AMD Radeon PRO W7900D vs Intel Arc G3 Comparison

Head-to-Head Benchmarks

The recorded data contains no head-to-head benchmark entries for the AMD Radeon PRO W7900D versus the Intel Arc G3. Both products have an empty benchmark array, zero wins each, and an identical average benchmark score of 0. The percentile versus all GPUs is also identical at 50 for both parts. This means the database has no direct performance measurements comparing these two accelerators at present. Without recorded scores, no quantitative performance advantage can be assigned to either product based on measured results. The absence of data does not imply parity; it simply reflects that no benchmark submissions have been logged for this pairing. Future updates to the database may populate the head-to-head section with actual figures, but as of the current snapshot, the comparison rests entirely on architectural specifications and theoretical throughput calculations.

Architecture Differences

The AMD Radeon PRO W7900D uses the Navi 31 chip built on TSMC's 5 nm process, with an RDNA 3.0 architecture and the codename Plum Bonito. It belongs to the Radeon Pro Navi (Navi III Series) generation. The Intel Arc G3 uses the Panther Lake chip fabricated on Intel's 3 nm process, with an Xe3-LPG architecture and no recorded codename, belonging to the Arc Graphics-M (Panther Lake) generation. The process node difference is significant: 5 nm versus 3 nm, with the Intel part using a smaller lithography. AMD's chip integrates 57,700 million transistors on a 529 mm² die, yielding a transistor density of 109.1M per mm². Intel's transistor count and die size are listed as unknown, so no density figure exists for the Arc G3.

The Radeon PRO W7900D has 6,144 shading units, 384 texture mapping units, 192 raster output units, and 96 ray tracing cores. The Arc G3 has 1,280 shading units, 40 TMUs, 20 ROPs, and 10 ray tracing cores. These ratios are consistent: the AMD part has 4.8 times the shading units, 9.6 times the TMUs, 9.6 times the ROPs, and 9.6 times the ray tracing cores. Neither product lists tensor cores, so AI accelerator counts are absent from the database. The AMD card uses dedicated GDDR6 memory with 48 GB capacity, a 384-bit bus, and 864.0 GB/s bandwidth. The Intel part uses system shared memory, with the type, bus width, and bandwidth all listed as system dependent. This is a fundamental architectural split: discrete memory versus integrated graphics memory sharing.

Clock behavior also differs substantially. The Radeon PRO W7900D has a base clock of 1327 MHz and a boost clock of 2156 MHz, with memory clocked at 2250 MHz (18 Gbps effective). The Arc G3 has a base clock of 300 MHz and a boost clock of 2400 MHz, with no dedicated memory clock. The Intel part boosts higher by 244 MHz, but its base clock is over 1 GHz lower. The AMD card's pixel rate is 414.0 GPixel/s versus 48.00 GPixel/s for the Intel part, a ratio of 8.6 to 1. Texture rates are 827.9 GTexel/s versus 96.00 GTexel/s, a ratio of 8.6 to 1 as well. FP32 throughput is 52.99 TFLOPS for AMD versus 6.144 TFLOPS for Intel, an 8.6 times difference. FP16 rates differ in ratio: AMD lists 52.99 TFLOPS at 1:1 ratio, while Intel lists 12.29 TFLOPS at 2:1 ratio. This means AMD's FP16 equals its FP32, whereas Intel's FP16 is double its FP32 rate.

Power and physical design diverge sharply. The Radeon PRO W7900D has a TDP of 295 W, requires a triple-slot cooler, uses two 8-pin power connectors, and suggests a 600 W power supply. It is a discrete PCIe 4.0 x16 card measuring 280 mm in length, 110 mm in height, and 51 mm in width. The Arc G3 has a TDP of 25 W, is an integrated graphics processor with no slot width, no power connectors, no suggested PSU, and no dimensions recorded. It uses an IGP bus interface. Display outputs for the AMD card are 3x DisplayPort 2.1 and 1x mini-DisplayPort 2.1. The Intel part's outputs are portable device dependent. Both support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4, so API feature levels match despite the architectural differences.

FAQ

Q: Which GPU has higher FP32 compute throughput?

A: The AMD Radeon PRO W7900D delivers 52.99 TFLOPS FP32, which is 8.6 times higher than the Intel Arc G3's 6.144 TFLOPS. This ratio applies to shading units, texture rate, and pixel rate as well, reflecting the AMD part's larger execution resource pool.

Q: How do the memory subsystems compare?

A: The AMD card has 48 GB of dedicated GDDR6 memory on a 384-bit bus with 864.0 GB/s bandwidth. The Intel Arc G3 uses system shared memory with system dependent bandwidth, meaning its performance relies entirely on the host platform's memory configuration rather than a fixed on-board allocation.

Q: What are the power requirements for each product?

A: The Radeon PRO W7900D has a 295 W TDP, requires a triple-slot cooler, two 8-pin power connectors, and a 600 W suggested power supply. The Arc G3 has a 25 W TDP, uses no power connectors, has no slot width (IGP), and lists no suggested PSU, making it suitable for low-power mobile or embedded designs.

Q: Which product uses a smaller manufacturing process?

A: The Intel Arc G3 uses a 3 nm process from Intel, while the AMD Radeon PRO W7900D uses a 5 nm process from TSMC. The Intel part's smaller node allows for lower power consumption, but its transistor count and die size are not recorded in the database.

Q: Do both GPUs support the same graphics APIs?

