GPU Comparison
GPU
Intel Arc A570M
CORE STATE
DG2-256
VRAM
8 GB
CLOCK SPEED
1300 MHz
TDP
75 W
BUS WIDTH
128 bit
ARCHITECTURE
Xe-HPG
PROCESS
6 nm
LAUNCH DATE
2023
VS
GEFORCE
B300
CORE STATE
GB110
VRAM
144 GB
CLOCK SPEED
2032 MHz
TDP
1400 W
BUS WIDTH
4096 bit
ARCHITECTURE
Blackwell Ultra
PROCESS
5 nm
LAUNCH DATE
2025
PERFORMANCE BENCHMARKS
geekbench_opencl
DETAILED SPECIFICATIONS
SPECIFICATION
A570M
B300
Core Specs
Shading Units
2,048
18,944
+825.0%
Shaders
2,048
18,944
+825.0%
TMUs
128
592
+362.5%
ROPs
64
24
-62.5%
SM Count
—
148
Execution Units
256
—
Clocks
Base Clock
900 MHz
1665 MHz
Boost Clock
1300 MHz
2032 MHz
Memory Clock
1750 MHz
14 Gbps effective
2000 MHz
8 Gbps effective
Memory
Memory Size
8 GB
144 GB
VRAM (MB)
8,192
147,456
+1700.0%
Memory Type
GDDR6
HBM3e
Memory Bus
128 bit
4096 bit
Bandwidth
224.0 GB/s
4.10 TB/s
Cache
L1 Cache
—
256 KB (per SM)
L2 Cache
8 MB
50 MB
Performance
Pixel Rate
83.20 GPixel/s
48.77 GPixel/s
Texture Rate
166.4 GTexel/s
1,202.9 GTexel/s
FP32 (TFLOPS)
5.325 TFLOPS
76.99 TFLOPS
FP64 (TFLOPS)
—
1,202.9 GFLOPS (1:64)
FP16 (TFLOPS)
10.65 TFLOPS (2:1)
1,231.8 TFLOPS (16:1)
AI/RT
RT Cores
16
—
Tensor Cores
—
592
XMX Cores
256
—
Power
TDP
75 W
1400 W
TDP (W)
75
1,400
+1766.7%
Suggested PSU
—
1800 W
Architecture
Architecture
Xe-HPG
Blackwell Ultra
GPU Name
DG2-256
GB110
Generation
Alchemist
(Arc 5 Mobile)
Server Blackwell
(Bxx)
Process Size
6 nm
5 nm
Transistors
11,500 million
104,000 million
Die Size
269 mm²
—
Foundry
TSMC
TSMC
Density
42.8M / mm²
—
API Support
DirectX
12 Ultimate (12_2)
—
OpenGL
4.6
—
Vulkan
1.4
—
OpenCL
3.0
3.0
CUDA
—
10.3
Shader Model
6.6
—
Physical
Slot Width
IGP
SXM Module
Outputs
Portable Device Dependent
No outputs
Bus Interface
PCIe 4.0 x8
PCIe 5.0 x16
Other
Production
Active
Active
Predecessor
—
Server Hopper
Successor
—
Server Rubin