GPU Comparison
RADEON
AMD FirePro S9300 X2
CORE STATE
Capsaicin
VRAM
4 GB
CLOCK SPEED
—
TDP
300 W
BUS WIDTH
4096 bit
ARCHITECTURE
GCN 3.0
PROCESS
28 nm
LAUNCH DATE
2016
VS
RADEON
Radeon R8 M445DX
CORE STATE
Meso
VRAM
System Shared
CLOCK SPEED
1021 MHz
TDP
—
BUS WIDTH
System Shared
ARCHITECTURE
GCN 3.0
PROCESS
28 nm
LAUNCH DATE
2016
PERFORMANCE BENCHMARKS
geekbench_opencl
geekbench_vulkan
DETAILED SPECIFICATIONS
SPECIFICATION
FirePro S9300 X2
R8 M445DX
Core Specs
Shading Units
4,096
320
-92.2%
Shaders
4,096
320
-92.2%
TMUs
256
20
-92.2%
ROPs
64
8
-87.5%
Compute Units
64
5
-92.2%
Clocks
Base Clock
—
780 MHz
Boost Clock
—
1021 MHz
GPU Clock
975 MHz
—
Memory Clock
500 MHz
1000 Mbps effective
System Shared
Memory
Memory Size
4 GB
System Shared
VRAM (MB)
4,096
—
Memory Type
HBM
System Shared
Memory Bus
4096 bit
System Shared
Bandwidth
512.0 GB/s
System Dependent
Cache
L1 Cache
16 KB (per CU)
16 KB (per CU)
L2 Cache
2 MB
128 KB
Performance
Pixel Rate
62.40 GPixel/s
8.168 GPixel/s
Texture Rate
249.6 GTexel/s
20.42 GTexel/s
FP32 (TFLOPS)
7.987 TFLOPS
653.4 GFLOPS
FP64 (TFLOPS)
499.2 GFLOPS (1:16)
40.84 GFLOPS (1:16)
FP16 (TFLOPS)
—
653.4 GFLOPS (1:1)
Power
TDP
300 W
—
TDP (W)
300
—
Suggested PSU
700 W
—
Power Connectors
2x 8-pin
—
Architecture
Architecture
GCN 3.0
GCN 3.0
GPU Name
Capsaicin
Meso
Generation
FirePro Server
(Sx300)
Gem System Hybrid
(Rx M400)
Process Size
28 nm
28 nm
Transistors
8,900 million
1,550 million
Die Size
596 mm²
125 mm²
Foundry
TSMC
TSMC
Density
14.9M / mm²
12.4M / mm²
API Support
DirectX
12 (12_0)
12 (12_0)
OpenGL
4.6
4.6
Vulkan
1.2.170
1.2.170
OpenCL
2.1
2.1
Shader Model
6.5
6.5
Physical
Slot Width
Dual-slot
IGP
Length
267 mm
10.5 inches
—
Height
111 mm
4.4 inches
—
Outputs
No outputs
Portable Device Dependent
Bus Interface
PCIe 3.0 x16
IGP
Other
Launch Price
5,999 USD
—
Production
End-of-life
End-of-life
Predecessor
FirePro Terascale
—
Successor
Radeon Pro GCN
—