AMD Ryzen AI Max+ PRO 495 vs AMD Ryzen Embedded 8845HS Comparison

AMD
AMD

AMD Ryzen AI Max+ PRO 495

CORE STATE Gorgon Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3.1 Base / 5.2 GHz Turbo
CACHE 64 MB
MAX TDP 55W
ARCHITECTURE Gorgon Halo
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
AMD
AMD

Ryzen Embedded 8845HS

CORE STATE Hawk Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.8 Base / 5.1 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen AI Max+ PRO 495 vs AMD Ryzen Embedded 8845HS

FAQ

Q: What are the core and thread counts of the AMD Ryzen AI Max+ PRO 495 and the AMD Ryzen Embedded 8845HS?

A: The Ryzen AI Max+ PRO 495 has 16 cores and 32 threads. The Ryzen Embedded 8845HS has 8 cores and 16 threads. The former doubles both core and thread counts.

Q: How do their boost clocks compare?

A: The Ryzen AI Max+ PRO 495 boosts to 5.20 GHz, while the Ryzen Embedded 8845HS boosts to 5.10 GHz. The difference is 0.10 GHz in favor of the AI Max+ PRO 495.

Q: Which processor supports higher memory bandwidth?

A: The Ryzen AI Max+ PRO 495 supports quad-channel LPDDR5X memory with 273.1 GB/s bandwidth. The Ryzen Embedded 8845HS uses dual-channel DDR5 with 89.6 GB/s bandwidth. The AI Max+ PRO 495 offers over three times the memory bandwidth.

Q: Are both processors built on the same manufacturing process?

A: Yes, both use a 4 nm process node from TSMC. However, they employ different architectures: the AI Max+ PRO 495 uses Zen 5 (codename Gorgon Halo), while the 8845HS uses Zen 4 (codename Hawk Point).

Q: What integrated graphics do these chips include?

A: The Ryzen AI Max+ PRO 495 integrates a Radeon 8065S. The Ryzen Embedded 8845HS integrates a Radeon 780M. Both are integrated graphics solutions, but they are different models.

Q: Do both support ECC memory?

A: Yes, both processors support ECC memory. This is a shared feature between the two.

Q: What sockets do they use?

A: The Ryzen AI Max+ PRO 495 uses AMD Socket FP11. The Ryzen Embedded 8845HS uses AMD Socket FP8. They are not socket-compatible.

Architecture Differences

The Ryzen AI Max+ PRO 495 and the AMD Ryzen Embedded 8845HS represent two distinct generations of AMD mobile processors. The AI Max+ PRO 495 is built on the Zen 5 architecture under the codename Gorgon Halo, while the 8845HS uses the older Zen 4 architecture with the codename Hawk Point. Both are fabricated on a 4 nm process at TSMC, but the architectural gap between Zen 5 and Zen 4 is significant.

The AI Max+ PRO 495 features 16 cores with 32 threads, a configuration that targets high-end mobile workloads. Its L1 cache is 80 KB per core, and its L2 cache is 1 MB per core. The L3 cache totals 64 MB. In contrast, the 8845HS has 8 cores and 16 threads, with an L1 cache of 64 KB per core, an L2 cache of 1 MB per core, and a shared L3 cache of 16 MB. The AI Max+ PRO 495 quadruples the L3 cache capacity.

The AI Max+ PRO 495 uses a dual-die design with a die size of 2x 70.6 mm². The 8845HS uses a monolithic die of 178 mm² and contains 25,000 million transistors. The process node is identical at 4 nm, but the architectural differences lead to different power envelopes: the AI Max+ PRO 495 has a TDP of 55 watts, while the 8845HS has a TDP of 45 watts.

Memory architecture also diverges sharply. The AI Max+ PRO 495 supports LPDDR5X memory over a quad-channel bus, delivering 273.1 GB/s of bandwidth. The 8845HS supports DDR5 over a dual-channel bus, providing 89.6 GB/s. Both support ECC memory, but the bandwidth gap is a major architectural distinction.

