 300 W, uses a dual-slot form factor, requires a single 12-pin power connector, lists a suggested power supply of 700 W, and has no display outputs. The bus interface differs as well: the Arc part uses IGP, while the Data Center part uses PCIe 5.0 x16. The Data Center part has a physical length of 267 mm (10.5 inches); the Arc part, being integrated, has no listed dimensions.

Release timing also separates them. The Arc Graphics 4 Xe Mobile is dated 2026-01-26, while the Data Center GPU Max 1100 is dated 2023-01-09. The Data Center part has a listed successor, the H3C Graphics, whereas the Arc part has no predecessor or successor listed.

Where Each One Wins

Given the absence of direct benchmark results, the win condition must be inferred from architectural and specification data. The Arc Graphics 4 Xe Mobile is the clear choice for scenarios requiring an integrated, low-power graphics solution with display output. Its 25 W TDP, lack of external power connectors, and portable-device-dependent display outputs position it for thin-and-light systems where space and power are constrained. Its support for DirectX 12 Ultimate (12_2) and Vulkan 1.4 means it can handle modern graphics APIs and ray-traced workloads, albeit at a modest 2.355 TFLOPS FP32. The 4 ray tracing cores and 16 ROPs enable conventional rasterization and basic ray tracing, which the Data Center part cannot perform due to its zero ROP count and zero pixel rate.

The Data Center GPU Max 1100 wins decisively in compute throughput. Its 22.22 TFLOPS FP32 is nearly an order of magnitude higher than the Arc part. Its 48 GB HBM2e memory with 1.23 TB/s bandwidth dwarfs the system-shared memory of the Arc part. The 56 ray tracing cores and 694.4 GTexel/s texture rate indicate substantial geometry and texture processing capability, though the zero pixel rate means it cannot output frames to a display. The 300 W TDP and PCIe 5.0 x16 interface suit server racks and accelerator slots, not laptops. Its 1:1 FP16 ratio means sustained FP16 throughput equals its FP32 rate, which benefits machine learning and scientific workloads that rely on half-precision arithmetic. The Arc part’s FP16 figure of 4.710 TFLOPS assumes a 2:1 ratio, effectively doubling its FP32 rate, but the Data Center part achieves that same 22.22 TFLOPS in both precisions.

The 8192-bit memory bus is the widest in the database, and the 1.23 TB/s bandwidth is a decisive advantage for memory-bound compute kernels. The Arc part’s system-dependent bandwidth cannot match this and is not even quantified in the database.

The Arc part wins in portability and integration. The Data Center part wins in raw compute, memory capacity, and bandwidth. There is no overlap in their intended usage domains.

The Verdict

The database clearly separates these two products into different categories. The Intel Arc Graphics 4 Xe Mobile is an integrated GPU for a future Panther Lake mobile platform. The Intel Data Center GPU Max 1100 is a discrete accelerator for servers and data centers, released in early 2023. Any selection between them must be based on the workload, not on benchmark scores, because no direct comparative benchmarks exist in the database.

For a client device requiring graphics output, the Arc Graphics 4 Xe Mobile is the only viable option. Its 16 ROPs, 36.80 GPixel/s pixel rate, and display outputs make it capable of driving a portable device’s screen. Its 25 W TDP fits within mobile thermal envelopes. Its DirectX 12 Ultimate and Vulkan 1.4 support ensures compatibility with current graphics APIs.

For a compute node without display requirements, the Data Center GPU Max 1100 is the only viable option. Its 48 GB HBM2e memory, 1.23 TB/s bandwidth, and 22.22 TFLOPS FP32/FP16 throughput provide server-class compute. Its lack of display outputs is irrelevant in a headless accelerator context. Its 300 W TDP and 700 W suggested PSU are appropriate for data center infrastructure.

The data does not support a verdict that one is “better” than the other. They are different tools. The Arc part’s highest FP32 throughput is 2.355 TFLOPS, less than one-tenth of the Data Center part’s 22.22 TFLOPS. But the Data Center part cannot render a frame to a screen, as evidenced by its 0 MPixel/s pixel rate and 0 ROPs. The Arc part can. The choice is dictated by the use case, and the database provides no benchmark evidence to override that structural logic.

