GPU Comparison
RADEON
AMD FirePro S9300 X2
CORE STATE
Capsaicin
VRAM
4 GB
CLOCK SPEED
—
TDP
300 W
BUS WIDTH
4096 bit
ARCHITECTURE
GCN 3.0
PROCESS
28 nm
LAUNCH DATE
2016
VS
GPU
Arc A570M
CORE STATE
DG2-256
VRAM
8 GB
CLOCK SPEED
1300 MHz
TDP
75 W
BUS WIDTH
128 bit
ARCHITECTURE
Xe-HPG
PROCESS
6 nm
LAUNCH DATE
2023
PERFORMANCE BENCHMARKS
geekbench_opencl
geekbench_vulkan
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro S9300 X2
A570M
Core Specs
Shading Units
4,096
2,048
-50.0%
Shaders
4,096
2,048
-50.0%
TMUs
256
128
-50.0%
ROPs
64
64
0.0%
Compute Units
64
—
Execution Units
—
256
Clocks
Base Clock
—
900 MHz
Boost Clock
—
1300 MHz
GPU Clock
975 MHz
—
Memory Clock
500 MHz
1000 Mbps effective
1750 MHz
14 Gbps effective
Memory
Memory Size
4 GB
8 GB
VRAM (MB)
4,096
8,192
+100.0%
Memory Type
HBM
GDDR6
Memory Bus
4096 bit
128 bit
Bandwidth
512.0 GB/s
224.0 GB/s
Cache
L1 Cache
16 KB (per CU)
—
L2 Cache
2 MB
8 MB
Performance
Pixel Rate
62.40 GPixel/s
83.20 GPixel/s
Texture Rate
249.6 GTexel/s
166.4 GTexel/s
FP32 (TFLOPS)
7.987 TFLOPS
5.325 TFLOPS
FP64 (TFLOPS)
499.2 GFLOPS (1:16)
—
FP16 (TFLOPS)
—
10.65 TFLOPS (2:1)
AI/RT
RT Cores
—
16
XMX Cores
—
256
Power
TDP
300 W
75 W
TDP (W)
300
75
-75.0%
Suggested PSU
700 W
—
Power Connectors
2x 8-pin
—
Architecture
Architecture
GCN 3.0
Xe-HPG
GPU Name
Capsaicin
DG2-256
Generation
FirePro Server
(Sx300)
Alchemist
(Arc 5 Mobile)
Process Size
28 nm
6 nm
Transistors
8,900 million
11,500 million
Die Size
596 mm²
269 mm²
Foundry
TSMC
TSMC
Density
14.9M / mm²
42.8M / mm²
API Support
DirectX
12 (12_0)
12 Ultimate (12_2)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.4
OpenCL
2.1
3.0
Shader Model
6.5
6.6
Physical
Slot Width
Dual-slot
IGP
Length
267 mm
10.5 inches
—
Height
111 mm
4.4 inches
—
Outputs
No outputs
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
PCIe 4.0 x8
Other
Launch Price
5,999 USD
—
Production
End-of-life
Active
Predecessor
FirePro Terascale
—
Successor
Radeon Pro GCN
—