INTEL

Intel Xeon 674X

Intel processor specifications and benchmark scores

28
Cores
56
Threads
4.9
GHz Boost
270W
TDP
Unlocked ECC Memory

At a Glance

Intel
Cores / Threads 28C / 56T
Boost Clock 4.9 GHz
Base Clock 3 GHz
L3 Cache 144 MB (shared)
TDP 270W
Architecture Granite Rapids
Socket Intel Socket 4710
nm
Process 5 nm
Released Feb 2026

Intel Xeon 674X Specifications

Xeon 674X Core Configuration

Processing cores and threading

The Intel Xeon 674X features 28 physical cores and 56 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
28
Threads
56
SMP CPUs
1

674X Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon 674X benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon 674X by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
3 GHz
Boost Clock
4.9 GHz
All-Core Turbo
4.3 GHz
Multiplier
30x (Unlocked)

Intel's Xeon 674X Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the 674X processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon 674X's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
112 KB (per core)
L2 Cache
2 MB (per core)
L3 Cache
144 MB (shared)

Granite Rapids Architecture & Process

Manufacturing and design details

The Intel Xeon 674X is built on Intel's 5 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 674X incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Granite Rapids
Codename
Granite Rapids
Process Node
5 nm
Foundry
Intel
Die Size
2x 598 mm²
Generation
Xeon 600 (Granite Rapids-WS)

Granite Rapids Instruction Set Features

Supported CPU instructions and extensions

The Xeon 674X by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
SHA
AES-NI
F16C
BMI1
BMI2
AMX
Intel 64
VT-x
VT-d

674X Power & Thermal

TDP and power specifications

The Intel Xeon 674X has a TDP (Thermal Design Power) of 270W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
270W
Tj Max
99°C

Intel Socket 4710 Platform & Socket

Compatibility information

The Xeon 674X uses the Intel Socket 4710 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 4710
Chipsets
W890
PCIe
Gen 5, 128 Lanes (CPU only)
Package
FC-LGA18N
DDR5

Intel Socket 4710 Memory Support

RAM compatibility and speeds

Memory support specifications for the 674X define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon 674X determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR5
Memory Bus
Eight-channel
Memory Bandwidth
409.6 GB/s
ECC Memory
Supported

Xeon 674X Product Information

Release and pricing details

The Intel Xeon 674X is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon 674X by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Feb 2026
Launch Price
$2199
Market
Server/Workstation
Status
Active
Part Number
SA2CZ
Bundled Cooler
None

Xeon 674X Benchmark Scores

No benchmark data available for this CPU.

About Intel Xeon 674X

Intel Xeon 674X is a 28-core, 56-thread server/workstation processor from Intel, built on the Granite Rapids architecture and fabricated on Intel's 5 nm process. The part carries a 270 W TDP, supports DDR5 across an eight-channel interface, and is positioned at the 50th percentile among all CPUs in the database, with no benchmark scores currently recorded.

Benchmark Performance

The benchmark record for the Xeon 674X is minimal. The benchmarks array is empty and the average benchmark score is 0, meaning no measured performance data has been logged. The only quantitative positioning available is the percentile field, which places the chip at exactly the 50th percentile among all tracked CPUs. That median placement should be read with caution: without actual scores, it reflects the processor's specification profile rather than empirical results.

Architecturally, the data indicates a processor tuned for throughput. 28 physical cores with 56 threads give it a wide parallel execution width; the thread count exceeding the core count implies hyperthreading. The 3.00 GHz base clock is moderate, but the 4.90 GHz boost clock is high for a 28-core server part, indicating significant single-thread headroom when fewer cores are active. The 144 MB shared L3 cache is a large pool for multi-threaded workloads, while the per-core L1 (112 KB) and L2 (2 MB) caches provide fast local storage for each core's working set.

Because no nearest rivals are listed in the dataset, no percentage deltas can be computed. The absence of rival entries means the Xeon 674X currently stands without direct comparative data points. The 50th percentile is the sole quantitative anchor, implying a middle-of-the-pack standing relative to all CPUs, but the lack of scores prevents a finer-grained assessment.

Who Should Consider It

The Xeon 674X targets the server and workstation segment, and its specification sheet aligns with that positioning. The 28 cores and 56 threads suit heavily parallel workloads such as software compilation, scientific simulation, video rendering, and virtualization hosts, where each additional thread contributes to throughput. The 144 MB shared L3 cache provides a large pool for workloads that repeatedly access shared data structures.

Latency-sensitive workloads benefit from the 4.90 GHz boost clock. Database query processing, financial analytics, and interactive engineering simulations often rely on a few threads running at maximum frequency; the boost clock provides that capability without sacrificing the core count. The eight-channel DDR5 memory interface with 409.6 GB/s of bandwidth and ECC support suits memory-bound applications like in-memory databases and high-performance computing, where data integrity is non-negotiable.

The 128 PCIe Gen 5 lanes (CPU only) make the part a strong candidate for systems that attach many accelerators — GPUs, NVMe storage arrays, or network interface cards — since each lane carries high-bandwidth traffic. For pure gaming, the Xeon 674X is less obvious: its server orientation and high TDP suggest it is not a typical consumer desktop choice, although the high boost clock would handle single-threaded game logic without difficulty. Office productivity workloads would not stress the part, but the core count provides ample headroom for multitasking.

