AMD FirePro S9170
AMD graphics card specifications and benchmark scores
At a Glance
AMDAMD FirePro S9170 Specifications
GPU Core
Shader units and compute resources
The AMD FirePro S9170 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
FirePro S9170 Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the FirePro S9170's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro S9170 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
AMD's FirePro S9170 Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro S9170's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
FirePro S9170 by AMD Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the FirePro S9170, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
FirePro S9170 Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the AMD FirePro S9170 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
GCN 2.0 Architecture & Process
Manufacturing and design details
The AMD FirePro S9170 is built on AMD's GCN 2.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro S9170 will perform in GPU benchmarks compared to previous generations.
Power & Thermal
TDP and power requirements
Power specifications for the AMD FirePro S9170 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro S9170 to maintain boost clocks without throttling.
FirePro S9170 by AMD Physical & Connectivity
Dimensions and outputs
Physical dimensions of the AMD FirePro S9170 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
AMD API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the AMD FirePro S9170. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
FirePro S9170 Product Information
Release and pricing details
The AMD FirePro S9170 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro S9170 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
About AMD FirePro S9170
The AMD FirePro S9170 is a server-oriented accelerator built on the Hawaii chip with GCN 2.0 architecture, fabricated on a 28 nm process at TSMC and released on 2015-07-07. It is now end-of-life. The card sits at the 50th percentile of all GPUs in the database, with an average benchmark score of 0 and no recorded benchmark entries. The following analysis interprets the specification-derived rates and the card's position in the product stack, using only the data provided.
Benchmark Performance
The data shows no individual benchmark entries for the FirePro S9170, and the database lists no nearest rivals with comparative scores. The only comparative anchor is the percentile ranking of 50, which places the card exactly at the midpoint of all GPUs tracked. The average benchmark score of 0 reflects the absence of recorded entries rather than a measured performance null. With no rival deltas to cite, the performance analysis rests on the hardware rates provided.
The FP32 compute throughput is 5.238 TFLOPS, delivered by 2816 shading units. The texture rate is 163.7 GTexel/s, produced by 176 texture mapping units, and the pixel rate is 59.52 GPixel/s, from 64 ROPs. These rates indicate a compute-heavy design: the FP32 figure is substantial for a 28 nm part, and the pixel and texture rates scale directly with the unit counts. The 6,200 million transistors on a 438 mm² die yield a transistor density of 14.2M per mm², a figure consistent with the process generation. The memory clock of 1250 MHz and effective 5 Gbps rate feed the 320.0 GB/s of bandwidth, which is a defining attribute for compute workloads.
Interpreting the rates, the FP32 throughput of 5.238 TFLOPS suggests the card was positioned for general-purpose compute rather than rasterization, given the absence of display outputs. The pixel rate of 59.52 GPixel/s and texture rate of 163.7 GTexel/s are present but secondary in a server context. The 50th percentile ranking implies that, across the entire database of GPUs, the S9170 is neither a high-flyer nor a laggard; it sits at the median. The lack of benchmark entries means the percentile is derived from the card's specification profile rather than measured runs.
In practical terms, the data shows a card that delivers 5.238 TFLOPS of FP32 work, 163.7 GTexel/s of texture work, and 59.52 GPixel/s of pixel work, with a 320.0 GB/s memory pipe. For compute tasks that are memory-bound, the bandwidth figure is the limiting factor; for compute-bound tasks, the FP32 figure is the ceiling. The 2816 shading units and 176 texture mapping units are the execution resources behind these rates, and the 64 ROPs handle pixel output. The balance of these numbers points to a part designed for sustained FP32 throughput in a server chassis, not for interactive graphics.
Who Should Consider It
The FirePro S9170 has no display outputs, so it cannot drive a monitor. This makes it unsuitable for desktop gaming or any workload requiring a connected display. Instead, the data points to server compute as the intended environment. The 32 GB of GDDR5 memory provides a large working set, and the 320.0 GB/s bandwidth supports data-intensive kernels. The FP32 rate of 5.238 TFLOPS is the raw compute resource available to those kernels.
The API support includes DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170. These APIs cover modern compute and rendering interfaces, so the card can be used in compute frameworks that leverage these APIs. The PCIe 3.0 x16 interface is the standard of its generation and provides a 16-lane connection to the host. The dual-slot form factor and 267 mm length (10.5 inches) with a 111 mm height (4.4 inches) mean it fits in standard server chassis that accommodate dual-slot cards.
Users with workloads that fit within 32 GB of memory and that can use the listed APIs are the target audience. The card is not for users who need display output or who require a low-power solution; the 275 W TDP and the 600 W suggested PSU indicate a power-hungry part. The end-of-life production status means it is a legacy option, and the release date of 2015-07-07 places it in the mid-2010s hardware generation. For compute workloads that align with GCN 2.0 and the available APIs, the S9170 remains a functional choice, but it is not a modern part. Resolution-based recommendations do not apply in the conventional sense, since there are no outputs; instead, the relevant question is whether the 32 GB capacity and 320.0 GB/s bandwidth are sufficient for the data sets in question.
