GPU Comparison
RADEON
AMD FirePro S7150
CORE STATE
Tonga
VRAM
8 GB
CLOCK SPEED
—
TDP
150 W
BUS WIDTH
256 bit
ARCHITECTURE
GCN 3.0
PROCESS
28 nm
LAUNCH DATE
2016
VS
RADEON
Radeon 8060S
CORE STATE
Strix Halo
VRAM
System Shared
CLOCK SPEED
2900 MHz
TDP
55 W
BUS WIDTH
System Shared
ARCHITECTURE
RDNA 3.5
PROCESS
4 nm
LAUNCH DATE
2025
PERFORMANCE BENCHMARKS
geekbench_opencl
geekbench_vulkan
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro S7150
8060S
Core Specs
Shading Units
2,048
2,560
+25.0%
Shaders
2,048
2,560
+25.0%
TMUs
128
160
+25.0%
ROPs
32
64
+100.0%
Compute Units
32
40
+25.0%
Clocks
Base Clock
—
1295 MHz
Boost Clock
—
2900 MHz
GPU Clock
920 MHz
—
Memory Clock
1250 MHz
5 Gbps effective
System Shared
Memory
Memory Size
8 GB
System Shared
VRAM (MB)
8,192
—
Memory Type
GDDR5
System Shared
Memory Bus
256 bit
System Shared
Bandwidth
160.0 GB/s
System Dependent
Cache
L1 Cache
16 KB (per CU)
—
L2 Cache
512 KB
8 MB
L3 Cache
—
64 MB
Performance
Pixel Rate
29.44 GPixel/s
185.6 GPixel/s
Texture Rate
117.8 GTexel/s
464.0 GTexel/s
FP32 (TFLOPS)
3.768 TFLOPS
14.85 TFLOPS
FP64 (TFLOPS)
235.5 GFLOPS (1:16)
464.0 GFLOPS (1:32)
FP16 (TFLOPS)
7.537 TFLOPS (2:1)
29.70 TFLOPS (2:1)
AI/RT
RT Cores
—
40
Power
TDP
150 W
55 W
TDP (W)
150
55
-63.3%
Suggested PSU
450 W
—
Power Connectors
1x 6-pin
None
Architecture
Architecture
GCN 3.0
RDNA 3.5
GPU Name
Tonga
Strix Halo
Generation
FirePro Server
(Sx100)
Navi Mobile
(RX 8000M)
Process Size
28 nm
4 nm
Transistors
5,000 million
—
Die Size
366 mm²
308 mm²
Foundry
TSMC
TSMC
Density
13.7M / mm²
—
API Support
DirectX
12 (12_0)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1
2.1
Shader Model
6.5
6.8
Physical
Slot Width
Single-slot
IGP
Length
241 mm
9.5 inches
—
Height
111 mm
4.4 inches
—
Outputs
No outputs
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
PCIe 5.0 x16
Other
Launch Price
2,399 USD
—
Production
End-of-life
Active
Predecessor
FirePro Terascale
Polaris Mobile
Successor
Radeon Pro GCN
—