Intel Xeon 6740P

The Intel Xeon 6740P is a 48-core, 96-thread server/workstation processor in the Xeon 6 (Granite Rapids-SP) generation, with a Granite Rapids architecture, an Intel Socket 4710 package, and a 2.10 GHz base clock / 3.80 GHz boost clock. It carries a 270 W TDP, an eight-channel DDR5 memory interface with 409.6 GB/s of bandwidth, ECC support, and 88 PCIe Gen 5 lanes from the CPU. The part is built on Intel’s 5 nm process using two 598 mm² dies, and its launch MSRP is $4650. The database entry also records an empty benchmarks array, an average benchmark score of 0, and a percentileVsAllCpus value of 50.

How It Compares

The nearestRivals array in the fact pack is empty. That means this page has no rival names, no rival scores, and no deltaPct values to use for direct comparisons. In place of neighbor-by-neighbor percentages, the only comparative field is percentileVsAllCpus: 50. That value indicates a middle position in the distribution of all CPUs tracked by the database. However, because the average benchmark score is 0 and the benchmarks list is empty, that 50th-percentile marker is not backed by any measured performance result. The absence of nearest rivals is therefore significant: it prevents any statement such as “X% ahead of” or “X% behind” another processor. The data set simply does not provide a rival framework for this processor. This leaves the Xeon 6740P’s specification sheet as the main basis for comparison, rather than benchmark-derived deltas.

Power and Thermals

The TDP is stated as 270 W. That is a high thermal envelope, and it defines the heat dissipation capability that a platform must provide. A 270 W TDP class implies a robust server-style cooling solution, not a compact low-profile cooler. The processor’s physical construction also matters for thermal analysis: the fact pack lists two dies, each 598 mm², so the 270 W is generated across a large total die area. That large area affects how heat spreads through the integrated heat spreader and into the cooling system. The process node is Intel’s 5 nm, which appears in the same record as the 270 W figure, but no measured power consumption or thermal test score is included in the fact pack. Without measured data, the 270 W TDP is the only power-related number available for judging cooling requirements. It is a clear signal that the platform designer must plan for sustained heat load in the 270 W class.

Benchmark Performance

The benchmark section is unpopulated. The benchmarks array is empty, and the avgBenchmarkScore field is 0. There are therefore no exact scores to analyze and no percentage deltas to compute. Because nearestRivals is also empty, there are no rival benchmark score pairs that would allow a relative performance statement. The only directly relevant numeric field is percentileVsAllCpus: 50. That field suggests the processor sits at the midpoint of the database’s all-CPU ranking, but the 0 average benchmark score makes it impossible to tie that percentile to a concrete performance output. This is not a claim that the processor has zero performance; rather, the database record lacks measured benchmark results. From a specification standpoint, the record does contain performance-relevant traits: 48 cores, 96 threads, a 2.10 GHz base clock, a 3.80 GHz boost clock, 288 MB of shared L3 cache, and eight-channel DDR5 memory at 409.6 GB/s. Those traits can inform expectations, but they are not substitutes for benchmark scores.

FAQ

Q: What socket does the Intel Xeon 6740P use?

A: It uses Intel Socket 4710.

Q: How many cores and threads does the Xeon 6740P have?

A: It has 48 cores and 96 threads.

Q: What memory configuration is supported?

A: It supports DDR5 memory with an eight-channel bus, ECC memory, and 409.6 GB/s of bandwidth.

Q: Does the processor include integrated graphics?

A: The fact pack lists no integrated graphics; the integratedGraphics field is null.

Q: Is the multiplier unlocked for overclocking?

A: No, the multiplierUnlocked field is false.

Q: What is the processor’s TDP?

A: The TDP is 270 W, which is the thermal design power that a cooling solution must be able to handle.

Single-Thread vs Multi-Thread Behavior

Separate single-thread and multi-thread benchmark scores are absent from the fact pack, so any discussion of that split must come from the listed specifications. For single-thread behavior, the relevant numbers are the 2.10 GHz base clock and the 3.80 GHz boost clock. Those two values define the clock range available to lightly threaded tasks: a task running on one core can boost from the base level up to the 3.80 GHz ceiling, assuming thermal and power limits allow it. The fact pack does not state how many cores can reach 3.80 GHz simultaneously, which is an important unknown for multi-thread behavior. For multi-thread work, the record lists 48 cores and 96 threads. Per-core cache is also present: 112 KB of L1 cache per core and 2 MB of L2 cache per core. Those per-core resources are useful when many threads execute at once and need local data. Above the per-core caches, the processor has 288 MB of shared L3 cache, which provides a large common pool for data shared across threads. The 270 W TDP creates a boundary condition: a 48-core processor operating at high utilization will need to balance clock speed against the 270 W thermal envelope. Because there are no per-core boost benchmark results, the exact single-thread versus multi-thread balance cannot be quantified from the data.

Platform and Compatibility

The Xeon 6740P is designed for Intel Socket 4710, which is the socket associated with its Granite Rapids architecture. The generation field is “Xeon 6 (Granite Rapids-SP)”, placing it in the Granite Rapids-SP family. The process node is 5 nm, and Intel is listed as both manufacturer and foundry. The production status is Active, with a release date of 2025-02-23. The part number is SRV5R. Memory support covers DDR5 over an eight-channel bus with 409.6 GB/s of memory bandwidth and ECC memory enabled. The PCIe implementation is Gen 5 with 88 lanes, with the fact pack noting that these are CPU-only lanes. The market segment is Server/Workstation. The multiplier is unlocked? No, multiplierUnlocked is false, so user-controlled overclocking is not part of the platform story. For upgrade path considerations, the socket and generation together define the compatible platform family: Socket 4710 and Xeon 6 Granite Rapids-SP. The record does not list a series or a set of sibling processors, so a detailed upgrade matrix is not present in the data.

Who Should Consider It

The market segment field points directly to Server/Workstation buyers. The 48-core, 96-thread configuration, combined with 288 MB of shared L3 cache, points toward workloads that can use many concurrent threads. The eight-channel DDR5 memory interface with 409.6 GB/s bandwidth is relevant for memory-heavy applications that move large volumes of data. The 88 PCIe Gen 5 lanes from the CPU support a wide array of expansion devices, storage controllers, or accelerators, which is a server- and workstation-oriented feature set. For creation workloads, the high core count and large memory bandwidth are meaningful indicators, although no creation-specific benchmark score is recorded. For gaming, the fact pack provides no gaming benchmark data and no integrated graphics; the processor is not positioned as a gaming part. For office productivity, the 270 W TDP, server socket, and high core count indicate a platform that is over-scaled for ordinary desktop office tasks. In short, the Xeon 6740P is best considered by users building or populating server/workstation platforms that expect heavy multi-threaded and memory-bandwidth-intensive work.