Users who need a single-socket workstation with massive memory bandwidth, ECC protection, and many PCIe lanes should consider this part. Users who prioritize raw single-thread performance over core count, or who run lightly threaded applications, would likely find the boost clock sufficient but the platform overhead excessive.

Power and Thermals

The Xeon 674X carries a TDP of 270 W. That is a high thermal envelope, and the data indicates the cooling solution must be substantial. The processor uses a dual-die design with a combined die size of 2x 598 mm² — a large silicon area that concentrates heat over a wide surface but also requires effective heat removal. The 270 W TDP class implies that a robust air cooler with a large heatsink or a liquid cooling loop is necessary to maintain sustained boost clocks under load.

The multiplier is unlocked, which means the part can be overclocked beyond its stock 4.90 GHz boost if the platform's power delivery and cooling permit. However, overclocking a 270 W part would push thermals significantly higher, and the data does not specify thermal limits beyond the TDP figure. The 5 nm process node, manufactured by Intel, helps mitigate power density concerns relative to older nodes, but the 270 W figure remains the governing constraint for system design.

Because the part is aimed at servers and workstations, chassis airflow and fan curves are typically designed around sustained all-core loads. The 144 MB L3 cache and 56 threads mean that all-core workloads can saturate the thermal budget quickly; the cooling solution must handle continuous maximum power draw, not just transient bursts. No integrated graphics are listed, so a discrete GPU is mandatory for any display output — a minor thermal consideration but one that affects system layout.

Platform and Compatibility

The Xeon 674X uses Intel Socket 4710, a platform designed for the Granite Rapids family. It belongs to the Xeon 600 (Granite Rapids-WS) generation, indicating a workstation-oriented variant of the Granite Rapids architecture. The socket and generation together define the platform's upgrade path: systems built around Socket 4710 can accept other Granite Rapids-based Xeon 600 parts, though the data does not enumerate which specific models are compatible.

Memory support is DDR5 across an eight-channel interface, yielding a peak bandwidth of 409.6 GB/s. ECC memory is supported, which is expected for server/workstation platforms and critical for data-integrity-sensitive workloads. The eight-channel configuration means that populating all channels is necessary to reach the stated bandwidth; fewer DIMMs reduce available bandwidth proportionally, though the data does not specify per-channel rates.

PCIe support is Gen 5 with 128 lanes available from the CPU itself. This is a very high lane count, enabling multiple high-bandwidth expansion cards without a separate PCIe switch. The CPU-only designation indicates that the 128 lanes do not include chipset-provided lanes; the platform chipset would add additional connectivity, but the data does not specify chipset details.

The part was released on 2026-02-01 and is in active production, so it is currently available in the market. The launch MSRP is $2199. The unlocked multiplier provides flexibility for overclocking, which is unusual for a server-class part and suggests some workstation users may tune the clock. The part number is SA2CZ.

Compatibility considerations include the need for a Socket 4710 motherboard, DDR5 ECC memory modules, and a discrete GPU since no integrated graphics are present. The 128 PCIe lanes require a motherboard with sufficient physical slots and power delivery to utilize them; the data does not specify board requirements beyond socket and memory.

How It Compares

The nearestRivals field for the Xeon 674X is empty, so the database currently contains no direct rival comparisons with scores or percentage deltas. This is a notable gap: without rival entries, the part cannot be positioned against competing CPUs using quantitative deltas. The only comparative metric available is the 50th percentile among all CPUs, which places it at the median of the entire tracked population.

Within its own generation, the Xeon 674X is part of the Xeon 600 (Granite Rapids-WS) family, sharing the Granite Rapids architecture and Socket 4710. Its 28-core, 56-thread configuration with a 4.90 GHz boost clock and 144 MB L3 cache defines its position within that family, but the data does not list sibling parts or their specifications.

Against the broader CPU landscape, the 50th percentile is a neutral placement. It neither signals a top-tier part nor a low-end one. Given the server/workstation market segment and the 270 W TDP, the Xeon 674X is clearly designed for professional workloads, and its percentile likely reflects the fact that consumer CPUs with higher single-thread scores and lower core counts occupy the upper percentiles in different metrics. However, without benchmark scores, this interpretation remains speculative.

The absence of rival data means that any purchase decision must rely on the specification sheet and platform fit rather than direct performance comparisons. The launch MSRP of $2199, the active production status, and the 2026-02-01 release date provide temporal and market context. For users evaluating this part, the key differentiators are the eight-channel DDR5 bandwidth, 128 PCIe Gen 5 lanes, and the 144 MB L3 cache — features that are rare outside the workstation/server segment.

The AMD Equivalent of Xeon 674X

Looking for a similar processor from AMD? The AMD Ryzen 5 130 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 130

AMD • 6 Cores

View Specs Compare

Popular Intel Xeon 674X Comparisons

See how the Xeon 674X stacks up against similar processors from the same generation and competing brands.

Compare Xeon 674X with Other CPUs

Select another CPU to compare specifications and benchmarks side-by-side.

Browse CPUs