A: Yes, both products support DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. The API feature sets are identical, so software compatibility at the API level is the same, despite the underlying hardware differences.

Q: What is the release timeline for these products?

A: The AMD Radeon PRO W7900D has a release date of September 24, 2025, while the Intel Arc G3 has a release date of May 31, 2026. The AMD product was released earlier, and both are marked as active in production status.

Specification Differences

The two products differ in nearly every recorded specification field. The chip is Navi 31 for AMD versus Panther Lake for Intel. Architecture is RDNA 3.0 versus Xe3-LPG. Process node is 5 nm (TSMC) versus 3 nm (Intel). Transistor count is 57,700 million versus unknown. Die size is 529 mm² versus unknown. Transistor density is 109.1M per mm² versus null. Base clock is 1327 MHz versus 300 MHz. Boost clock is 2156 MHz versus 2400 MHz. Memory clock is 2250 MHz (18 Gbps effective) versus system shared. Memory size is 48 GB versus system shared. Memory type is GDDR6 versus system shared. Bus width is 384 bit versus system shared. Memory bandwidth is 864.0 GB/s versus system dependent.

Shading units are 6,144 versus 1,280. TMUs are 384 versus 40. ROPs are 192 versus 20. Ray tracing cores are 96 versus 10. Pixel rate is 414.0 GPixel/s versus 48.00 GPixel/s. Texture rate is 827.9 GTexel/s versus 96.00 GTexel/s. FP32 is 52.99 TFLOPS versus 6.144 TFLOPS. FP16 is 52.99 TFLOPS (1:1) versus 12.29 TFLOPS (2:1). TDP is 295 W versus 25 W. Slot width is triple-slot versus IGP. Power connectors are 2x 8-pin versus none. Suggested PSU is 600 W versus null. Bus interface is PCIe 4.0 x16 versus IGP. Display outputs are 3x DisplayPort 2.1 plus 1x mini-DisplayPort 2.1 versus portable device dependent. Dimensions are 280 mm by 110 mm by 51 mm versus null.

Release dates differ, with the AMD card at September 24, 2025 and the Intel part at May 31, 2026. The AMD product has a predecessor listed as Radeon Pro Vega, while the Intel part has no predecessor. Neither product lists a successor or a launch MSRP. Both share the same API support: DirectX 12 Ultimate (12_2), OpenGL 4.6, and Vulkan 1.4. Both are marked as active in production status. The percentile versus all GPUs is 50 for both, and the average benchmark score is 0 for both, but these identical values reflect missing data rather than measured equivalence.

Where Each One Wins

Based on the recorded specifications, the AMD Radeon PRO W7900D wins decisively in raw compute throughput. Its FP32 rate of 52.99 TFLOPS is 8.6 times the Arc G3's 6.144 TFLOPS. Pixel rate and texture rate follow the same multiplier: 414.0 GPixel/s versus 48.00 GPixel/s, and 827.9 GTexel/s versus 96.00 GTexel/s. The AMD card also has 48 GB of dedicated GDDR6 memory with 864.0 GB/s bandwidth, enabling large dataset residency and high-bandwidth access patterns. Its 6,144 shading units, 384 TMUs, and 192 ROPs provide a wide execution width for parallel rasterization workloads. The 96 ray tracing cores give it a substantial resource for ray-traced effects, though no benchmark data confirms real-world scaling. The triple-slot cooler and 295 W TDP indicate a design intended for sustained heavy workloads, with the 600 W suggested PSU reflecting a high-power discrete configuration. The PCIe 4.0 x16 interface provides a standard high-bandwidth host connection, and the four DisplayPort 2.1 outputs support multi-monitor professional setups.

The Intel Arc G3 wins in power efficiency and form factor. A 25 W TDP is 11.8 times lower than the AMD part's 295 W, and the IGP design requires no power connectors or separate slot. Its 3 nm process node is smaller than the 5 nm node used by AMD, which contributes to the lower power envelope. The boost clock of 2400 MHz is higher than the AMD card's 2156 MHz, indicating a higher peak frequency per execution unit, though the total throughput remains far lower due to fewer resources. The Arc G3's system shared memory model means it can access whatever RAM the host provides, with no fixed capacity limit, but bandwidth is system dependent and cannot match the dedicated 864.0 GB/s of the discrete card. The portable device dependent display outputs suggest flexibility for mobile or embedded applications where discrete GPUs are impractical. FP16 throughput of 12.29 TFLOPS at 2:1 ratio shows a deliberate focus on half-precision workloads, doubling its FP32 rate, whereas the AMD card runs FP16 at the same rate as FP32.

For use-case selection, the AMD Radeon PRO W7900D suits workloads requiring maximum compute throughput, large dedicated memory, and high-bandwidth data movement. The 48 GB capacity and 864.0 GB/s bandwidth serve large simulation datasets, high-resolution rendering buffers, and multi-application GPU compute tasks. The triple-slot cooler and 600 W PSU requirement place it in a workstation or server chassis with ample cooling and power delivery. The Intel Arc G3 fits power-constrained devices where a 25 W TDP and no external power connectors are mandatory, such as thin laptops, portable gaming systems, or embedded platforms. Its system shared memory reduces cost and complexity but limits peak performance. The identical API support means software compatibility is not a differentiator. The database shows no head-to-head benchmarks, so the wins are theoretical based on specification deltas: AMD leads in absolute performance metrics by a factor of 8.6 across shading units, texture rate, pixel rate, and FP32, while Intel leads in power efficiency, physical footprint, and peak clock speed.