PCIe connectivity differs as well. The AI Max+ PRO 495 provides Gen 4 with 16 lanes (CPU only). The 8845HS provides Gen 4 with 20 lanes (CPU only). The 8845HS offers four more PCIe lanes, which can matter for embedded applications requiring additional expansion.

Integrated graphics differ by generation. The AI Max+ PRO 495 uses a Radeon 8065S, while the 8845HS uses a Radeon 780M. The former is a newer graphics solution paired with the Zen 5 architecture.

Head-to-Head Benchmarks

The benchmark data for these two processors shows no recorded head-to-head benchmark results. The database contains empty arrays for head-to-head comparisons, and both processors have zero wins each. Additionally, both processors have an average benchmark score of zero and a percentile ranking of 50 against all CPUs.

With no benchmark numbers available, a quantitative comparison of performance is not possible from the recorded data. The nearest rival data is also empty, so no relative scores or delta percentages exist to reference.

What can be stated from the specification data is the theoretical advantage of the AI Max+ PRO 495 in core count, thread count, cache size, and memory bandwidth. The 8845HS counters with a higher base clock and more PCIe lanes. But these are specification differences, not measured benchmark outcomes.

The absence of recorded benchmark scores means that any performance ranking must rely on architectural parameters rather than empirical results. The data shows no wins for either processor in the head-to-head section. Without scores, the database provides no basis for declaring a performance leader.

Specification Differences

The two processors differ across several key specification fields.

Cores: The AI Max+ PRO 495 has 16 cores, the 8845HS has 8 cores.

Threads: The AI Max+ PRO 495 has 32 threads, the 8845HS has 16 threads.

Base clock: The AI Max+ PRO 495 has a base clock of 3.10 GHz, the 8845HS has a base clock of 3.80 GHz. The 8845HS is 0.70 GHz higher.

Boost clock: The AI Max+ PRO 495 boosts to 5.20 GHz, the 8845HS boosts to 5.10 GHz. The AI Max+ PRO 495 is 0.10 GHz higher.

TDP: The AI Max+ PRO 495 has a TDP of 55 watts, the 8845HS has a TDP of 45 watts.

Socket: The AI Max+ PRO 495 uses AMD Socket FP11, the 8845HS uses AMD Socket FP8.

Codename: The AI Max+ PRO 495 is Gorgon Halo, the 8845HS is Hawk Point.

Architecture: The AI Max+ PRO 495 uses Zen 5, the 8845HS uses Zen 4.

Die size: The AI Max+ PRO 495 has a die size of 2x 70.6 mm², the 8845HS has a die size of 178 mm².

Transistors: The AI Max+ PRO 495 has no transistor count listed, the 8845HS has 25,000 million transistors.

L1 cache: The AI Max+ PRO 495 has 80 KB per core, the 8845HS has 64 KB per core.

L3 cache: The AI Max+ PRO 495 has 64 MB, the 8845HS has 16 MB shared.

Memory support: The AI Max+ PRO 495 supports LPDDR5X, the 8845HS supports DDR5.

Memory bus: The AI Max+ PRO 495 is quad-channel, the 8845HS is dual-channel.

Memory bandwidth: The AI Max+ PRO 495 has 273.1 GB/s, the 8845HS has 89.6 GB/s.

PCIe: The AI Max+ PRO 495 has Gen 4 with 16 lanes, the 8845HS has Gen 4 with 20 lanes.

Integrated graphics: The AI Max+ PRO 495 uses Radeon 8065S, the 8845HS uses Radeon 780M.

Release date: The AI Max+ PRO 495 was released on 2026-05-19, the 8845HS was released on 2024-04-01.

Part number: The AI Max+ PRO 495 has part number 100-000002124, the 8845HS part number is unknown.