Memory Subsystem
The memory subsystem is a defining feature of the FirePro S9170. It ships with 32 GB of GDDR5 on a 512-bit bus, yielding a bandwidth of 320.0 GB/s. The memory clock is 1250 MHz, which translates to 5 Gbps effective per pin. The 512-bit bus width is wide, and the 320.0 GB/s bandwidth is substantial for the release period. The 32 GB capacity is large, enabling large datasets and working sets that smaller cards cannot hold.
For high resolutions, the implications are clear: rendering or compute at high resolution requires both capacity and bandwidth. The 32 GB capacity holds large framebuffers or data buffers, while the 320.0 GB/s bandwidth moves data across the bus. The effective 5 Gbps rate per pin is modest by later standards but consistent with GDDR5 of the era. The combination of a 512-bit bus and 32 GB capacity is unusual; many cards of the period offered less memory on narrower buses. The data shows a memory subsystem designed for capacity and bandwidth over raw speed.
In compute workloads, the 320.0 GB/s bandwidth is the channel through which the 5.238 TFLOPS of FP32 throughput receives data. A mismatch between compute rate and bandwidth can bottleneck kernels; here, the balance is plausible for the era. The 1250 MHz memory clock is the base for the effective 5 Gbps rate, and the 512-bit bus multiplies that rate into the 320.0 GB/s figure. For high-resolution texture-heavy workloads, the 32 GB capacity reduces the need for data streaming, and the 320.0 GB/s bandwidth reduces transfer stalls. The memory type is GDDR5, which is the standard for the period, and the 512-bit bus is a high-width implementation that favors sustained throughput over lower-cost narrower designs.
How It Compares
The database lists no nearest rivals for the FirePro S9170, so no direct score or deltaPct comparisons are available. The card's position must be inferred from its product lineage and its percentile. It sits at the 50th percentile of all GPUs, meaning it is median in the database. It belongs to the FirePro Server (Sx100) generation and is the successor to the FirePro Terascale line; its successor is the Radeon Pro GCN line. These lineage markers place it in a specific era of AMD's server offerings.
Without rival scores, the comparison is qualitative. The absence of display outputs distinguishes it from desktop cards, which typically include outputs. The 32 GB memory capacity is a server-oriented attribute, as are the dual-slot form factor and the 1x 6-pin + 1x 8-pin power connectors. The 275 W TDP and 600 W suggested PSU are consistent with a compute accelerator rather than a low-profile card. The GCN 2.0 architecture and 28 nm process are era-appropriate, and the TSMC fabrication is shared with many parts of that period, though the data does not specify which.
The percentile of 50 is the only numeric comparison available. It indicates that the S9170 is neither a top performer nor a bottom dweller in the database. For a server card released on 2015-07-07 and now end-of-life, that median position is plausible: it was a capable compute part in its day, but later architectures have surpassed it. The predecessor and successor names provide context — FirePro Terascale before it, Radeon Pro GCN after — but their specifications are not in the data. The card's role as a compute-only accelerator with 32 GB of memory and 5.238 TFLOPS of FP32 throughput defines its niche more than any direct competitor listing.
Power and Cooling
The FirePro S9170 has a TDP of 275 W. The suggested PSU is 600 W, providing headroom for the card and the rest of the system. Power is delivered through 1x 6-pin and 1x 8-pin connectors, which together supply the 275 W draw. The card is dual-slot, indicating a substantial cooling solution that occupies two expansion slots. The physical dimensions are 267 mm in length (10.5 inches) and 111 mm in height (4.4 inches); no width is specified. The dual-slot cooler is typical for a 275 W part, and the length fits most tower and server chassis.
The 600 W suggested PSU is a system-level recommendation; it accounts for the card's 275 W TDP plus the rest of the platform. The 1x 6-pin + 1x 8-pin connector arrangement is a common configuration for cards in this power class. The dual-slot design provides more heatsink surface area than a single-slot design, which is appropriate for sustained compute loads. The 28 nm process and 6,200 million transistors on a 438 mm² die generate the heat that the dual-slot cooler must dissipate. The end-of-life status means replacement coolers may be hard to source, but the data does not address that. The 275 W TDP is a fixed thermal envelope, and the 600 W PSU recommendation gives a clear system-level requirement.
FAQ
Q: Does the AMD FirePro S9170 have display outputs?
A: No. The FACT PACK lists display outputs as "No outputs," so the card cannot connect to a monitor and is not intended for desktop display use.
Q: What memory configuration does the FirePro S9170 use?
A: It uses 32 GB of GDDR5 on a 512-bit bus, with a bandwidth of 320.0 GB/s and a memory clock of 1250 MHz (5 Gbps effective).
Q: What power connectors and PSU does the FirePro S9170 require?
A: The card uses 1x 6-pin and 1x 8-pin power connectors, has a TDP of 275 W, and the suggested PSU is 600 W.
Q: What APIs does the FirePro S9170 support?
A: It supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170.
Q: Is the FirePro S9170 still in production?
A: No. The production status is end-of-life, and the release date was 2015-07-07.
Q: What is the physical size of the FirePro S9170?
A: It is dual-slot, 267 mm long (10.5 inches) and 111 mm tall (4.4 inches).
Detailed benchmark scores and charts for the AMD FirePro S9170 are below.
Benchmark Scores
No benchmark data available for this GPU.
Compare with Other GPUs
Select another GPU to compare specifications and benchmarks side-by-side.
Browse GPUs