GPU Comparison
RADEON
AMD FirePro S7150
CORE STATE
Tonga
VRAM
8 GB
CLOCK SPEED
—
TDP
150 W
BUS WIDTH
256 bit
ARCHITECTURE
GCN 3.0
PROCESS
28 nm
LAUNCH DATE
2016
VS
GPU
Arc A530M
CORE STATE
DG2-256
VRAM
8 GB
CLOCK SPEED
1300 MHz
TDP
65 W
BUS WIDTH
128 bit
ARCHITECTURE
Xe-HPG
PROCESS
6 nm
LAUNCH DATE
2023
PERFORMANCE BENCHMARKS
geekbench_opencl
geekbench_vulkan
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro S7150
A530M
Core Specs
Shading Units
2,048
1,536
-25.0%
Shaders
2,048
1,536
-25.0%
TMUs
128
96
-25.0%
ROPs
32
48
+50.0%
Compute Units
32
—
Execution Units
—
192
Clocks
Base Clock
—
900 MHz
Boost Clock
—
1300 MHz
GPU Clock
920 MHz
—
Memory Clock
1250 MHz
5 Gbps effective
1750 MHz
14 Gbps effective
Memory
Memory Size
8 GB
8 GB
VRAM (MB)
8,192
8,192
0.0%
Memory Type
GDDR5
GDDR6
Memory Bus
256 bit
128 bit
Bandwidth
160.0 GB/s
224.0 GB/s
Cache
L1 Cache
16 KB (per CU)
—
L2 Cache
512 KB
8 MB
Performance
Pixel Rate
29.44 GPixel/s
62.40 GPixel/s
Texture Rate
117.8 GTexel/s
124.8 GTexel/s
FP32 (TFLOPS)
3.768 TFLOPS
3.994 TFLOPS
FP64 (TFLOPS)
235.5 GFLOPS (1:16)
—
FP16 (TFLOPS)
7.537 TFLOPS (2:1)
7.987 TFLOPS (2:1)
AI/RT
RT Cores
—
12
XMX Cores
—
192
Power
TDP
150 W
65 W
TDP (W)
150
65
-56.7%
Suggested PSU
450 W
—
Power Connectors
1x 6-pin
—
Architecture
Architecture
GCN 3.0
Xe-HPG
GPU Name
Tonga
DG2-256
Generation
FirePro Server
(Sx100)
Alchemist
(Arc 5 Mobile)
Process Size
28 nm
6 nm
Transistors
5,000 million
11,500 million
Die Size
366 mm²
269 mm²
Foundry
TSMC
TSMC
Density
13.7M / mm²
42.8M / mm²
API Support
DirectX
12 (12_0)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1
3.0
Shader Model
6.5
6.6
Physical
Slot Width
Single-slot
IGP
Length
241 mm
9.5 inches
—
Height
111 mm
4.4 inches
—
Outputs
No outputs
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
PCIe 4.0 x8
Other
Launch Price
2,399 USD
—
Production
End-of-life
Active
Predecessor
FirePro Terascale
—
Successor
Radeon Pro GCN
—