Series: The AI Max+ PRO 495 has no series listed, the 8845HS is in the 8000 series.

Both processors share the same process node (4 nm), foundry (TSMC), ECC memory support, market segment (Mobile), production status (Active), and lack of an unlocked multiplier.

Where Each One Wins

Based on the recorded specification data, the Ryzen AI Max+ PRO 495 holds advantages in several areas that typically translate to multi-threaded and memory-intensive workloads. Its 16 cores and 32 threads double the 8845HS counts, making it suited for heavily parallel tasks. The 64 MB L3 cache is four times the 8845HS's 16 MB, which can reduce memory latency for large working sets. The quad-channel LPDDR5X memory with 273.1 GB/s bandwidth is a major advantage for integrated graphics performance and data-heavy applications, as it offers over three times the bandwidth of the 8845HS's dual-channel DDR5 at 89.6 GB/s.

The AI Max+ PRO 495 also has a higher boost clock of 5.20 GHz versus 5.10 GHz, and a higher TDP of 55 watts versus 45 watts, indicating a larger power envelope for sustained performance. Its newer Radeon 8065S integrated graphics likely benefit from the newer Zen 5 platform, though no benchmark data confirms this.

The Ryzen Embedded 8845HS counters with a higher base clock of 3.80 GHz versus 3.10 GHz, which can benefit lightly threaded or latency-sensitive tasks that rely on base frequency. It also provides more PCIe lanes: 20 lanes versus 16 lanes, both Gen 4. For embedded applications requiring additional I/O expansion, the extra four lanes could be advantageous. The 8845HS has a lower TDP of 45 watts, which may fit power-constrained embedded designs better. Its smaller L3 cache of 16 MB and dual-channel memory are less demanding on the memory subsystem, which could simplify system design.

The release dates also matter for platform choices. The 8845HS was released on 2024-04-01, making it an earlier product with an established ecosystem. The AI Max+ PRO 495 was released on 2026-05-19, representing a newer platform.

In use-case terms, the AI Max+ PRO 495 is positioned for high-end mobile computing where core count, cache capacity, and memory bandwidth are paramount. The 8845HS is positioned for embedded systems where base clock, PCIe lane count, and lower power draw may take priority. The data does not assign a performance winner because no benchmark scores are recorded, but the specification split is clear: the AI Max+ PRO 495 leads in processing throughput and memory capabilities, while the 8845HS leads in base frequency, PCIe expansion, and power efficiency.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Max+ PRO 495
Embedded 8845HS
Core Specs
Cores
16
8 -50.0%
Threads
32
16 -50.0%
Base Clock (GHz)
3.1
3.8 +22.6%
Boost Clock (GHz)
5.2
5.1 -1.9%
Frequency (GHz)
3.1
3.8 +22.6%
Turbo Clock (GHz)
5.2
5.1 -1.9%
Multiplier
31
38 +22.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
64 MB
16 MB (shared)
Power
TDP (W)
55
45 -18.2%
Configurable TDP
45-120 W
35-54 W
Architecture
Architecture
—
Zen 4
Codename
Gorgon Halo
Hawk Point
Generation
Ryzen AI Max+ PRO (Zen 5)
Ryzen Embedded (Zen 4 (Hawk Point))
Process Size
4 nm
4 nm
Transistors
—
25,000 million
Die Size
2x 70.6 mm²
178 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
LPDDR5X
DDR5
Memory Bus
Quad-channel
Dual-channel
Memory Bandwidth
273.1 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP11
AMD Socket FP8
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AI/NPU
NPU
Yes / 55 TOPS
Yes / 16 TOPS
Graphics
Integrated Graphics
Radeon 8065S
Radeon 780M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000002124
unknown
Package
FC-BGA
FP8, FP7, FP7r2
Tj Max
100°C
100°C
View Ryzen AI Max+ PRO 495 Details View Ryzen Embedded 8845HS Details