The Arc part’s release date of 2026-01-26 is still in the future relative to the Data Center part’s 2023-01-09 release, which means the Arc part represents a newer process node (3 nm vs 10 nm) and a newer architecture generation. However, newer does not mean faster in absolute terms; the Data Center part’s massive shader count and memory subsystem remain far ahead in raw compute.

FAQ

Q: Which GPU has higher FP32 throughput?

A: The Intel Data Center GPU Max 1100 delivers 22.22 TFLOPS FP32, compared to the Intel Arc Graphics 4 Xe Mobile’s 2.355 TFLOPS FP32, a difference of approximately 9.4 times.

Q: Can the Data Center GPU Max 1100 output video to a display?

A: No. The database lists its pixel rate as 0 MPixel/s, its ROP count as 0, and its display outputs as “No outputs.”

Q: What memory does each GPU use?

A: The Arc Graphics 4 Xe Mobile uses system-shared memory with system-dependent bandwidth. The Data Center GPU Max 1100 has 48 GB of HBM2e memory on an 8192-bit bus with 1.23 TB/s bandwidth.

Q: Which GPU supports Vulkan?

A: Only the Arc Graphics 4 Xe Mobile lists Vulkan support (version 1.4). The Data Center GPU Max 1100 has no Vulkan support listed in the database.

Q: What are the TDP figures for each GPU?

A: The Arc Graphics 4 Xe Mobile has a TDP of 25 W. The Data Center GPU Max 1100 has a TDP of 300 W.

Q: Which GPU has ray tracing cores?

A: Both have ray tracing cores. The Arc Graphics 4 Xe Mobile has 4, and the Data Center GPU Max 1100 has 56.

Specification Differences

| Specification | Intel Arc Graphics 4 Xe Mobile | Intel Data Center GPU Max 1100 |

|---|---|---|

| Architecture | Xe3-LPG | Generation 12.5 |

| Chip | Panther Lake | Ponte Vecchio |

| Generation | Arc Graphics-M (Panther Lake) | Data Center GPU (Ponte Vecchio) |

| Process node | 3 nm | 10 nm |

| Transistors | unknown | 100,000 million |

| Die size | unknown | 1280 mm² |

| Transistor density | not listed | 78.1M / mm² |

| Base clock | 300 MHz | 1000 MHz |

| Boost clock | 2300 MHz | 1550 MHz |

| Memory clock | System Shared | 600 MHz, 1200 Mbps effective |

| Memory size | System Shared | 48 GB |

| Memory type | System Shared | HBM2e |

| Memory bus width | System Shared | 8192 bit |

| Memory bandwidth | System Dependent | 1.23 TB/s |

| Shading units | 512 | 7168 |

| TMUs | 32 | 448 |

| ROPs | 16 | 0 |

| RT cores | 4 | 56 |

| Pixel rate | 36.80 GPixel/s | 0 MPixel/s |

| Texture rate | 73.60 GTexel/s | 694.4 GTexel/s |

| FP32 | 2.355 TFLOPS | 22.22 TFLOPS |

| FP16 | 4.710 TFLOPS (2:1) | 22.22 TFLOPS (1:1) |

| TDP | 25 W | 300 W |

| Slot width | IGP | Dual-slot |

| Power connectors | None | 1x 12-pin |

| Suggested PSU | not listed | 700 W |

| Bus interface | IGP | PCIe 5.0 x16 |

| Display outputs | Portable Device Dependent | No outputs |

| DirectX | 12 Ultimate (12_2) | 12 (12_1) |

| OpenGL | 4.6 | 4.6 |

| Vulkan | 1.4 | not listed |

| Length | not listed | 267 mm (10.5 inches) |

| Release date | 2026-01-26 | 2023-01-09 |

| Successor | not listed | H3C Graphics |

| Production status | Active | Active |