GPU Comparison
RADEON
AMD FirePro S9170
CORE STATE
Hawaii
VRAM
32 GB
CLOCK SPEED
—
TDP
275 W
BUS WIDTH
512 bit
ARCHITECTURE
GCN 2.0
PROCESS
28 nm
LAUNCH DATE
2015
VS
GEFORCE
GeForce RTX 2070 Mobile
CORE STATE
TU106
VRAM
8 GB
CLOCK SPEED
1440 MHz
TDP
115 W
BUS WIDTH
256 bit
ARCHITECTURE
Turing
PROCESS
12 nm
LAUNCH DATE
2019
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro S9170
RTX 2070 Mobile
Core Specs
Shading Units
2,816
2,304
-18.2%
Shaders
2,816
2,304
-18.2%
TMUs
176
144
-18.2%
ROPs
64
64
0.0%
Compute Units
44
—
SM Count
—
36
Clocks
Base Clock
—
1215 MHz
Boost Clock
—
1440 MHz
GPU Clock
930 MHz
—
Memory Clock
1250 MHz
5 Gbps effective
1750 MHz
14 Gbps effective
Memory
Memory Size
32 GB
8 GB
VRAM (MB)
32,768
8,192
-75.0%
Memory Type
GDDR5
GDDR6
Memory Bus
512 bit
256 bit
Bandwidth
320.0 GB/s
448.0 GB/s
Cache
L1 Cache
16 KB (per CU)
64 KB (per SM)
L2 Cache
1024 KB
4 MB
Performance
Pixel Rate
59.52 GPixel/s
92.16 GPixel/s
Texture Rate
163.7 GTexel/s
207.4 GTexel/s
FP32 (TFLOPS)
5.238 TFLOPS
6.636 TFLOPS
FP64 (TFLOPS)
2.619 TFLOPS (1:2)
207.4 GFLOPS (1:32)
FP16 (TFLOPS)
—
13.27 TFLOPS (2:1)
AI/RT
RT Cores
—
36
Tensor Cores
—
288
Power
TDP
275 W
115 W
TDP (W)
275
115
-58.2%
Suggested PSU
600 W
—
Power Connectors
1x 6-pin + 1x 8-pin
None
Architecture
Architecture
GCN 2.0
Turing
GPU Name
Hawaii
TU106
Generation
FirePro Server
(Sx100)
GeForce 20 Mobile
Process Size
28 nm
12 nm
Transistors
6,200 million
10,800 million
Die Size
438 mm²
445 mm²
Foundry
TSMC
TSMC
Density
14.2M / mm²
24.3M / mm²
API Support
DirectX
12 (12_0)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1
3.0
CUDA
—
7.5
Shader Model
6.5
6.8
Physical
Slot Width
Dual-slot
MXM Module
Length
267 mm
10.5 inches
—
Height
111 mm
4.4 inches
—
Outputs
No outputs
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
PCIe 3.0 x16
Other
Production
End-of-life
End-of-life
Predecessor
FirePro Terascale
GeForce 10 Mobile
Successor
Radeon Pro GCN
GeForce 30 Mobile